Results 171 to 180 of about 590 (212)
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The significance of reactive ions and reactive neutrals in ion-beam-assisted etching

Journal of Vacuum Science & Technology B: Microelectronics Processing and Phenomena, 1985
Using a custom designed beam analyzer system, the ionic species from a broad beam ion source have been measured under various etching conditions. In broad beam ion-beam-assisted etching (IBAE), it was observed that up to 25% of the ionic species are from the reactive neutral component backdiffusing into the ion source through the extraction grids ...
J. D. Chinn, E. D. Wolf
openaire   +1 more source

Reactive Ion Etching Of Silicon Dioxide

SPIE Proceedings, 1987
The etch rates of thermally grown and CVD-deposited silicon dioxide were studied in three different reactive ion etch reactors, parallel plate, hexode and single wafer. Carbon-fluorine chemistry was used, and each reactor operated at 13.56 MHz. Assuming the etch rate to be a linear function of the DC bias and using an empirical relationship between ...
Peter C. Sukanek, Glynis Sullivan
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Technology of reactive ion etching

1998
Abstract The original meaning of ‘etching’ is ‘to eat’; the process of removing something from an object. Moreover, it is impressive that another original meaning of it is ‘to feed’. In fact, reactive ion etching (RIE) consists of two processes; ‘to eat’ and ‘to feed’.
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Deposition and reactive ion etching of molybdenum

Applied Physics Letters, 1983
The stress in molybdenum films deposited by dc magnetron sputtering in neon has been characterized. Fabrication of 1-μ-thick films 2 cm in diameter on polyimide membranes has been achieved with low-stress material. A reactive ion etching process is described with 75-nm resolution and 15:1 aspect ratios.
Abdelhak Bensaoula   +3 more
openaire   +1 more source

Deep Reactive Ion Etching

2010
Laermer, Franz   +3 more
openaire   +6 more sources

Radial Etch Rate Nonuniformity in Reactive Ion Etching

Journal of The Electrochemical Society, 1984
A study was performed to determine some of the causes of the edge‐to‐center "bullseye" clearing pattern, in which the etch rate decreases monotonically from the wafer periphery to its center, observed when certain films are etched in a parallel‐plate reactive ion etching system.
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Lithography and Reactive Ion Etching in Microfabrication

1995
The term “microfabrication” has been used to denote the technology for manufacturing integrated micro-circuits and microsystems. During the last 30 years the advanced micro-electronics could not maintain its place without microfabrication technology and this is also the case for the present and for the future.
I. W. Rangelow, P. Hudek
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A Review: Inductively Coupled Plasma Reactive Ion Etching of Silicon Carbide

Materials, 2022
Mariusz Sochacki   +2 more
exaly  

Reactive Ion Etching of Tantalum in Silicon Tetrachloride

SSRN Electronic Journal, 2022
Asaad K. Edaan Al-mashaal   +1 more
openaire   +1 more source

Reactive Ion Etching

1984
BERNARD GOROWITZ, RICHARD J. SAIA
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