Results 11 to 20 of about 509,648 (256)

Predicting tumor response to drugs based on gene-expression biomarkers of sensitivity learned from cancer cell lines

open access: yesBMC Genomics, 2021
Background Human cancer cell line profiling and drug sensitivity studies provide valuable information about the therapeutic potential of drugs and their possible mechanisms of action.
Yuanyuan Li   +5 more
doaj   +1 more source

Design, Modeling and Analysis of Cu-Carbon Hybrid Interconnects

open access: yesIEEE Access, 2021
In this work, a new interconnect structure is proposed for the first time where copper-carbon nanotube composite interconnect is encapsulated by graphene barrier layers named here as copper-carbon (Cu-carbon) hybrid interconnects.
Bhawana Kumari   +3 more
doaj   +1 more source

Recent insights into the structure and function of coronavirus ribonucleases

open access: yesFEBS Open Bio, 2022
Coronaviruses use approximately two‐thirds of their 30‐kb genomes to encode nonstructural proteins (nsps) with diverse functions that assist in viral replication and transcription, and evasion of the host immune response.
Meredith N. Frazier   +4 more
doaj   +1 more source

Integration of Light and Auxin Signaling [PDF]

open access: yesCold Spring Harbor Perspectives in Biology, 2009
Light is vital for plant growth and development: It provides energy for photosynthesis, but also reliable information on seasonal timing and local habitat conditions. Light sensing is therefore of paramount importance for plants. Thus, plants have evolved sophisticated light receptors and signaling networks that detect and respond to changes in light ...
Halliday, Karen J   +2 more
openaire   +2 more sources

Signal Integrity Analysis of RF Probe Card for WLCSP Testing Using Polyimide-Based Grounded Coplanar Waveguide Transmission Lines

open access: yesIEEE Access, 2023
Wafer-level chip-scale packages have been extensively adopted in the electronic packaging industry owing to their ability to enhance device performance.
Tae Kyun Kim   +3 more
doaj   +1 more source

Precision Design and Fabrication of Noise-free High-Frequency Amplifier Board for Enhanced Signal Processing [PDF]

open access: yesITM Web of Conferences, 2023
An optical signal processing system is widely used for long-distance signal transmission with high speed and low attenuation. It plays a fundamental role in optical communication systems that involves transmitting, receiving, amplifying, and manipulating
Narvekar Sonal, Sharma Kadambari
doaj   +1 more source

Signal integrity [PDF]

open access: yesIEEE Electromagnetic Compatibility Magazine, 2012
Welcome to the Signal Integrity Column! In this issue, you will find a very interesting paper on power integrity. In modern high-speed digital designs, power distribution networks (PDNs) using power and ground planes are commonly used where decoupling capacitors are necessary to provide charge for logic transitions and, at the same time, to mitigate ...
openaire   +1 more source

A Novel Decision Feedback Equalization Structure for Nonlinear High-Speed Links

open access: yesIEEE Access, 2020
As the degree of nonlinearity in high-speed links becomes more and more serious, traditional decision feedback equalization (DFE) which is based on linear time-invariant assumption can no longer eliminate the inter-symbol interference effectively.
Xiuqin Chu   +7 more
doaj   +1 more source

CMOS Noise Analysis and Simulation From Low Frequency and Baseband to RF and Millimeter Wave

open access: yesIEEE Access, 2023
Generic guidelines for noise simulation of CMOS integrated circuits and advanced noise signal integrity analyses, were addressed in this work. The provided noise simulation guidelines are referring to a wide application spectrum, from baseband designs to
Anastasios Michailidis   +2 more
doaj   +1 more source

Crosstalk Analysis of Delay-Insensitive Code in High-Speed Package Interconnects

open access: yesMicromachines, 2023
The development of integrated circuits has increased the size of chip interconnects, which has brought challenges to interconnect design in chip packages.
Bo Sun, Zhaoxin Xu
doaj   +1 more source

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