Results 91 to 100 of about 250,697 (304)
Transistor step stress testing program, JANTX 2N2905A [PDF]
The effect of power and temperature stresses when applied to a variety of semiconductor devices is ...
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Hermetic-coaxial package design for microwave transistors [PDF]
Semiconductor package has been developed for high power semiconductor devices that operate in the GHz-frequency range at several watts. Package includes stud, insulating ring, electrically conductive washer, insulating washer, braze ring, and cap.
Jacobson, D. S.
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Reliability of Reverse Properties of Power Semiconductor Devices: Influence of Surface Dielectric Layer and its Experimental Verification [PDF]
Reliability of reverse properties of power semiconductor devices is an important condition for their practical application. Usual standard tests do not reveal total information concerning the technological genetic aspects of devices production.
Kojecký, B. +2 more
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In MOCVD MoS2 memristors, a current compliance‐regulated Ag filament mechanism is revealed. The filament ruptures spontaneously during volatile switching, while subsequent growth proceeds vertically through the MoS2 layers and then laterally along the van der Waals gaps during nonvolatile switching.
Yuan Fa +19 more
wiley +1 more source
Identification of Gate Turn-Off Thyristor Switching Patterns Using Acoustic Emission Sensors
Modern seagoing ships are often equipped with converters which utilize semiconductor power electronics devices like thyristors or power transistors. Most of them are used in driving applications such as powerful main propulsion plants, auxiliary podded ...
Maciej Kozak +2 more
doaj +1 more source
We report on two edge-coupling and power splitting devices for hybrid integration of III-V lasers with sub-micrometric silicon-on-insulator (SOI) waveguides. The proposed devices relax the horizontal alignment tolerances required to achieve high coupling
Marzban, Bahareh +4 more
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Bio‐Inspired Molecular Events in Poly(Ionic Liquids)
Originating from dipolar and polar inter‐ and intra‐chain interactions of the building blocks, the topologies and morphologies of poly(ionic liquids) (PIL) govern their nano‐ and micro‐processibility. Modulating the interactions of cation‐anion pairs with aliphatic dipolar components enables the tunability of properties, facilitated by “bottom‐up ...
Jiahui Liu, Marek W. Urban
wiley +1 more source
A strategy of lanthanide-ion doping into dual-halogen-alloyed perovskites CsPb(X x Y1-x )3 (X, Y = Cl, Br, I) via chemical vapor deposition is introduced, obtaining a series of high-quality, stable microplates.
Junyu He +18 more
doaj +1 more source
High temperature electronics applications in space exploration [PDF]
The extension of the range of operating temperatures of electronic components and systems for planetary exploration is examined. In particular, missions which utilize balloon-borne instruments to study the Venusian and Jovian atmospheres are discussed ...
Jurgens, R. F.
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Investigation of Fault-Tolerant Capabilities in an Advanced Three-Level Active T-Type Converter [PDF]
A novel fault-tolerant three-level power converter topology, named advanced three-level active T-Type (A3L-ATT) converter, is introduced to increase the reliability of multilevel power converters used in safety-critical applications.
He, Jiangbiao +2 more
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