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What makes no-clean flux residue benign?
2016 Pan Pacific Microelectronics Symposium (Pan Pacific), 2016Since the conversion to lead-free solders, no-clean flux has become the predominate flux used in electronic card assembly and test (ECAT) manufacturing. No-clean flux performs well and can save steps in manufacturing. If used properly, no-clean flux can be effective, safe and reliable.
Phil Isaacs, Terry Munson
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Characterising the Corrosion Properties of Flux Residues
Soldering & Surface Mount Technology, 1992Today's emphasis on alternative flux technology as an approach to eliminate the use of chlorofluorocarbons (CFCs) requires an understanding of the corrosion potential of the new fluxes. In 1989, Dr David Bono proposed that monitoring the effect of different soldering fluxes on the rate of corrosion of a copper wire printed on a circuit board would ...
L.J. Turbini +5 more
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Control of Residual Flux in Current Transformers
IEEE Transactions on Power Apparatus and Systems, 1973This paper provides additional data about residual flux in current transformers including evaluation of the effect on metering and relaying performance, and methods of measurement and control.
E. Conner, R. Greb, E. Wentz
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Transformation of reflow solder flux residue under humid conditions
Microelectronics Reliability, 2021Abstract The use of reflow flux system for soldering process of SMT electronics results in the concealed residues located underneath of the components, which changes its characteristics upon exposure to humidity. In this paper, the transformation of reflow process-related solder flux residues was investigated under varied humidity and temperature ...
Kamila Piotrowska, Feng Li, Rajan Ambat
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Characterising the Corrosion Properties of Flux Residues
Soldering & Surface Mount Technology, 1991A new corrosion test for assessing flux residues is applied to marginally cleaned water soluble fluxed test boards and low solids/no clean fluxed test boards. This test method developed by Bono has been modified to accelerate the corrosion process. The corrosion mechanism observed in this study is conductive anodic filament (CAF), a corrosion mechanism
L.J. Turbini +5 more
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Removal of flux residues from highly dense assemblies
2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT), 2012Quality and reliability is a function of the manufacturing design that achieves repeatability and reproducibility. Designing advanced packages and assemblies is more difficult due to lead-free wetting and higher process temperature requirements. The associated manufacturing changes along with component miniaturization and board density increases ...
Mike Bixenman, Jason Chan, T.C. Loy
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Residual Magnetic Flux in High Resistance Grounding System
2019 5th International Conference on Electric Power Equipment - Switching Technology (ICEPE-ST), 2019When transformer is being energized a large magnetizing inrush current flows depending upon the closing phase of circuit breakers and the residual magnetic flux in the iron core. One of the suppressing the magnetizing inrush current method is to control closing phase of the circuit breaker.
Yukihiko Himata +2 more
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Research on Residual Flux Prediction of the Transformer
IEEE Transactions on Magnetics, 2017The complete inrush current elimination depends on the veracity of the residual flux prediction for transformers. The precedent methods cannot satisfy the increasingly strict engineering requirements. Considering the chopping current and shunt capacitor influence on residual flux, a method for predicting residual flux based on the dynamic Jiles ...
Yang Wang, Zhizhen Liu, Hongxing Chen
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Research on residual flux prediction of the transformer
2016 IEEE Conference on Electromagnetic Field Computation (CEFC), 2016The complete inrush current elimination depends on the veracity of the residual flux prediction for transformers. The precedent methods cannot satisfy the increasingly strict engineering requirements. Considering the chopping current and shunt capacitor influence on residual flux, a method for predicting residual flux based on the dynamic Jiles ...
Yang Wang, Zhizhen Liu
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Metal Electromigration Induced by Solder Flux Residue in Hybrid Microcircuits
IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1988Electrical failure due to excessive current-leakage was observed in a hybrid following burn-in. The current leakage was a result of extensive metal electromigration between substrate conductors, which has been correlated with flux residue in the device.
J.A. Weiner +4 more
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