Results 61 to 70 of about 2,624 (204)
Improved reliability of planar power interconnect with ceramic-based structure [PDF]
, 2018 This paper proposes an advanced Si3N4 ceramic-based structure with through vias designed and filled with brazing alloy as a reliable interconnect solution in planar power modules. Finite element (FE) modeling and simulation were first used to predict the
Corfield, Martin +7 more
core +1 more source
The Journal of Engineering, 2018 Voltage sourced converter (VSC) high-voltage direct current (HVDC) is moving to higher DC voltage and capacity, such as ±500 kV/3000 MW and ±800 kV/5000 MW for a single converter, which will bring tremendous challenges for converter submodule design ...
Huifeng Chen +3 more
doaj +1 more source
International Transactions on Electrical Energy Systems, Volume 2026, Issue 1, 2026.The South African rail sector is a key contributor to the national economy, boosting gross domestic product (GDP) and creating jobs. However, serious malfunctions often jeopardize the reliability of locomotives such as the Class 8E locomotive, leading to lost output and longer lead times.
Rofhiwa C. Mufamadi +3 more
wiley +1 more source
Investigation of FACTS devices to improve power quality in distribution networks [PDF]
, 2011 Flexible AC transmission system (FACTS) technologies are power electronic solutions that improve power transmission through enhanced power transfer volume and stability, and resolve quality and reliability issues in distribution networks carrying ...
Rehman Shaikh, Muhammad Asim +1 more
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Life Cycle Profile Development for Product Reliability Assessment
Quality and Reliability Engineering International, Volume 41, Issue 7, Page 3054-3064, November 2025.ABSTRACT The life cycle profile (LCP) is a catalog of all the expected loads a given product experiences across its lifetime, from the completion of product manufacture to the end of operation and removal from service. This paper outlines a procedure for developing an LCP, including cataloging estimates of the loads the product experiences over its ...
Abhishek Ram, Diganta Das
wiley +1 more source
Built-in reliability design of highly integrated solid-state power switches with metal bump interconnects [PDF]
, 2014 A stacked substrate–chip–bump–chip–substrate assembly has been demonstrated in the construction of power switch modules with high power density and good electrical performance.
Castellazzi, Alberto +5 more
core +3 more sources
Edge‐Free Graphene‐Derived Mesoporous Carbon for High‐Voltage Supercapacitors
Small Structures, Volume 6, Issue 10, October 2025.A defect‐minimized, edge‐free graphene‐derived mesoporous carbon (GMC) is synthesized via a rapid carbothermal shock process. The GMC shows ultrahigh surface area, high conductivity (≈9000 S m−1), and excellent electrochemical performance (≈250 F g−1 , 10,000+ cycles at 4.4 V), offering a scalable path to high‐voltage energy storage.
Mitesh Ganpat Mapari +4 more
wiley +1 more source
Recent Advanced Ultra‐Wide Bandgap β‐Ga2O3 Material and Device Technologies
Advanced Electronic Materials, Volume 11, Issue 1, January 2025.The advanced ultra‐wide bandgap semiconductor material β‐Ga2O3 is highly favored for its exceptional material properties. This sudy provides a comprehensive review of its developments in areas such as materials, power devices, and RF devices. The current status of its commercialization process is outlined, along with an analysis of the challenges it is
Sihan Sun +5 more
wiley +1 more source
Asset management strategies for power electronic converters in transmission networks: Application to HVdc and FACTS devices [PDF]
, 2018 The urgency for an increased capacity boost bounded by enhanced reliability and sustainability through operating cost reduction has become the major objective of electric utilities worldwide. Power electronics have contributed to this goal for decades by
Coventry, Paul +3 more
core +2 more sources
Control of the MKQA tuning and aperture kickers of the LHC [PDF]
, 2009 The large hadron collider (LHC) at CERN has been equipped with four fast pulsed kicker magnets in RA43 situated at point 4 which are part of the measurement system for the tune and the dynamic aperture of the LHC beam (Beam 1 and Beam 2).
Barlow, R A +4 more
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