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Thermo-mechanical reliability studies of lead-free solder interconnects [PDF]
, 2021 Solder interconnections, also known as solder joints, are the weakest link in electronics packaging. Reliability of these miniature joints is of utmost interest - especially in safety-critical applications in the automotive, medical, aerospace, power ...
Depiver, Joshua Adeniyi
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A study on the influence of graphene nano-sheets on the microstructure and mechanical properties of lead-free Sn-0.7Cu solder alloy [PDF]
TehnikaNumerous research studies on composite solder materials have aimed to develop sustainable lead-free solders. The production of various types of lead-free solders has been seriously investigated worldwide as an alternative to harmful Pb solders. The study
Nedeljković Milan M. +5 more
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Research Progress on the Solder Joint Reliability of Electronics Using in Deep Space Exploration
Chinese Journal of Mechanical Engineering, 2023 The spacecraft for deep space exploration missions will face extreme environments, including cryogenic temperature, intense radiation, wide-range temperature variations and even the combination of conditions mentioned above.
Qilong Guan +6 more
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Study of Lead-Free Solder Joint Reliability
, 2022 Solders are essential for the construction of many engineering materials. The use of soldering in electronic packaging has become increasingly critical in today\u27s world.
Puspita, Widya Rika +9 more
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Crystals, 2017 Copper wires have been attracting much attention for Large Scale Integration (LSI) bonding because of their excellent mechanical and electrical properties, in addition to their low material cost.
Naoya Tada +3 more
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Effect of rare earth Ce on the microstructure, physical properties and thermal stability of a new lead-free solder [PDF]
Journal of Mining and Metallurgy. Section B: Metallurgy, 2011 In this paper, in order to develop a low silver content lead-free solder with good overall properties, a newly designed solder alloys of Sn-0.3Ag-0.7Cu-20Bi-xCe type, with addition of varying amounts of rare earth Ce (0.05 mass%, 0.1 mass% and 0.2 ...
Chen W., Kong J., Chen W.J.
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Structure and properties of Sn-Cu lead-free solders in electronics packaging
Science and Technology of Advanced Materials, 2019 With the development of lead-free solders in electronic packaging, Sn-Cu lead-free solder has attracted wide attention due to its excellent comprehensive performance and low cost.
Meng Zhao +4 more
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Printing Morphology and Rheological Characteristics of Lead-Free Sn-3Ag-0.5Cu (SAC) Solder Pastes [PDF]
, 2014 Solder paste plays a crucial role as the widely used joining material in surface mount technology (SMT).The understanding of its behaviour and properties is essential to ensure the proper functioning of the electronic assemblies.The composition of the ...
Mallik, Sabuj +4 more
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Science and Technology of Advanced Materials, 2015 Nanocomposite lead-free solders are gaining prominence as replacements for conventional lead-free solders such as Sn–Ag–Cu solder in the electronic packaging industry.
Ai Ting Tan, Ai Wen Tan, Farazila Yusof
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A review: lead free solder and its wettability properties [PDF]
, 2016 The purpose of this paper is to publish on the review of the lead free solder for electronic packaging. This involved the basic principles of the solder, the lead solder and its legislation and the lead free solder with its mechanism.
Mhd Noor, Ervina Efzan +2 more
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