Results 21 to 30 of about 27,052 (317)
Creep-Fatigue Behaviours of Sn-Ag-Cu Solder Joints in Microelectronics Applications [PDF]
, 2021 Electronic manufacturing is one of the dynamic industries in the world in terms of leading technological advancements. Electronic assembly's heart lies the 'soldering technology' and the 'solder joints' between electronic components andsubstrate.
Joshua A. Depiver +10 more
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A New Low-Temperature Solder Assembly Technique to Replace Eutectic Sn-Bi Solder Assembly
Micromachines, 2022 We successfully achieved low-temperature assembly by reflowing the 13.5Sn-37.5Bi-45In-4Pb quaternary eutectic solder paste and the SAC 305 solder ball together at 140 °C for 5 min. The wetting angle of the mixed solder joint is 17.55°. The overall atomic
Lingyao Sun +5 more
doaj +1 more source
Physics Letters B, 2007 In two dimensions the simple addition of two chiral bosons of opposite chiralities does not lead to a full massless scalar field. Similarly, in three dimensions the addition of two Maxwell-Chern-Simons fields of opposite helicities $\pm 1$ will not produce a parity invariant Maxwell-Proca theory.
Dalmazi, D., Dutra, Alvaro de Souza
openaire +3 more sources
CrystalsIn this study, intense pulsed light (IPL) soldering was employed on Sn-58Bi solder pastes with two distinct particle sizes (T3: 25–45 μm and T9: 1–8 μm) to investigate the correlation between the solder microstructure and mechanical properties as a ...
Hyeri Go +3 more
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Journal of Science: Advanced Materials and Devices, 2023 With the miniaturization of electronic components and higher density of electrical connections in the printed circuit boards, the properties of conventional solder masks are unfit for these ever-growing requirements, especially when subjected to extreme ...
William Yung Ling Lim +4 more
doaj +1 more source
CFD simulation of solder paste flow and deformation behaviours during stencil printing process. [PDF]
, 2015 In 20th century, Electronics elements have become most significant part of the regular life. The main heart of electronic element is PCB which supports and manages mostly machines and equipments these days.
Mallik, Sabuj +2 more
core +1 more source
Reliability Simulation of IGBT Module with Different Solders Based on the Finite Element Method
MetalsThe interconnecting solder is a key control factor for the reliability of electronic power packaging because it highly affects the junction temperature of insulated-gate bipolar transistor (IGBT) modules and is prone to plasticity, creep, and other ...
Haoran Ma +4 more
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Mechanical Property of Sn-58Bi Solder Paste Strengthened by Resin
Applied Sciences, 2018 Sn-58Bi solder has been widely used for microelectronics packaging due to its low melting point temperature, good wetting performance, good mechanical properties, and low cost.
Lu Liu, Songbai Xue, Siyi Liu
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Effect of Cr on microstructure and properties of brazed diamond with Ni-based boron free solder
Jin'gangshi yu moliao moju gongcheng, 2022 In view of the problem that B element is easy to cause more hard and brittle phases in brazed diamond joints, a new type of Ni–Cr–Si–Cu–Sn boron free active solder was prepared, and the effects of Cr element on the microstructure of solder and the ...
Pengbo WANG +7 more
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An Introductory Overview of Various Typical Lead-Free Solders for TSV Technology
InorganicsAs semiconductor packaging technologies face limitations, through-silicon via (TSV) technology has emerged as a key solution to extending Moore’s law by achieving high-density, high-performance microelectronics.
Sooyong Choi +5 more
doaj +1 more source