Results 121 to 130 of about 103,204 (298)
Conductive Bonding and System Architectures for High‐Performance Flexible Electronics
This review outlines bonding technologies and structural design strategies that support high‐performance flexible and stretchable electronics. Bonding approaches such as surface‐activated bonding and anisotropic conductive films, together with system‐level architectures including buffer layers and island‐bridge structures, possess distinct mechanical ...
Kazuma Nakajima, Kenjiro Fukuda
wiley +1 more source
This study investigates the impact of modeling the aluminum (Al) metallization layer as an integrated part of the chip model, versus as an individual component, on the results of electrical–thermal analysis of power semiconductor packages using Finite ...
Na-Yeon Choi, Sang-Gi Kim, Sung-Uk Zhang
doaj +1 more source
On the Substrate Thermal Optimization in SiC-Based Backside-Mounted High-Power GaN FETs [PDF]
Angelini, A. +5 more
core +1 more source
Applying a high electric field to a doped organic semiconductor heats up the charge carrier distribution beyond the lattice temperature, enhancing conductivity. It is shown that the associated effective temperature can be used to extract the effective localization length, which is a characteristic length scale of charge transport and provides ...
Morteza Shokrani +4 more
wiley +1 more source
Physics-based simulation techniques for small- and large-signal device noise analysis in RF applications [PDF]
Bonani, Fabrizio +2 more
core +1 more source
AgCrP2S6 reveals a momentum‐indirect band edge (≈1.35 eV) and chain‐locked linear dichroism: the first direct transitions emerge at 1.6–1.8 eV for E||a. Resonant Raman and photoemission corroborate this assignment. In ACPS/graphene heterostructures, photocurrent turns on above ≈1.5 eV and follows the same polarization selection rules (anisotropy ≈0.53),
Oleksandr Volochanskyi +9 more
wiley +1 more source
Polymorph engineering in ErMnO3 enables low‐voltage, forming‐free threshold switching with tunable negative differential resistance. Conducting orthorhombic regions embedded in an insulating hexagonal matrix provide controlled Joule‐heating‐enhanced Poole–Frenkel transport. The hexagonal phase prevents excessive heating and breakdown.
Rong Wu +8 more
wiley +1 more source
A TCAD approach to the physics-based modeling of frequency conversion and noise in semiconductor devices under large-signal forced operation [PDF]
Bonani, Fabrizio +3 more
core +1 more source
Nanoscale‐grooved indium gallium oxide (IGO) semiconductors, patterned via thermal nanoimprint lithography (NIL) using CD/DVD templates, are integrated into electrolyte‐gated transistor biosensors to overcome Debye length limitations. Precisely engineered concave–convex nanostructures modulate local electrostatic potentials, extend the effective Debye ...
Jong Yu Song +5 more
wiley +1 more source
Thermal modeling of power semiconductor devices
В даній статті висвітлені перспективні методи електротеплового моделювання за допомогою складення еквівалентної схеми, побудови моделей в системі Simulink та поєднання пакетного середовища Matlab з програмою, написаною мовою С++ для більш складних циклів та обчислень.
openaire +2 more sources

