Results 201 to 210 of about 120,829 (333)

Design, build and test of via test and reliability structures to determine design marginalities in an established semiconductor process

, 2016
Estermann, Nadine
openalex   +1 more source

High reliability screening of semiconductor and integrated circuit devices [PDF]

, 1969
Jack P. Lombardi, Lauren McDonough, H. Padden   +2 more
openalex   +1 more source

Electro‐Active Polymer Actuated Microfiltration Membranes: Design, Performance, and Particle Dynamics

Advanced Functional Materials, EarlyView.
The concept of foulant particle manipulation and detachment from active microfiltration membranes via voltage‐driven vibrations is introduced. Actuator components are initially integrated onto the filtration membranes using an airbrush spray printing technique.
Irem Gurbuz, Hanieh Bazyar, Andres Hunt
wiley   +1 more source

First Demonstration of Hysteresis-Free IGZO/SnO-Based Complementary Circuits and SRAM with Long-Term Reliability Using SU-8 Passivation. [PDF]

Nano Converg
Han C, Park H, Choi Y, Choi M, Lim J, Shin H, Moon S, Shin C.   +7 more
europepmc   +1 more source

Reliability Study of Fiber Coupling Efficiency of 980 nm Semiconductor Laser [PDF]

Gang Liu, S. W. Pang, Xin Zhang, Mingzhi Tang, Lei Liang, Rui Li, R. T. Huang   +6 more
openalex   +1 more source

Alkali Ion‐Incorporated HfO2 Dielectrics for Reconfigurable Neuromorphic Computing

Advanced Functional Materials, EarlyView.
This work presents an indium gallium zinc oxide (IGZO) transistor with an alkali cation‐integrated hafnium dioxide (HfO2) dielectric exhibiting synaptic behavior via ion retention. The solution‐based film fabrication strategy overcomes the limitations of atomic layer deposition (ALD) and precursor coating, enabling the control of synaptic retention ...
Seung Yeon Ki, In Cheol Kwak, Seonkwon Kim, Jihyun Kim, Dong Gue Roe, Se‐Jin Kim, Joohoon Kang, Jeong Ho Cho   +7 more
wiley   +1 more source

Advanced WBG power semiconductor packaging: nanomaterials and nanotechnologies for high-performance die attach paste. [PDF]

Nano Converg
Ju YM, Kim TW, Lee SH, Lee HJ, Ahn J, Kim HS.   +5 more
europepmc   +1 more source

Quantification of metal oxide semiconductor field effect transistor device reliability with low-Vt lanthanum-incorporated high permittivity dielectrics [PDF]

, 2009
Barry O’Sullivan, M. Aoulaiche, M. J. Cho, T. Kauerauf, R. Degraeve, Hiroshi Okawa, T. Schram, T. Hoffmann, G. Groeseneken, S. Biesemans, Takashi Nakabayashi, Atsushi Ikeda‐Ohno, M. Niwa   +12 more
openalex   +1 more source

Mesoporous Carbon Thin Films with Large Mesopores as Model Material for Electrochemical Applications

Advanced Functional Materials, EarlyView.
Mesoporous carbon thin films possessing 70 nm mesopores are prepared on titanium substrates by soft templating of resol resins with a self‐synthesized poly(ethylene oxide)‐block‐poly(hexyl acrylate) block copolymer. A strategy to avoid corrosion of the metal substrate is presented, and the films are extensively characterized in terms of morphology ...
Lysander Q. Wagner, Joshua Schober, Pascal Dippell, Chantal Glatthaar, Smail Mekhilef, David Schäfer, Hannes Hergert, Marcus Rohnke, Matthias T. Elm, Bernd M. Smarsly   +9 more
wiley   +1 more source

Enabling scalable ferroelectric-based future generation vertical NAND flash with bonding-friendly architecture: strategies for erase and disturb optimization. [PDF]

Nanoscale Adv
Song I, Kim J, Lee S, Myeong I.
europepmc   +1 more source