Results 241 to 250 of about 54,444 (308)

Wafer-Scale Deterministic Fabrication of Axis-Ratio-Engineered Silicon Nanoparticles for On-Resonance Electric-Magnetic Dipole Interference. [PDF]

Small
Kim T, Lee J.
europepmc   +1 more source

Engineering Oncolytic Virus‐Armed Macrophages for Enhanced Cancer Immunotherapy

Advanced Science, EarlyView.
ZIFOA‐M is engineered by conjugating oncolytic adenovirus‐loaded ZIF‐8 nanoparticles onto macrophage surfaces via bioorthogonal chemistry. Upon tumor infiltration, the platform releases OA to downregulate CD47/CD24 on tumor cells, restoring macrophage phagocytosis.
Jilong Wang, Ning Lu, Zhuo Yan, Luyi Ye, Luyao Bai, Shanshan Yuan, Yuting Zhu, Yiru Xiong, Yongheng Bai, Yaping Chen, Junjie Deng   +10 more
wiley   +1 more source

A silicon microneedle array atmospheric pressure plasma ionization source for real-time trace gas chemical analysis. [PDF]

Microsyst Nanoeng
Chew BS, Koch DT, Gibson P, McCartney MM, Borras E, Kenyon NJ, Davis CE.   +6 more
europepmc   +1 more source

Silicon‐Embedded Multifunctional Heterogeneous Integration for Miniaturized Photoplethysmography Detection Devices

Advanced Science, EarlyView.
ABSTRACT The multifunctional integration of chips with high flexibility and scalable manufacturing is crucial for enhancing chip performance, reducing chip size, and simplifying chip design. However, balancing volume, cost, flexibility, and functionality using traditional heterogeneous integration methods is challenging.
Lang Chen, Shizun Hu, Zhou Yang, Shitao Shen, Pan Zhang, Han Xu, Chi Zhang, Wei Wang   +7 more
wiley   +1 more source

Improving 3C-SiC Quality Through Wafer-Bonded Switchback Epitaxy. [PDF]

Materials (Basel)
Colston G, Perera KH, Renz A, Gammon P, Antoniou M, Mawby PA, Shah VA.   +6 more
europepmc   +1 more source

Organoid Brain‐Machine‐Interface Devices for Central Nervous System Repair

Advanced Science, EarlyView.
We envision organoid brain‐machine‐interface (Organoid‐BMI) devices as new biohybrid bidirectional communication pathways to connect the human CNS and the external world for personalized CNS repair and regeneration. ABSTRACT Central nervous system (CNS) repair and regeneration suffer from tremendous clinical challenges due to current limitations in ...
Yantao Xing, Yang Yang, Zichen Hong, Chunhui Tian, Huiyu Chu, Susanne Clara Prokop, Hongwei Cai, Mingxia Gu, Jason Tchieu, Ken Mackie, Feng Guo   +10 more
wiley   +1 more source

Silicon Dioxide Multi-Mode Interference Spectrometers. [PDF]

Micromachines (Basel)
Harkness JG, Pan D, Ramollari H, Yuzvinsky TD, Schmidt H, Hawkins AR.   +5 more
europepmc   +1 more source

The Mechanism of Ruthenium Oxide Catalyzed Electroless Etching of Silicon in Oxidizing HF Solution. [PDF]

Materials (Basel)
Bai B, Li Y, Xu W, Lu P, Luo J, Wu J, Peng KQ.   +6 more
europepmc   +1 more source

Robust Shape-from-Focus via Physics-Inspired Distortion-Aware Focal Depth Regression. [PDF]

Sensors (Basel)
Li X, Shen W, Li J, Zhai Z, Guan X, Lei Z.   +5 more
europepmc   +1 more source

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Wafer-to-wafer fusion bonding of oxidized silicon to silicon at low temperatures

Sensors and Actuators A: Physical, 1998
Abstract In this paper a silicon wafer-to-wafer bonding process is presented where silicon dioxide is used as an intermediate layer. Because the process temperature is very low (120 °C) and because the chemical treatment of the surface before bonding does not damage aluminium patterns, wafers containing electronic circuity can be bonded.
A. Berthold, B. Jakoby, M.J. Vellekoop
openaire   +1 more source