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Scratch Fracture of Polycrystalline Silicon Wafers
Journal of the American Ceramic Society, 2015Fracture of silicon wafers is responsible for lower than desirable manufacturing yields in the photovoltaic industry. This study investigates the fracture response of polycrystalline silicon wafers under sliding contacts at different length scales, by means of macro and microscratch tests which simulate cutting processes.
Borrero-Lõpez, O. +3 more
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Silicon Wafer for the Gigabit Era
1998With the increasing integration density towards the Gigabit memory, the structure size (design rule) reduces from 0.35 μm to 0.25 μm and later to 0.18 μm. The latter 0.18 μm structure is to be expected at the turn of the century. Therefore the requirements which have to be fulfilled by the base material of the integrated circuits, the silicon wafers ...
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Silicon photonic wafer fabrication for education
2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC), 2017Silicon Photonics is a promising new technology for realizing efficient, high performance interconnects. There is a growing need for educating future engineers on how to design, fabricate, test and package Silicon photonic circuits. Here we demonstrate a Silicon photonic process suitable for an educational institution with i-line lithography ...
Sanjna Lakshminarayanamurthy +7 more
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physica status solidi (a), 2006
AbstractMulti‐wire sawing is the main slicing technique for large multi‐ and monocrystalline silicon crystals in the photovoltaic and microelectronic industry. This paper describes the basic mechanisms by which slicing is achieved and develops a model for the material removal rate.
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AbstractMulti‐wire sawing is the main slicing technique for large multi‐ and monocrystalline silicon crystals in the photovoltaic and microelectronic industry. This paper describes the basic mechanisms by which slicing is achieved and develops a model for the material removal rate.
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Silicon-on-Insulator Wafers with Buried Cavities
Journal of The Electrochemical Society, 2006Direct bonding and mechanical thinning of pre-etched silicon wafers have been studied for the fabrication of silicon-on-insulator (SOI) wafers with buried cavities. The thin Si diaphragm over the cavity is deflected downward during the grinding and polishing, as the thinning is carried out without supporting the diaphragm.
Suni, Tommi +7 more
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Minimum Silicon Wafer Thickness for ID Wafering
Journal of The Electrochemical Society, 1982An analytical model, based on fracture mechanics analysis, is proposed for estimating the minimum wafer thickness as a function of the diameter requirement for solar cells. The conditions under which the model can be applied are discussed with reference to the critical flaw size, the applied force, and the width of the side support.
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Ultrathin films of cellulose on silicon wafers
Advanced Materials, 1993The first preparation of thin films of cellulose itself is reported. Cellulose exhibits excellent wetting behavior, is extremely stable against oxidation and other chemical degradation and in thin‐film form would have a number of applications. The method involves the preparation of LB films of trimethylcellulose (see Figure) and the in situ conversion ...
Schaub, M. +4 more
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1989
Several workers have considered a hybridized version of wafer-scale integration in which the discrete IC’s are still mounted on circuit boards but with the circuit board fabricated on a silicon wafer. Lewis [1], at the conclusion of his study of package performance, suggests flip-chip, beam lead or tape (TAB) mounting of unpackaged ICs directly on a ...
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Several workers have considered a hybridized version of wafer-scale integration in which the discrete IC’s are still mounted on circuit boards but with the circuit board fabricated on a silicon wafer. Lewis [1], at the conclusion of his study of package performance, suggests flip-chip, beam lead or tape (TAB) mounting of unpackaged ICs directly on a ...
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Biochemical Synthesis in Microstructured Silicon Wafer
Zeitschrift für Physikalische Chemie, 2002In biotechnics microsystems have been introduced primarily for analytical purpose in the past few years. Recently miniaturised microtiterplates, so called nanotiterplates, as efficient tools in screening have been discussed.In a case study we demonstrate the application of cell-free translation or transcription/translation and nucleic acid ...
Gebinoga, M. +4 more
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On the fracture of multi-crystalline silicon wafer
Journal of Physics D: Applied Physics, 2016This work focuses on the fracture behavior of multi-crystalline silicon in 4-point bending tests. The objective is to investigate the crack path as well as the effect of the grain boundary on the crack propagation. Thin specimens that contain the same grains have been tested under identical loading in order to assess the consistency of the fracture ...
Zhao, Lv +5 more
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