Results 261 to 270 of about 3,856 (291)

Microstructure, interfacial IMC and mechanical properties of Sn–0.7Cu–xAl (x=0–0.075) lead-free solder alloy

Materials & Design, 2015
Yaocheng Zhang, Jun Dai, Jinguo Ge
exaly  

Solder Alloys

2018
openaire   +1 more source

Creep behavior of eutectic 80Au/20Sn solder alloy

Journal of Alloys and Compounds, 2009
J Wei
exaly  

Wettability of low temperature solder alloys for step-soldering

1991
F Hosking, P Vianco, D Frear
openaire   +1 more source

Microstructure and mechanical properties of Sn–xBi solder alloy

Journal of Materials Science: Materials in Electronics, 2015
Chengchao Du, Wu Mingfang
exaly  

Effect of aluminum concentration on the microstructure and mechanical properties of Sn–Cu–Al solder alloy

Microelectronics Reliability, 2015
Yaocheng Zhang, Chengchao Du, Jun Dai
exaly  

Solders and brazing alloys

1976
openaire   +1 more source

Investigation of stress exponent in the room-temperature creep of Sn–40Pb–2.5Sb solder alloy

Journal of Alloys and Compounds, 2007
A Rezaee-Bazzaz
exaly  

Melting and solidification properties of the nanoparticles of Sn3.0Ag0.5Cu lead-free solder alloy

Materials Characterization, 2010
Yulai Gao, Bin Yang, Qijie Zhai
exaly  

Low cycle fatigue behavior of a eutectic 80Au/20Sn solder alloy

International Journal of Fatigue, 2015
Y Y Zhang, J Wei
exaly