Results 51 to 60 of about 27,052 (317)
Creep Damage of BGA Solder Interconnects Subjected to Thermal Cycling and Isothermal Ageing [PDF]
, 2019 Solder joints of electronic components are the most critical part of any electronic device. Their untimely failure during the system’s operation often culminates incatastrophic failure of the device.
Joshua A. Depiver +9 more
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Thermal fatigue life of ball grid array (BGA) solder joints made from different alloy compositions
, 2021 As temperature cycling drives fatigue failure of solder joints in electronic modules, characterisation of the thermal fatigue response of different solder alloy formulations in BGA solder joints functioning in mission-critical systems has become crucial.
MALLIK, SABUJ +6 more
core +1 more source
Effective Solder for Improved Thermo-Mechanical Reliability of Solder Joints in a Ball Grid Array (BGA) Soldered on Printed Circuit Board (PCB) [PDF]
, 2020 Ball grid array (BGA) packages have increasing applications in mobile phones, disk drives, LC displays and automotive engine controllers. However, the thermo-mechanical reliability of the BGA solder joints challenges the device functionality amidst ...
MALLIK, SABUJ +5 more
core +1 more source
Advanced Healthcare Materials, EarlyView.A portable respiratory monitoring device based on a flexible PZT sensor captures pressure‐ and temperature‐related airflow responses in a single waveform. Polarity‐opposed piezoelectric and pyroelectric components generate a narrow transient spike and a broad quasi‐steady peak during both inhalation and exhalation. This dual‐component structure enables
Minyu Li +7 more
wiley +1 more source
ZINC MICRO-ALLOYING ADDITIONS IN Sn-0.7Cu LEAD-FREE SOLDER ALLOYS. SHORT REVIEW [PDF]
European Journal of Materials Science and Engineering, 2017 Sn-Pb solder alloy has been replaced with lead-free solder alloys due to the negative effect for environment and human health. The additions of Zinc (Zn) micro-alloying element in Sn0.7Cu lead-free solder alloy were reported by several researchers in ...
Intan Nashasha Amira IBRAHIM +1 more
doaj
Ain Shams Engineering Journal, 2022 Demand for more interconnection joints between semiconductor devices can be realized with solder bump technology. Surface tension and density are usually material properties related factors that affect solder bump geometric shape. Therefore, to cope with
Ab Aziz bin Mohd Yusof +2 more
doaj +1 more source
Advanced Materials, EarlyView.We report a multifunctional tapered optical fiber integrating a conformal micro‐resistance temperature detector (µRTD) for local, real‐time thermometry during optical stimulation. The platform combines light‐delivery and temperature sensing within a minimally invasive footprint, enabling detection of sub‐degree cortical heating under representative ...
Antonio Balena +6 more
wiley +1 more source
Effect of reflow profile on reliability of CNT-composite solder joint [PDF]
Advanced ManufacturingThis study investigates the effect of the different wt % of carbon nanotube (CNT) on melting point and the effect of time duration in the reflow zone on the reliability of the CNT-composite solder (CCS) solder.
Seri Rahayu Kamat +3 more
doaj +1 more source
Solder spread: A criterion for evaluation of soldering [PDF]
Gold Bulletin, 1990 Quantitative measurements of the intrinsic spread characteristics of solders used in electronics applications can be carried out by making use of the beneficial properties of gold.
Humpston, G., Jacobson, D. M.
openaire +1 more source
Ball Impact Reliability of Zn-Sn High-Temperature Solder Joints Bonded with Different Substrates
, 2014 In this study, the high-speed deformation behavior of solder joints formed withPb-free Zn-Sn and commercial Pb-Sn alloys bonded on different substrateswas investigated by the ball impact test method. Overall, Zn-Sn jointsexhibited greater impact strength
Tsung-Yun Pai +5 more
core +1 more source