In Situ Raman Measurement of the Growth of SiCOH Thin Film Using Hexamethyl-Disiloxane (HMDSO) Mixture Source in Semiconductor Interconnection. [PDF]
Lee HR, Choi TM, Pyo SG.
europepmc +1 more source
Zero‐dimensional carbon nanomaterials are presented as multifunctional platforms linking structure, property, and sensing performance. Surface engineering and heteroatom doping modulate electron‐transfer and luminescent behavior, enabling electrochemical, photoluminescent, and electrochemiluminescent detection. Fundamental design principles, analytical
Gustavo Martins +8 more
wiley +1 more source
Recent Progress in Structural Integrity Evaluation of Microelectronic Packaging Using Scanning Acoustic Microscopy (SAM): A Review. [PDF]
Meshki Zadeh P, Brand S, Dehghan-Niri E.
europepmc +1 more source
High‐Performance, Paper‐Based Microelectronics via a Micromodular Fabrication Process
This study demonstrates high‐performance silicon micromodular transistors on cellulose nanomaterial‐coated paper, with interconnects formed via e‐jet printing. Transistors exhibit excellent electrical properties and maintain performance under applied strain.
Rebecca K. Banner +9 more
wiley +1 more source
Thermal management of 3-D heterogeneously integrated microelectronics: challenges and future research directions. [PDF]
Sharma MK, Ramos-Alvarado B.
europepmc +1 more source
Impact of Oxygen Plasma Pre‐Treatment on Thermal Oxidation and Reliability of SiO2 on 4H‐SiC
We investigate how oxygen plasma pre‐treatment affects the thermal oxidation of silicon carbide. While plasma modification increases growth rates by 84%, it reduces dielectric breakdown strength by 18%. Our findings reveal that although plasma improves the interface state density, it introduces structural damage, highlighting a critical trade‐off ...
Chezhiyan Nanjappan +3 more
wiley +1 more source
Spectroscopic Evaluation of AlN/n-Si MIS Structures through Frequency-Driven Dielectric Characterization. [PDF]
Karaca A +3 more
europepmc +1 more source
Plasma‐sequence‐engineered ALD (PSE‐ALD), based on sequential NH3 and N2 plasma pulses, enables ultrathin, dense SiNx films. ToF‐MS analysis confirms ligand removal via HCl evolution, while increased film density indicates network densification. The resulting SiNx coating provides robust protection of graphite under H2 plasma exposure.
Hye‐Young Kim +7 more
wiley +1 more source
A Dynamic Physics-Guided Ensemble Model for Non-Intrusive Bond Wire Health Monitoring in IGBTs. [PDF]
Yang X, Hu Z, Bo Y, Shi T, Cui M.
europepmc +1 more source

