An in situ integrated TiO2/SiOx/Al2O3 synaptic phototransistor couples ultraviolet and electrical stimuli within a scalable, CMOS‐compatible oxide stack. Multimodal plasticity, spike‐timing‐dependent learning, and bee‐inspired associative conditioning are achieved through trap‐mediated temporal dynamics.
Youngbin Yoon +5 more
wiley +1 more source
A quantum magneto-photo-thermoelastic model for wave propagation in laser-excited semiconductors. [PDF]
Al-Sunousi HF +5 more
europepmc +1 more source
Influence of Reactor Configuration and Operating Conditions on Nanostructured Semiconductor Photocatalysts for Hydrogen Evolution: A Systematic Technical Review. [PDF]
Galván JH +5 more
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Integration of LASER Diodes Emitting at Eight Different Wavelengths from Blue to Infrared on a 4H-SiC-Based Optical Integration Platform. [PDF]
Wang X +9 more
europepmc +1 more source
Suppression of Interface Traps and Improved Breakdown in Recessed-Gate AlGaN/GaN MISHEMTs Using Low-Temperature Nitrogen Passivation. [PDF]
Chen HC +6 more
europepmc +1 more source
A visualized AI-assisted framework for pre-surgical evaluation of implant pathways on periapical radiographs. [PDF]
Lin YJ +7 more
europepmc +1 more source
Endurance Paradox in Hafnium-Oxide-Based Silicon-Channel Ferroelectric Transistors. [PDF]
Das A +14 more
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Fabrication, testing, and reliability of semiconductor lasers
SPIE, The International Society for Optical Engineering
core
Reliability of compound semiconductor devices
Abstract This paper reviews the reliability of III–V semiconductor devices with particular attention to the failure mechanisms typical of these structures. Instability effects at the surface of various FETs have been examined and the problems related to the metallurgies employed.
FANTINI, Fausto, F. MAGISTRALI
openaire +3 more sources
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Semiconductor network reliability assessment
Proceedings of the IEEE, 1964The paper discusses the reliability test plan and test results on semiconductor network microelectronic devices. Included in the test plan are reliability programs, life testing, step stress testing, and environmental tests. The failure analysis-corrective action cycle is discussed at length.
J. Adams, W. Workman
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