Results 241 to 250 of about 1,561,898 (299)

Elements of semiconductor-device reliability

Proceedings of the IEEE, 1974
Semiconductor-device quality and reliability are discussed in the context of the major factors producing failures, the relationship of process technology and its control to device quality and reliability, the testing procedures used to determine quality levels, and screening procedures that can be employed to segregate certain levels of device quality.
C.G. Peattie, J.D. Adams, S.L. Carrell, T.D. George, M.H. Valek   +4 more
exaly   +2 more sources

Paralleling of IGBT Power Semiconductor Devices and Reliability Issues

Electronics (Switzerland), 2023
Paralleling of power semiconductor devices is inevitable considering their widespread application and exploitation in the extended horizon of these applications.
Ravi Tripathi, Ichiro Omura
exaly   +2 more sources

Reliability of semiconductor devices

1959 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 1959
exaly   +2 more sources

Optical semiconductor device reliability

Microelectronics Reliability, 2002
Abstract Based on the degradation modes and mechanisms clarified in 1980s and 1990s, reliability of laser diodes and photodiodes is discussed for application to current optical fiber networks such as communication systems employing wavelength-division-multiplexing technique (WDM), high-frequency modulation technique, etc.
openaire   +2 more sources

The investigation of semiconductor shipping bag reliability

2015 IEEE International Conference on Industrial Engineering and Engineering Management (IEEM), 2015
The shipping bag used in semiconductor industry is very important as a protection guard of products. It provides good protection for finished products after shipping and the handling by the final users. Among various shipping bags, Moisture Barrier Bag (MBB) is the most widely used type in the semiconductor industry because of its high reliability ...
Hailin Jonson Gao, Xueliang Ruben Zhang, Yanju Lisa Yu, Kaiyuan Kevin Chang, Wei-Ting Kary Chien   +4 more
openaire   +2 more sources

Achieving semiconductor equipment reliability

Proceedings. Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium, 2003
It is noted that the increasing complexity of semiconductor manufacturing processes and the competitiveness of worldwide device production demand step function improvements in production equipment reliability and predictability of its availability for use.
D. Ditmore, J. Stewart, R. Dudley, N. Bright   +3 more
openaire   +1 more source

Reliability of semiconductor devices

Physics in Technology, 1976
Report on Metallization systems for semiconductor devices, 13 February 1976 Imperial College, London.
openaire   +1 more source

A reliability appraisal of semiconductor devices

Proceedings of the IEE - Part B: Electronic and Communication Engineering, 1959
The current problems of assessing the reliability of semiconductor devices are discussed, and reference is made to the order of reliability required in typical applications.The evidence from life tests carried out on devices drawn from production lines of transistors and diodes shows how variations in operating conditions and assessment levels affect ...
R. Brewer, W.W.D. Wyatt
openaire   +1 more source

Semiconductor laser reliability

SPIE Proceedings, 1998
In this paper, a review of the state-of-the-art in semiconductor laser diode reliability is presented, with a particular regard to the reliability of laser diodes used in long-distance telecommunication system. Remarkable advances in semiconductor laser reliability have been demonstrated over their thirty year history, leading to estimated median ...
openaire   +1 more source

Reliability investigation of semiconductor coolers

XVI ICT '97. Proceedings ICT'97. 16th International Conference on Thermoelectrics (Cat. No.97TH8291), 2002
The life tests on the thermoelectric shock of semiconductor coolers show that the life of semiconductor coolers follows the Weibull distribution. After the early failed devices are removed, the failure rule of the devices can be described as an exponential distribution. The main failure mode is the crack between electric couple material and welding pad.
null Liu Zhenmao, null Wang Xilian, null Liu Xiaowei, null Quan Wuyun, null Sun Shufang, null Ye Shuichi, null Lui Jingwei, null Chen Lunqiang   +7 more
openaire   +1 more source