Results 181 to 190 of about 4,206 (226)
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Influence of shadow mask design and deposition methods on nonplanar dielectric material deposition
Journal of Micro/ Nanolithography, MEMS, and MOEMS, 2005In this paper, we report on the deposition of nonplanar SiO2 and SiNx dielectric layers using plasma-enhanced chemical vapor deposition (PECVD), radio frequency (rf) sputtering and reactive rf sputtering through metal and dielectric shadow masks. The layers were analyzed for trends in deposition rate and curvature as a function of shadow mask material ...
Andrew M Sarangan +2 more
exaly +2 more sources
Pulsed laser deposition of YBCO thin films in a shadow mask configuration
Thin Solid Films, 2000Abstract We present an investigation on a modified pulsed laser deposition method (PLD) that employs plume geometric shadowing (Nd:YAG laser, 1.06 μm, 2.5 J/cm 2 , YBCO target). A plane shadow mask and a newly proposed helical mask were used. The aim of our approach was to improve the film surface morphology.
Aurelian Marcu, Weihua Jiang
exaly +2 more sources
Limitations of patterning thin films by shadow mask high vacuum chemical vapor deposition
Thin Solid Films, 2014A key factor in engineering integrated devices such as electro-optic switches or waveguides is the patterning of high quality crystalline thin films into specific geometries. In this contribution high vacuum chemical vapor deposition (HV-CVD) was employed to grow titanium dioxide (TiO2) patterns onto silicon. The directed nature of precursor transport -
Patrik Hoffmann, Yury Kuzminykh
exaly +2 more sources
Sensors and Actuators A: Physical, 2007
Abstract Pattern deposition of metals with controlled and microscale dimensions can be a challenging task if traditional photolithography is not a practical option. This is a particularly valid concern for the case of certain polymer substrates, which are gaining in importance in the microelectronics and related industries.
Alexis Abramson, Pankaj B Kaul
exaly +2 more sources
Abstract Pattern deposition of metals with controlled and microscale dimensions can be a challenging task if traditional photolithography is not a practical option. This is a particularly valid concern for the case of certain polymer substrates, which are gaining in importance in the microelectronics and related industries.
Alexis Abramson, Pankaj B Kaul
exaly +2 more sources
Surface and Coatings Technology, 2012
Abstract Thin film Mo–Se–Ni–C coatings for tribologycal applications were prepared by pulsed laser co-deposition from two targets — MoSe 2 (Ni) and graphite. Two methods of deposition from the MoSe 2 (Ni) target were used: deposition with unhindered expansion of the laser plume (standard PLD) and deposition of a plume scattered in collisions with Ar ...
A G Gnedovets +2 more
exaly +2 more sources
Abstract Thin film Mo–Se–Ni–C coatings for tribologycal applications were prepared by pulsed laser co-deposition from two targets — MoSe 2 (Ni) and graphite. Two methods of deposition from the MoSe 2 (Ni) target were used: deposition with unhindered expansion of the laser plume (standard PLD) and deposition of a plume scattered in collisions with Ar ...
A G Gnedovets +2 more
exaly +2 more sources
Wafer-Scale Ferromagnetic Shadow Mask Compatible with Contact Aligner for Dry Etching And Deposition
2025 IEEE 38th International Conference on Micro Electro Mechanical Systems (MEMS)Jungchul Lee, Taeyeong Kim
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Techniques for shadow mask deposition of nonplanar dielectric layers
The 16th Annual Meeting of the IEEE Lasers and Electro-Optics Society, 2003. LEOS 2003., 2004In this investigation, we explore the deposition of nonplanar dielectric layers using laser micromachined shadow masks. Depositing dielectrics on semiconductors is advantageous for a variety of reasons. By finishing VCSELs or RC-LEDs with dielectric layers, expense and time can be avoided.
S.B. Blickenstaff +2 more
openaire +1 more source
Silicon shadow masks for fine-feature thin-film depositions
IEEE Electron Device Letters, 1982In this paper we investigate the possibility of using silicon wafers with anisotropically etched-through slots as shadow masks. We report slots having widths of 11 µm and 172 µm. A double-etching scheme that makes possible a considerably narrower slot width as well as greater uniformity of the widths of the slots is evaluated.
M. Sango, T. Van Duzer
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Reconfigurable shadow mask technology: a microsystem for metal nanoline deposition
Nanotechnology, 2004Reconfigurable shadow mask technology, presented in this paper, introduces the use of microsystems for in situ metal deposition, and direct patterning of structures with micron and submicron lateral and vertical dimensions. A multilayer microstructure acts as a set of addressable active shutters and shadow masks in a physical vapour deposition (PVD ...
Christophe G Courcimault, Mark G Allen
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Direct growth of nanostructures by deposition through an Si3N4 shadow mask
Physica E: Low-dimensional Systems and Nanostructures, 1999Abstract We propose a method for the simultaneous fabrication of a multitude of identical nanodots . Without any further lithographic procedures, structures in the regime of 100 nm and below can be directly prepared by vapour deposition while partly shadowing the substrate with a free standing stencil mask, – here an Si 3N4 membrane with an ...
Köhler, J. +3 more
openaire +2 more sources

