Results 241 to 250 of about 3,856 (291)

The gold solder, gold alloy interface

Australian Dental Journal, 1977
Abstract— With soldering the physical properties of the basis metal must be maintained and a minimum of molten metal is used. An examination of joints in 17 gauge platinized gold wire is made with 18 k gold solder following quenching immediately after flow and cooling in air; there is a widening of grain boundaries and intergranulation penetration in ...
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Reflow soldering evaluation of lead free solder alloys

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93), 2002
A quantitative dynamic solder wettability measurement was used to evaluate the effects of reflow processing on the wettability parameters associated with the nonlead bearing solders 96.5% Sn/3.5% Ag and 58% Bi/42% Sn. An experimental design approach employing full factorial experiments was formulated to investigate the solder wetting dependence of the ...
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SOLDERING ALLOY

2001
The invention relates to a soldering alloy consisting of an element or a mixture of elements chosen from the following group: copper, silver and antimony, this element or mixture of elements totalling 0.1 to 40 wt. %, as the first component; an element or mixture of elements chosen from the following group: the rare earths, this element or mixture of ...
EUROMAT GMBH, HILLEN FRANK, RASS INO, LUGSCHEIDER ERICH   +3 more
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Microstructural behaviour of solder alloys

5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the, 2004
In this contribution a strongly nonlocal diffuse interface theory is used to model the microstructure evolution of a multiphase solder alloy. The mechanical behaviour of the material is modelled using a hyperelasto-viscoplastic Perzyna model. The material parameters are taken dependent on the mass fraction field which is calculated with the diffuse ...
Ubachs, R.L.J.M., Schreurs, P.J.G., Geers, M.G.D.   +2 more
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A Creep Model for Solder Alloys

Journal of Electronic Packaging, 2011
Demand for long-term reliability of electronic packaging has lead to a large number of studies on viscoplastic behavior of solder alloys. Various creep models for solder alloys have been proposed. They range from purely empirical to mechanism based models where dislocation motion and diffusion processes are taken into account.
Yongchang Lee, Cemal Basaran
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Warpage produced by soldering with dental solders and gold alloys

The Journal of Prosthetic Dentistry, 1954
Abstract To summarize the results of all of these trials, it can be said that the more precise the fit of the parts to be soldered, the less they will be distorted.This is true whether the joints considered are of wires or of bars. The amount of solder used to produce the joint is important.The less solder used to produce the union, the less the ...
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Electrochemical Behaviour of Solder Alloys

2011
For a powered circuit, a metal corrosion–induced failure mechanism of particular concern is that of the formation of metal dendrites in the presence of contamination and moisture residues, which can lead to catastrophic failure. The propensities of two lead-free solders, SnAgCu (SAC) and Sn, to form dendrites have been assessed using electrochemical ...
C. Zou, C. Hunt
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Superconducting silver brazing alloy (silver solder)

Review of Scientific Instruments, 1978
A superconducting transition has been observed in a type BAg-3 silver brazing alloy (silver solder) with Tc=96.6 mK and Hc=4.7 Oe. The associated diamagnetism indicates that approximately 1/3 of the sample volume displays the Meissner effect. This property dictates caution in its use at very low temperatures, particularly near sensitive magnetic ...
J R, Thompson, J O, Thomson
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The Performance of Fluxes and Lead-Free Solder Alloys In Soldering of Aluminum

Soldering and Reliability Conferences, 2012
ABSTRACT There is a strong desire in the electronics industry to replace copper with aluminum in some areas for cost and weight saving, especially in wire harness applications. Being able to solder aluminum effectively will ease the transition.
William F. Avery, Philip A. Baskin
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Effect of Solder Paste Alloy and Volume on Solder Voiding

2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2023
Abdallah Alakayleh, Mohamed El Amine Belhadi, Sufyan Tahat, Ehab HMasha, Andrii Shmatok, Ali Alahmer, Sa'd Hamasha   +6 more
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