Results 1 to 10 of about 27,052 (317)
Study of diffusion processes in contact areas of thermocouples with metals [PDF]
E3S Web of Conferences, 2023 Diffusion processes on the contact areas of the metal-solder-semiconductor system are experimentally studied in this work. Diffusion coefficients, activation energies and pre-exponential factors in samples commutated with solders based on Pb-Sb are ...
Onarkulov K., Azimov T.
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Research of terminal soldering technology for auto glass heating systems [PDF]
E3S Web of Conferences, 2023 The paper considers the issues of technology for soldering a terminal (contactor) to auto-glass heating systems for cars, i.e. technology of soldering metal to non-metal bodies.
Abdurakhmonov Sultonali +4 more
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Comparison between bulk and particle solder alloy on the performance of low-melting solder joints
Journal of Materials Research and Technology, 2023 The influence of uniformity and small size solder particles on microstructure evolution and mechanical performances of low temperature soldering joints was investigated.
Mingkun Yang +4 more
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Method for forming a titanium-germanium contact layer for thermostabilization of transistors
Вестник Дагестанского государственного технического университета: Технические науки, 2021 Objective. The objective of the study is to obtain high-quality and reproducible electrophysical parameters of thin-film metal layers, the formation technology of which determines the reliability and quality of microelectronic products – silicon ...
T. A. Ismailov +3 more
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International Journal of Advanced Studies, 2022 The article takes into account the technological structure according to the structure of the formation of composite coating layers on the substrate surface, consisting of an adhesive layer, which is a CuMnCo solder, and an essentially functional layer ...
Etibar Yusif Ogli Balaev +3 more
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Effect of trace elements on the interface reactions between two lead-free solders and copper or nickel substrates [PDF]
Journal of Mining and Metallurgy. Section B: Metallurgy, 2007 Traditional Sn-Pb solder alloys are being replaced, because of environmental and health concerns about lead toxicity. Among some alternative alloy systems, the Sn-Zn and Sn-Cu base alloy systems have been studied and reveal promising properties.
Soares D. +5 more
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Heliyon, 2023 Eutectic Sn–Ag–Cu lead-free solder has limited applications due to cost and reliability issues. Sn–Ag–Zn solder has the advantages of low melting point, good mechanical properties and reliable welding interface. However, the research system of low silver
Jin Xiao +4 more
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Metals, 2019 Sn-58Bi eutectic solder is the most recommended low temperature Pb-free solder but is also limited from the interfacial embrittlement of Bi segregation. Since the quaternary Sn-38Bi-1.5Sb-0.7Ag solder provides a similar melting point as Sn-58Bi eutectic,
Kaipeng Wang +3 more
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CoSn3 Intermetallic Nanoparticles for Electronic Packaging
Nanomaterials, 2022 At present, composite solder pastes are getting a lot of attention, especially composite Sn based solders reinforced by nanoparticles. Indeed, CoSn3 is a strong nucleating agent of Sn crystal, which has potential application value in the field of ...
Jintao Wang +5 more
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Metals, 2018 The aim of the research was to characterize the soldering alloy In–Ag–Ti type, and to study the direct soldering of SiC ceramics and copper. The In10Ag4Ti solder has a broad melting interval, which mainly depends on its silver content.
Roman Koleňák +4 more
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