Results 241 to 250 of about 70,499,433 (305)
Silicon-on-Insulator (SOI) optical waveguides with liquid crystals
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Transconductance of Silicon-on-Insulator (SOI) MOSFET's
IEEE Electron Device Letters, 1985Transconductance of n-channel Silicon-on-Insulator (SOI) MOSFET's has been measured with backside gate (substrate) bias as a parameter. For negative values of the backside gate bias, transconductance of SOI transistors is similar to that of bulk devices.
J -P Colinge
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Silicon-on-insulator (SOI) as a Photonics Platform
ECS Meeting Abstracts, 2006Abstract not Available.
Dan-Xia Xu +4 more
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Nanophotonic applications for silicon-on-insulator (SOI)
SPIE Proceedings, 2004Silicon-on-insulator is a proven technology for very large scale integration of microelectronic devices. The technology also offers the potential for development of nanophotonic devices and the ability to interface such devices to the macroscopic world.
Paul R. de la Houssaye +2 more
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Silicon-on-Insulator (SOI) Movable Integrated Optical Waveguide Technology
The technology of a new type of optical waveguide, the silicon-on-insulator (SOI) movable integrated optical waveguide, is discussed. The fabrication method based on the surface-micromachining technique and wafer bonding is described.
G K L Wong
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Silicon-on-insulator (SOI) structures for pressure sensors
Sensors and Actuators A: Physical, 1991Abstract The zone-melting-recrystallization method of preparating silicon-on-insulator (SOI) films, its variations, advantages, disadvantages, and its applicability for pressure sensors are considered in this article. The method of artificial epitaxy (graphoepitaxy) allows microstructures in SOI films to be controlled.
Eugene I. Givargizov +3 more
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High voltage silicon-on-insulator (SOI) MOSFETs
[1991] Proceedings of the 3rd International Symposium on Power Semiconductor Devices and ICs, 2002Novel lateral high-voltage SOI MOSFETs capable of withstanding up to 400 V are presented. The design optimization, fabrication, and experimental results obtained for these devices are presented. The devices can be implemented using a CMOS-SOI compatible process.
Q. Lu, P. Ratnam, C.A.T. Salama
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Silicon-on-insulator (SOI) by bonding and ETCH-back
1985 International Electron Devices Meeting, 1985A silicon wafer bonding process is described in which only thermally grown oxide is present between wafer pairs. Bonding occurs after insertion into an oxidizing ambient. It is proposed the wafers are drawn into intimate contact as a result of the gaseous oxygen between them being consumed by oxidation, thus producing a partial vacuum.
J.B. Lasky +3 more
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