Results 141 to 150 of about 372,503 (352)

MOFs and COFs in Electronics: Bridging the Gap between Intrinsic Properties and Measured Performance

Advanced Functional Materials, EarlyView.
Metal‐organic frameworks (MOFs) and covalent organic frameworks (COFs) hold promise for advanced electronics. However, discrepancies in reported electrical conductivities highlight the importance of measurement methodologies. This review explores intrinsic charge transport mechanisms and extrinsic factors influencing performance, and critically ...
Jonas F. Pöhls, R. Thomas Weitz
wiley   +1 more source

Diode step stress program for JANTX1N5554 [PDF]

Data were compiled for the purpose of evaluating the effect of power/temperature step stress when applied to a variety of semiconductor devices.

core   +1 more source

Development of Si(110) CMOS process for monolithic integration with GaN power semiconductor

, 2019
Hyung-tak Kim
openalex   +2 more sources

Defects Dynamic in Photo‐Excited CeO2 and their Influence on CO2 Photoreduction

Advanced Functional Materials, EarlyView.
X‐ray photoelectron spectroscopy study under light excitation is presented to track the defect dynamic (Ce4+ to Ce3+) in CeO2. Surface enhanced Raman spectroscopy confirmed the key role of Ce3+ states in controlling charge and energy transfer across the CeO2‐dye molecule interface.
Rambabu Yalavarthi, Shashi B. Mishra, Olivier Henrotte, Emiliano Cortes   +3 more
wiley   +1 more source

Demonstration of a simple and efficient design methodology for high‐voltage floating field limiting ring in SiC power devices

Electronics Letters
This letter, proposes and experimentally demonstrates a simple and efficient estimating method for high‐voltage floating field ring (FFR). Four rings in FFR are used to determine the influence of rings’ distance (d) on the voltage drops of the highest ...
Bingke Zhang, Hang Zhou, Bo Yi, Huan Ge, Rui Jin, Tao Zhu   +5 more
doaj   +1 more source

An Advanced Three-Level Active Neutral-Point-Clamped Converter With Improved Fault-Tolerant Capabilities [PDF]

, 2017
A resilient fault-tolerant silicon carbide (SiC) three-level power converter topology is introduced based on the traditional active neutral-point-clamped converter.
He, Jiangbiao, Katebi, Ramin, Weise, Nathan   +2 more
core   +1 more source

Influence of an Electrically Non-Conducting Heat Sink for Power Semiconductors on Radiated Interferences [PDF]

, 2018
Stephan Chromy, Kai Rathjen, Sebastian Fahlbusch, Klaus F. Hoffmann, Stefan Dickmann   +4 more
openalex   +1 more source

Multicolor Optoelectronic Synapse Enabled by Photon‐Modulated Remote Doping in Solution‐Processed Van Der Waals Heterostructures

Advanced Functional Materials, EarlyView.
Multicolor optoelectronic synapses are realized by vertically integrating solution‐processed MoS2 thin‐film and SWCNT. The electronically disconnected but interactive MoS2 enables photon‐modulated remote doping, producing a bi‐directional photoresponse.
Jihyun Kim, Hyunbin Kim, Gang Jin Cheon, Dohyun Lee, In Soo Kim, Uiyeon Won, Jongseok Lee, Sang Min Won, Joohoon Kang   +8 more
wiley   +1 more source

High-frequency high-voltage high-power DC-to-DC converters [PDF]

The current and voltage waveshapes associated with the power transitor and the power diode in an example current-or-voltage step-up (buck-boost) converter were analyzed to highlight the problems and possible tradeoffs involved in the design of high ...
Owen, H. A., Jr., Wilson, P. M., Wilson, T. G.   +2 more
core   +1 more source

Device Integration Technology for Practical Flexible Electronics Systems

Advanced Functional Materials, EarlyView.
Flexible device integration technologies are essential for realizing practical flexible electronic systems. In this review paper, wiring and bonding techniques critical for the industrial‐scale manufacturing of wearable devices are emphasized based on flexible electronics.
Masahito Takakuwa, Kento Yamagishi, Sunghoon Lee, Yusaku Tagawa, Takao Someya, Tomoyuki Yokota   +5 more
wiley   +1 more source