Results 41 to 50 of about 27,052 (317)

Self-Assembly of Microscale Parts through Magnetic and Capillary Interactions

Micromachines, 2011
Self-assembly is a promising technique to overcome fundamental limitations with integrating, packaging, and general handling of individual electronic-related components with characteristic lengths significantly smaller than 1 mm. Here we describe the use
Madan Dubey, Christopher J. Morris, Brian Isaacson, Michael D. Grapes   +3 more
doaj   +1 more source

Effects of solder volume on formation and redeposition of Au-containing intermetallics in Au/Ni-SnAgCu-Ni(P) solder joints

, 2007
SnAgCu is one of the most promising candidates for lead-free solders to replace conventional eutectic SnPb solders. The effects of solder volume on interfacial reactions and microstructure evolution in Au/Ni-SnAgCu-Ni(P) solder joints have been ...
Chen, Hongtao, Tian, Yanhong, Wang, Chunqing, Yan, Cheng, Huang, Y.   +4 more
core   +1 more source

Characterising Solder Materials from Random Vibration Response of their Interconnects in BGA Packaging

, 2023
Solder interconnection in electronic packaging is the weakest link, thus driving the reliability of electronic modules and systems. Improving interconnection integrity in safety-critical applications is vital in enhancing application reliability.
DEPIVER, J., Joshua A. Depiver, Emeka H. Amalu, Mallik, Sabuj, Amalu, Emeka H., Sabuj Mallik, Amalu, E. H., Amalu, Emeka H.; id_orcid, Mallik, S., Depiver, Joshua A.   +9 more
core   +1 more source

Swelling‐Induced Stress‐Assisted Transfer of Nanodiamond Arrays With a PVA Carrier Tape for Conformal Bio‐Integrated Sensing and Labelling

Advanced Functional Materials, EarlyView.
This work introduces a swelling‐induced, stress‐assisted water‐soluble PVA tape strategy to transfer‐print nanodiamond quantum‐sensor arrays onto soft, curved biological interfaces. The room‐temperature, water‐triggered process achieves >98% fidelity and residue‐free integration, enabling conformal quantum sensing on contact lenses, neural probes, and ...
Luyao Zhang, Lingzhi Wang, Xinhao Hu, Tai Nam Yip, Mingze Sun, Jixiang Jing, Lizhi Xu, Yuan Lin, Yong Hou, Zhiqin Chu   +9 more
wiley   +1 more source

Overview on the Evolution of Laser Welding of Vascular and Nervous Tissues

Applied Sciences, 2019
Laser welding presents a core position in the health sector. This process has had an outstanding impact on the surgical procedures from many medical areas, such as on vascular and nervous surgeries.
Diogo Francisco Gomes, Ivan Galvão, Maria Amélia Ramos Loja   +2 more
doaj   +1 more source

Microstructure, Mechanical, and Electrical Properties and Corrosion Analysis of Lead-Free Solder CSI Joints on Cu Substrate Using Novel Concentrated Solar Energy Soldering (CSES) Method

Advances in Materials Science and Engineering, 2020
In this study, “Concentrated Solar Energy (CSE)” is applied for soldering and is named as the “Concentrated Solar Energy Soldering (CSES) technique.” Lead-free solders are used for comparing novel CSES technique solder joints with CSI (Conventional ...
Pushkaraj D. Sonawane, V. K. Bupesh Raja, Manoj Gupta   +2 more
doaj   +1 more source

Pull‐and‐Push Nanotherapeutic Hydrogels: Scavenging Inflammatory Triggers While Driving Tissue Regeneration in Burn Wounds

Advanced Functional Materials, EarlyView.
A nanounit‐assembled hydrogel employing a “pull‐and‐push” strategy simultaneously scavenges pro‐inflammatory cell‐free DNA (cfDNA) and delivers regenerative therapeutics in response to burn‐induced hyperthermia. By repolarizing macrophages and promoting angiogenesis, this multifunctional platform accelerates burn wound healing, offering a blueprint for
Han‐Sem Kim, Seong‐Jin Shin, Sak Lee, Nandin Mandakhbayar, Ji‐Hye Kang, Da‐Young Kong, Seong‐Doo Hong, Ueon Sang Shin, Hae‐Won Kim, Jung‐Hwan Lee   +9 more
wiley   +1 more source

The doped Pd on the crystal calculation and intermetallic property of low-temperature soldered ENEPIG substrates

Journal of Materials Research and Technology, 2023
The preparation of new solder joint materials for chip packaging by designing a variety of brazing material mixes has become one of the future research directions for solder joints. They added low melting point elements to traditional solder materials to
Shuye Zhang, Shaoan Wang, Shang Zhang, Xiangyu Chen, Chen Zeng, Kyung-Wook Paik, Peng He   +6 more
doaj   +1 more source

Vorticity‐Driven µ‐Platelet Rotation and Selective Packing for Vertical Thermal–Electrical Interconnects

Advanced Functional Materials, EarlyView.
We introduce a capillary‐filtering‐based particle‐filling (CFPF) process that simultaneously forms vertical thermal pathways and electrical vias within µ‐pores. In situ microfluidic analysis reveals that capillary‐driven velocity gradients generate vorticity that governs µ‐platelet rotation and vertical alignment.
Yujin Mun, Sang Gil Lee, Un‐seong Baik, Taeyoon Kwon, Jungyeon Kim, Joo Hwan Shin, Chanho Jeong, Jae‐seung Shim, Yeji Kim, Hyein Jung, Jin‐Tae Kim, Tae‐il Kim   +11 more
wiley   +1 more source

Materials modification of the lead-free solders incorporated with micro/nano-sized particles: A review

Materials & Design, 2021
As to promote the performance of the solder joints applied to electronics industry, the researchers take advantage of micro/nano-sized particles or another element coated on nanoparticles to be incorporated into the solder paste or flux and investigate ...
Mu-lan Li, Liang Zhang, Nan Jiang, Lei Zhang, Su-juan Zhong   +4 more
doaj   +1 more source