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Research on residual flux prediction of the transformer
2016 IEEE Conference on Electromagnetic Field Computation (CEFC), 2016The complete inrush current elimination depends on the veracity of the residual flux prediction for transformers. The precedent methods cannot satisfy the increasingly strict engineering requirements. Considering the chopping current and shunt capacitor influence on residual flux, a method for predicting residual flux based on the dynamic Jiles ...
Yang Wang, Zhizhen Liu
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Effect of solder flux residues on corrosion of electronics
2009 Annual Reliability and Maintainability Symposium, 2009Flux from ‘No Clean’ solder processes can cause reliability problems in the field due to aggressive residues, which may be electrical conducting or corrosive in humid environments. The solder temperature during a wave solder process is of great importance to the amount of residues left on a PCBA[a].
Kirsten Stentoft Hansen +4 more
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Characterization of Flux Residues
SMTA International, 1999ABSTRACT This paper will briefly discuss the types of fluxes used in SMT processes in order to address the issue of residues that may be left on assemblies or components. The main types of residues encountered are ionic and non-ionic/organic.
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Influence of As-flux on As enhanced diffusion and residual defects
Vacuum, 1989Abstract The relation between enhanced diffusion coefficients, As fluxes and residual defects are given in this paper. When a low flux (2 μA cm −2 ) is used, after rapid thermal annealing (RTA), the enhanced diffusion coefficient is 50–80 times greater than that of normal diffusion. It agrees with the results of Pennycook et al 1 .
Zhang Tonghe +3 more
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Residual fluxes of water in an estuarine lagoon
Estuarine, Coastal and Shelf Science, 1988Abstract Observations of currents are presented for three stations in Khowr Al-Zubair (south Iraq); the observations were made over a complete tidal cycle, on both neap and spring tides, and the data are analysed to provide estimates of the residual fluxes of water.
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No-Clean Flux Residue and Reliability – An Ems Perspective
SMTA International, 2012ABSTRACT Majority of products are built using no clean process today. Low residue is the more appropriate nomenclature however no-clean is what is commonly referred to by the engineering community. No-clean doesn’t mean that no residue is left on the assembly after the process. It means that there will be some residues which should be
Jennifer Nguyen +3 more
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The Influence of Flux Residues on the Quality of Electronic Assemblies
Soldering & Surface Mount Technology, 1994Ionic contaminations, especially flux residues due to manufacturing, cause various faults and failures of printed circuits during service. The contamination (µg‐eq NaCI), surface insulation resistance (SIR), electromigration and corrosion caused by flux residues of six different fluxes (categories: F‐SW26, F‐SW32 and F‐SW34 according to DIN 8511) have ...
Kh.G. Schmitt‐Thomas, C. Schmidt
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Measurement of Residual Flux in Permanent Magnets
International Journal of Electrical Engineering & Education, 1983A simple and accurate method, using a search coil and a calibrated fluxmeter, is presented for experimental determination of residual flux of permament magnets of simple geometries. Applied to a small rectangular AlNiCo-VI magnet used variously, the method shows the importance of preventing accidental, or otherwise, demagnetisation of permanent magnets.
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Kinetics of flux residue formation in a humid environment
Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium, 2002Flux residue has been a manufacturing concern for many decades, as these potentially conductive residues increase the possibility of circuit failure. To avoid this, printed wire assemblies were cleaned with chloroflourocarbon (CFC) solvents. However, CFC's are very detrimental to the environment, contributing to the destruction of the ozone layer ...
A. Sinni, M.A. Palmer
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1985
More and more, the ultimate reliability of a printed circuit board is considered to depend on its cleanliness level. The three main reasons for this are the increased use of faster soldering speeds which demand fluxes with higher activity levels, developments in PCB technology which permit higher density conductor lines and spacings needed for higher ...
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More and more, the ultimate reliability of a printed circuit board is considered to depend on its cleanliness level. The three main reasons for this are the increased use of faster soldering speeds which demand fluxes with higher activity levels, developments in PCB technology which permit higher density conductor lines and spacings needed for higher ...
openaire +1 more source

