Results 151 to 160 of about 161,989 (332)

Chiroferromagnetic Quantum Dots for Chiroptical Synapse (ChiropS)

Advanced Materials, EarlyView.
Chiroptical activity is enhanced by up to 0.003 in the g‐factor through the induction of ferromagnetism in quantum dots. A chiroptical neuromorphic synapse, composed of chiroferromagnetic quantum dots, generates different synaptic weights from multiple wavelengths and circularly polarized light.
Junyoung Kwon, Jae Bum Jeon, Walber Gonçalves Guimarães Júnior, Min Gu Lee, Changhyeon Lee, Geunyoung Kim, Hanchan Song, Woon Hyung Cheong, Sung Gap Im, André F. de Moura, Kyung Min Kim, Jihyeon Yeom   +11 more
wiley   +1 more source

Light‐Emitting Diodes Based on Metal Halide Perovskite and Perovskite Related Nanocrystals

Advanced Materials, EarlyView.
The review covers the past and current developments in light‐emitting diodes (LEDs) exploiting nanocrystals of halide perovskites and perovskite‐related materials. The review examines the aspects of material optimizations, device engineering, and applications.
Ying Liu, Zhuangzhuang Ma, Jibin Zhang, Yanni He, Jinfei Dai, Xinjian Li, Zhifeng Shi, Liberato Manna   +7 more
wiley   +1 more source

Van Der Waals Hybrid Integration of 2D Semimetals for Broadband Photodetection

Advanced Materials, EarlyView.
Advanced broadband photodetector technologies are essential for military and civilian applications. 2D semimetals, with their gapless band structures, high mobility, and topological protection, offer great promise for broadband PDs. This study reviews the latest advancements in broadband PDs utilizing heterostructures that combine 2D semimetals with ...
Xue Li, Kunxuan Liu, Di Wu, Pei Lin, Zhifeng Shi, Xinjian Li, Longhui Zeng, Yang Chai, Shu Ping Lau, Yuen Hong Tsang   +9 more
wiley   +1 more source

Thermal Processing Creates Water‐Stable PEDOT:PSS Films for Bioelectronics

Advanced Materials, Volume 37, Issue 13, April 2, 2025.
Instead of using chemical cross–linkers, it is shown that PEDOT:PSS thin films for bioelectronics become water‐stable after a simple heat treatment. The heat treatment is compatible with a range of rigid and elastomeric substrates and films are stable in vivo for >20 days.
Siddharth Doshi, Margaux O. A. Forner, Pingyu Wang, Salim El Hadwe, Amy T. Jin, Gerwin Dijk, Kenneth Brinson, Juhwan Lim, Antonio Dominguez‐Alfaro, Carina Yi Jing Lim, Alberto Salleo, Damiano G. Barone, Guosong Hong, Mark L. Brongersma, Nicholas A. Melosh, George G. Malliaras, Scott T. Keene   +16 more
wiley   +1 more source

Behavior of Space Charge in Polyimide and the Influence on Power Semiconductor Device Reliability

, 2020
K. Tajiri, Hirotaka Muto, Didier Marty‐Dessus, Laurent Berquez, G. Teyssèdre, Marie‐Laure Locatelli, Sombel Diaham, V. Griseri, Flora Carrasco   +8 more
openalex   +2 more sources

Advances in Photonic Materials and Integrated Devices for Smart and Digital Healthcare: Bridging the Gap Between Materials and Systems

Advanced Materials, EarlyView.
This article summarizes significant technological advancements in materials, photonic devices, and bio‐interfaced systems, which demonstrate successful applications for impacting human healthcare via improved therapies, advanced diagnostics, and on‐skin health monitoring.
Seunghyeb Ban, Hoon Yi, Jaejin Park, Yunuo Huang, Ki Jun Yu, Woon‐Hong Yeo   +5 more
wiley   +1 more source

Advances in core technologies for semiconductor manufacturing: applications and challenges of atomic layer etching, neutral beam etching and atomic layer deposition. [PDF]

Nanoscale Adv
Lee TY, Chen PT, Huang CC, Chen HC, Chen LY, Lee PT, Chen FC, Horng RH, Kuo HC.   +8 more
europepmc   +1 more source

Prediction of power semiconductors devices reliability working in cyclic mode [PDF]

, 2014
E. V. Kravchenko, Г. В. Кузнецов   +1 more
openalex   +1 more source

Model for Prediction of Testing Time of a Computer Program for Automated Reliability Evaluation of Semiconductor Devices

, 2022
V. O. Kaziuchyts, С. М. Боровиков, Е. Н. Шнейдеров   +2 more
openalex   +2 more sources

Robust Full‐Surface Bonding of Substrate and Electrode for Ultra‐Flexible Sensor Integration

Advanced Materials, EarlyView.
A direct hybrid bonding method that enables both gold and parylene bonding without adhesives is developed. This technique achieves full‐surface direct bonding of electrodes and substrates in flexible electronic connections. The method offers high flexibility, stable mechanical durability, and high‐resolution interconnections, accommodating varying ...
Masahito Takakuwa, Daishi Inoue, Lulu Sun, Michitaka Yamamoto, Shinjiro Umezu, Daisuke Hashizume, Toshihiro Itoh, Kenjiro Fukuda, Takao Someya, Tomoyuki Yokota   +9 more
wiley   +1 more source