Results 21 to 30 of about 2,624 (204)
Clamping Force Distribution within Press Pack IGBTs
, 2018 Deng, Erping +3 more
openaire +4 more sources
Review on Failure Mode and Mechanism of Press-Pack IGBT and Thyristor Devices
Zhongguo dianli, 2023 High voltage and large capacity press-pack insulated gate bipolar transistor (IGBT) devices and thyristor devices are the core devices in high-voltage DC transmission projects, which are of great significance for the efficient use of energy.
Haoze LUO +5 more
doaj +1 more source
Thermal Resistance Distribution Experiment of Parallel Sub-Module in Press-Pack IGBT Device
Zhongguo dianli, 2020 In the rigid Press-Pack IGBT module, the pressure distribution of parallel chips determines the contact thermal resistance and contact electrical resistance directly.
Lubin HAN, Lin LIANG, Yong KANG
doaj +1 more source
Analysis of transient current distribution characteristics of Press Pack IGBT
IOP Conference Series: Earth and Environmental Science, 2018 Jinyuan Li +3 more
openaire +2 more sources
3D Lumped Thermal Model for Compliant Press‐Pack IGBT Submodule in MMC
IET Power Electronics, Volume 19, Issue 1, January/December 2026.We present a 3D lumped thermal model for compliant press‐pack IGBT submodules in MMCs. The model accounts for double‐sided cooling and thermal coupling, achieving high accuracy and efficiency, making it suitable for real‐time condition monitoring. ABSTRACT The compliant press‐pack IGBT is widely used in modular multilevel converters (MMCs).
Shan Gao +5 more
openalex +2 more sources
Influence of UnevenTemperature on Current Distribution in Paralleled Multi-Chips Press Pack IGBT
Zhongguo dianli, 2020 The multi-chip parallel press pack IGBT device is a key component in flexible DC transmission equipment. Due to manufacturing processes, loop parasitic parameters and thermal coupling, the internal stress distribution of the device is imbalance ...
Zhenyu DENG +6 more
doaj +1 more source
Thermal Load Application Method for Temperature Cycle Test of Power Module PP-IGBT
Zhongguo dianli, 2023 Temperature cycling test is an important test method to study the thermal fatigue aging characteristics of power module press pack insulated gate bipolar transistor (PP-IGBT) devices. Therefore, taking the PP-IGBT of flexible direct converter valve power
Biaojun LI +3 more
doaj +1 more source
Interconnect materials enabling IGBT modules to achieve stable short circuit failure behavior [PDF]
, 2017 Insulated gate bipolar transistor (IGBT) modules, which can fail to stable short-circuit mode, have major applications in electricity network-related fields.
Corfield, Martin +3 more
core +1 more source
A Review of Thermal Design for IGBT Module
Zhongguo dianli, 2020 In this paper, the thermal characteristics and thermal design of IGBT module are reviewed. Firstly, the thermal network model and its dependence on the packaging material’s thermal performance and dimensions are addressed.
Guoyou LIU +5 more
doaj +1 more source
IEEE Access, 2023 Stress imbalance significantly affects the performance of a press-pack insulated gate bipolar transistor (IGBT). Time-variant loads and conditions lead to the stress fluctuations, exacerbating the impacts.
Hangyang Li +6 more
doaj +1 more source