Reliability issues of lead-free solder joints in electronic devices [PDF]
Science and Technology of Advanced Materials, 2019 Electronic products are evolving towards miniaturization, high integration, and multi-function, which undoubtedly puts forward higher requirements for the reliability of solder joints in electronic packaging.
Nan Jiang +7 more
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First-principles study on elastic properties of Cu, (Cu1−x,Nix)3Sn and interfacial mechanical properties of (Cu1−x,Nix)3Sn/Cu in the lead-free solder joint [PDF]
Beilstein Journal of NanotechnologyIn this study, the elastic properties of Cu and (CuxNi1−x)3Sn were calculated to reveal the effects of Ni alloying on the interfacial mechanical properties of (CuxNi1−x)3Sn/Cu in lead-free solder joints.
Guomin Hua
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Thermal Induced Interface Mechanical Response Analysis of SMT Lead-Free Solder Joint and Its Adaptive Optimization [PDF]
Micromachines, 2022 Surface mount technology (SMT) plays an important role in integrated circuits, but due to thermal stress alternation caused by temperature cycling, it tends to have thermo-mechanical reliability problems.
Shaoyi Liu +10 more
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A Short Review on the Influence of Antimony Addition to the Microstructure and Thermal Properties of Lead-Free Solder Alloy [PDF]
Archives of Metallurgy and Materials, 2023 For long time, Sn-Pb solder alloys have been used extensively as the main interconnection materials in the soldering. It is no doubt that Sn-Pb offers many advantages including good electrical conductivity, mechanical properties as well as low melting ...
Nur Syahirah Mohamad Zaimi +3 more
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Lead-Free Solders for Superconducting Applications [PDF]
IEEE Transactions on Applied Superconductivity, 2016 In this paper, the low-temperature properties of some commercial Pb-free solders developed for electronics and aerospace applications were investigated for possible use as superconducting solder materials. Their properties are also compared with in-house Sn 35In 50Bi 15 solders being developed to replace the widely used Pb-Bi alloys. Of these materials,
Aksoy, C. +4 more
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Effect of Aging Time on Deformation Behavior of Lead-Free and Lead Base Solders Alloys [PDF]
Engineering and Technology Journal, 2018 The effect of aging time on the deformation behavior of lead-free and lead- based sub-mm solder alloys were investigated. Experimental results showed that the aging time (less than 4 hours) did not have any effect on the anisotropy behavior of Tin solder
Alaa Ali
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Gallium-effect in a lead-free solder for silver-sheathed superconducting tape
Materials Research Express, 2021 Solder joints of silver-sheathed superconducting tapes are promising for various commercial applications. In this research, Pb, Ga, and Ga-doped lead-free Sn–Ag–Cu solders are used to study the gallium effect for the low joint resistivity with silver ...
Shin-Ichi Shamoto +7 more
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Phase equilibria investigation and alloys characterization in Sn-In-Ag system [PDF]
Hemijska Industrija, 2008 Lead-free soldering has become very popular in the world recently, especially in electronics, because of high ecological demands in industry. Some of lead-free solder alloys are already used in electronic industry, but despite that investigations are ...
Milosavljević Aleksandra R. +5 more
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Reliability Examinations of SAC Lead Free Solder Material [PDF]
Archives of Metallurgy and Materials, 2019 In this paper the effect of soldering technique and thermal shock test were investigated on SAC 305 solder joints, produced by two different solder method.
D. Koncz-Horváth +3 more
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Laser-Induced Period Surface Structures to Improve Solderability of Electrical Solder Pads
Applied Sciences, 2021 We report on structuring copper representing soldering pads of printed circuit boards by laser-induced periodic surface structures. Femtosecond laser radiation is used to generate low spatial frequency laser-induced surface structures, having a spatial ...
Stefan Rung, Ralf Hellmann
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