Results 81 to 90 of about 190,755 (383)
Harnessing Outer Space for Improved Electrocaloric Cooling
A novel radiative heat sink/source‐integrated electrocaloric (R‐iEC) system combines the electrocaloric (EC) effect with a thermally conductive radiative cooler (TCRC) to address heat dissipation limitations in EC devices. Utilizing outer space as a heat sink, the system achieves up to 240 W m−2 of heat dissipation performance, making it highly ...
Dong Hyun Seo+8 more
wiley +1 more source
In this paper, the degradation mechanism of the RF performance of 22 nm fully depleted (FD) silicon-on-insulator nMOSFETs at different total ionizing dose levels has been investigated.
Zhanpeng Yan+7 more
doaj +1 more source
The relationship between primary polymer structure and pattern quality in the directed self‐assembly of chemically modified polystyrene‐block‐poly(methyl methacrylate) derivatives is explored. The perpendicular lamellae are aligned, with a periodicity below 20 nm. No parallel orientations or dislocations form, and line patterns are well defined over an
Shinsuke Maekawa+8 more
wiley +1 more source
Making Photoresponsive Metal–Organic Frameworks an Effective Class of Heterogeneous Photocatalyst
This review summarizes photoresponsive MOFs for photocatalytic applications, focusing on their capacity to enhance light harvesting, charge transfer, and surface reactions. While existing studies provide foundational insights, emerging characterization techniques enable a deeper understanding of photoresponsive MOFs.
Rui Liu+3 more
wiley +1 more source
Efficient inverted organic solar cells (OSCs) with the MoO3 (2 nm)/Ag (12 nm) transparent cathode and an aqueous solution ZnO electron extraction layer processed at low temperature are investigated in this work.
Zhizhe Wang+9 more
doaj +1 more source
Exploiting Semiconductor Properties for Hardware Trojans [PDF]
This paper discusses the possible introduction of hidden reliability defects during CMOS foundry fabrication processes that may lead to accelerated wearout of the devices. These hidden defects or hardware Trojans can be created by deviation from foundry design rules and processing parameters.
arxiv
Bi‐directionally assembled BN µ‐platelets in micropatterns formed by a micro‐molding method for thermal interface materials are demonstrated. The BN µ‐platelets are vertically aligned selectively, while compressed regions without patterns accommodate horizontally assembled BN µ‐platelets. Through anisotropic orientation, high thermal conductivities for
Young Gil Kim+12 more
wiley +1 more source
Ground state determination and band gaps of bilayers of graphenylenes and octafunctionalized-biphenylenes [PDF]
Device fabrication often requires materials that are either reliably conducting, reliably semiconducting, or reliably nonconducting. Bilayer graphene (BLG) changes from a superconductor to a semiconductor depending on it's stacking, but because it is difficult to control its stacking, it is not a reliable material for device fabrication.
arxiv +1 more source
Improved hybrid circuit assembly yields and reliability by glassivation of the semiconductor chip [PDF]
B. C. Heap, S. A. France
openalex +2 more sources
Gate stability of GaN-Based HEMTs with P-Type Gate [PDF]
status ...
Decoutere, S.+10 more
core +2 more sources