Skin-conformal PMN-PT ultrasonic sensor for cuffless blood pressure sensing via eutectic solder integration. [PDF]
Zaidi STH +5 more
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Failure Behavior and Mechanism of Solder Joint Under Thermal Mechanical Coupling Loads. [PDF]
Deng Y +6 more
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Influence of Pd Coating Thickness and Pd Content in Sn-Based Solders on Interfacial IMC Formation and Microstructural Evolution in Solder/Ni Joints. [PDF]
Wang CH, Li CA, Li KT, Chiu HW.
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Cross Comparison Between Thermal Cycling and High Temperature Stress on I/O Connection Elements. [PDF]
Dhyani M +3 more
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Microstructure and Mechanical Properties of In-Doped Low-Temperature SnPb Solders. [PDF]
Xie X +7 more
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Investigation of the Microstructures and Mechanical Properties of Sn-Cu-Bi-In-Ni Solders. [PDF]
Lv X +5 more
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Influence of Alloying Elements on the Phase Structure, Stress-Strain Behavior, and Fracture Toughness of Ni<sub>3</sub>Sn: A First-Principles Study. [PDF]
Zhang H +5 more
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Microstructural and mechanical responses of Sn58Bi/Cu composite solder joints with 0.1wt.% Ni and carbon fiber addition. [PDF]
Kong X +6 more
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ABSTRACT On-demand webinar originally hosted by SMTA Oregon Chapter Technical Presentation: The MIL/AERO industry continues to use SnPb solder for SMT component attachment ...
Rob Rowland, Raiyo Aspandiar
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