Results 31 to 40 of about 2,624 (204)
Thermal Design of Power Electronic Circuits [PDF]
, 2016 The heart of every switched mode converter consists of several switching semiconductor elements. Due to their non-ideal behaviour there are ON state and switching losses heating up the silicon chip.
Künzi, R.
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The state-of-the-art of power electronics in Japan [PDF]
, 1998 Since the late 1950s, power electronics has been developing by leaps and bounds without saturation to become the key technology essential to modern society and human life as well as to electrical engineering. This paper mainly focuses on the state-of-the-
Akagi, Hirofumi
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Evaluation of SiC Schottky diodes using pressure contacts [PDF]
, 2017 The thermomechanical reliability of SiC power devices and modules is increasingly becoming of interest especially for high power applications where power cycling performance is critical. Press-pack assemblies are a trusted and reliable packaging solution
Alatise, Olayiwola +7 more
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A multiphysics modeling and experimental analysis of pressure contacts in power electronics applications [PDF]
, 2017 This paper details a modeling and experimental assessment of the packaging process for a silicon carbide Schottky diode using pressure contacts. The work detailed in this paper is original, as it applies a combined electrothermomechanical modeling ...
Alatise, Olawiwola +4 more
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Enabling high reliability power modules : a multidisciplinary task [PDF]
, 2016 Reliability of power electronic systems is a major concern for application engineers in the automotive and power system sectors. Power electronic modules are one of the main sources of failure in wind energy conversion systems.
Alatise, Olayiwola M. +10 more
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Electro-thermo-mechanical modelling and analysis of the Press Pack Diode in Power Electronics [PDF]
, 2015 This paper details a finite element modelling approach of the press pack assembly process for a diode in a power electronic module. Molybdenum and aluminum graphite have been investigated as suitable materials for the contact pad.
Alatise, O. +4 more
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Deformation Analysis of Press-Pack IGBT Using Thermal Mechanical Coupling Method [PDF]
, 2022 Press-pack Insulated Gate Bipolar Transistors (PP IGBT) are becoming increasingly used in HVDC and FACT applications. Due to its unique packaging, its reliability issues have also attracted increasing attention in the engineering field. More comprehensive investigation into the thermal, electrical and mechanical factors should be conducted to reveal ...
Gu, Bowen +5 more
openaire +1 more source
High-power active devices [PDF]
, 2006 Very high-power (HP) electronics represents a small part of the electronics market. In semiconductor terms, HP represents a world device market of 600 million euros out of a total 200 billion euros for all semiconductors—a mere 0.3 per cent. At the multi-
Carroll, E
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Utility applications of power electronics in Japan [PDF]
, 1997 Since the late 1950s, power electronics has been developing by leaps and bounds without saturation into the key technology essential to modern society and human life, as well as to electrical engineering.
Akagi, Hirofumi
core +1 more source
High-throughput and Full Automatic DBC-Module Screening Tester for High Power IGBT [PDF]
, 2015 We developed a high-throughput screening tester for DBC-module of IGBT. The tester realizes a new screening test with current distribution in addition to a conventional switching test. It consists of a power circuit, a replaceable test head, sensor array
Noda R. +5 more
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