Analysis of surface mount technology solder joints [PDF]
, 1996 This thesis was submitted for the degree of Doctor of Philosophy and awarded by Brunel University.The factors determining the quality of surface mount technology (SMT) solder joints are numerous, and complex.
Hui, Ip Kee
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Study of Lead-Free Solder Joint Reliability [PDF]
, 2022 Solders are essential for the construction of many engineering materials. The use of soldering in electronic packaging has become increasingly critical in today\u27s world.
Puspita, Widya Rika +9 more
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Thermo-mechanical reliability studies of lead-free solder interconnects [PDF]
, 2021 Solder interconnections, also known as solder joints, are the weakest link in electronics packaging. Reliability of these miniature joints is of utmost interest - especially in safety-critical applications in the automotive, medical, aerospace, power ...
Depiver, Joshua Adeniyi
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A study on the influence of graphene nano-sheets on the microstructure and mechanical properties of lead-free Sn-0.7Cu solder alloy [PDF]
TehnikaNumerous research studies on composite solder materials have aimed to develop sustainable lead-free solders. The production of various types of lead-free solders has been seriously investigated worldwide as an alternative to harmful Pb solders. The study
Nedeljković Milan M. +5 more
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Research Progress on the Solder Joint Reliability of Electronics Using in Deep Space Exploration
Chinese Journal of Mechanical Engineering, 2023 The spacecraft for deep space exploration missions will face extreme environments, including cryogenic temperature, intense radiation, wide-range temperature variations and even the combination of conditions mentioned above.
Qilong Guan +6 more
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Structure and properties of Sn-Cu lead-free solders in electronics packaging
Science and Technology of Advanced Materials, 2019 With the development of lead-free solders in electronic packaging, Sn-Cu lead-free solder has attracted wide attention due to its excellent comprehensive performance and low cost.
Meng Zhao +4 more
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Crystals, 2017 Copper wires have been attracting much attention for Large Scale Integration (LSI) bonding because of their excellent mechanical and electrical properties, in addition to their low material cost.
Naoya Tada +3 more
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Effect of rare earth Ce on the microstructure, physical properties and thermal stability of a new lead-free solder [PDF]
Journal of Mining and Metallurgy. Section B: Metallurgy, 2011 In this paper, in order to develop a low silver content lead-free solder with good overall properties, a newly designed solder alloys of Sn-0.3Ag-0.7Cu-20Bi-xCe type, with addition of varying amounts of rare earth Ce (0.05 mass%, 0.1 mass% and 0.2 ...
Chen W., Kong J., Chen W.J.
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Science and Technology of Advanced Materials, 2015 Nanocomposite lead-free solders are gaining prominence as replacements for conventional lead-free solders such as Sn–Ag–Cu solder in the electronic packaging industry.
Ai Ting Tan, Ai Wen Tan, Farazila Yusof
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Effect Of Lead-free Solder And Gold Content On The Shear Strength, Toughness, IMC And Void Formation [TT267. C518 2004 f rb Kejuruteraan] [Microfiche 7715]. [PDF]
, 2004 Study of interaction between lead free solder with gold and the mechanical toughness,shear strength of solder that associated with intermetallic compound IMC and void formation was carried out.
Oo, Cheng Ee
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