Results 11 to 20 of about 27,052 (317)
Solder joint failures under thermo-mechanical loading conditions – a review [PDF]
, 2020 Solder joints play a critical role in electronic devices by providing electrical, mechanical and thermal interconnections. These miniature joints are also the weakest links in an electronic device.
Mallik, Sabuj +3 more
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Preparation and temperature cycling reliability of electroless Ni(P) under bump metallization [PDF]
, 2007 The reliability of electroless Ni(P) under-bump metallization (UBM) was evaluated via temperature cycling and solder bump shear strength tests. Commercial diodes and dummy dies fabricated in-house were used as substrates for the electroless Ni(P) UBM ...
Chen, Weimin +9 more
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Viscoplastic behavior of diamond die attach subjected to high temperature conditions [PDF]
, 2012 In power electronic applications, diamond based semi-conductors appears to be a new way to widely increase the capabilities of power electronic converters. The main prospective expected is an increasing in system integration and power capabilities.
Msolli, Sabeur +9 more
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Thermo-mechanical reliability studies of lead-free solder interconnects [PDF]
, 2021 Solder interconnections, also known as solder joints, are the weakest link in electronics packaging. Reliability of these miniature joints is of utmost interest - especially in safety-critical applications in the automotive, medical, aerospace, power ...
Depiver, Joshua Adeniyi
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Micromachines, 2022 The development of advanced electronic devices leads to highly miniaturized interconnect circuits (ICs), which significantly increases the electromigration (EM) phenomenon of solder and circuits due to higher current density.
Yuanxiang Zhang +3 more
doaj +1 more source
Creep-fatigue life evaluation of Sn-3.5Ag lead-free solder at low temperatures
Mechanical Engineering Journal, 2016 This paper describes creep-fatigue lives of Sn-3.5Ag lead-free solder at low temperatures. Since solders have lower melting temperature and electronic devices are often used at low temperature environment, it is effective for improving the fatigue life ...
Noritake HIYOSHI
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Materials Research Express, 2021 A comparison of the microstructure, interfacial IMC layer, shear behavior and hardness of the Sn58Bi, SnBi@110P-Cu/Cu and SnBi@500P-Cu/Cu solder joints was carried out during isothermal aging in this study.
Yang Liu +5 more
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Metals, 2017 Au-Ge-Ni solder was chosen for brazing of the Cu-Cr-Zr alloy cylinder and a part with a cylindrical hole (sleeve) below 550 °C. The Au based solder was first sintered on the surface of the cylinder and then brazed to the inner surface of the sleeve.
Zaihua Li +3 more
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Proposal of experimental method on fatigue of bonding materials for electronic packaging
Nihon Kikai Gakkai ronbunshu, 2020 Various bonding materials have been developed for power semiconductor products. However, the fatigue characteristics of many of these materials are difficult to evaluate uniformly using a conventional test, and this difficulty represents an obstacle to ...
Yu HARUBEPPU +2 more
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Printing Morphology and Rheological Characteristics of Lead-Free Sn-3Ag-0.5Cu (SAC) Solder Pastes [PDF]
, 2014 Solder paste plays a crucial role as the widely used joining material in surface mount technology (SMT).The understanding of its behaviour and properties is essential to ensure the proper functioning of the electronic assemblies.The composition of the ...
Mallik, Sabuj +4 more
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