Results 71 to 80 of about 27,052 (317)

Effect of electron irradiation on microstructural evolution and mechanical properties of Sn3Ag0.5Cu solder joints

Journal of Materials Research and Technology
Power electronic devices face harsh radiation environments in deep space exploration. It is significant to study the reliability of solder joints of electronic devices in radiation environments.
Yang Liu, Yangjing Xia, Yuxiong Xue, Xuewei Zhao, Nannan Li, Zhengqiang Zhu, Chaoyang Xing   +6 more
doaj   +1 more source

Deformation behavior of lLeadless 60% Pb–40% Sn solder joints

, 1987
Room temperature deformation data of leadless solder joints are reported. The joints were sheared under cyclic, displacement controlled loading at frequencies between 0.001 and 0.01 Hz.
Ravichandran Subrahmanyan, Subrahmanyan, Ravichandran, Stone, Donald, Che-Yu Li, Donald Stone, Li, Che-Yu   +5 more
core   +1 more source

Double‐Sided Mechanical Interlocking Enables Soft‐Rigid Conductive Interfaces With a Record High Toughness for Flexible Electronics

Advanced Materials, EarlyView.
A double‐sided mechanical interlocking strategy is developed to create robust electrical contact between polymer electrode and metal interconnect. The fibrous structure enables formation of thread–hole adhesion, which only breaks under bulk failure and achieves a record high interfacial energy exceeding 730 J·m−2. This adhesion secures the integrity of
Gang Li, Minkun Cai, Chunyan Cao, Zengbai Ouyang, Hong Fu, Lingyu Zhao, Bingang Xu   +6 more
wiley   +1 more source

Comparison of the Self-Healing Behaviour of 60Sn40Pb and 99.3Sn0.7Cu Solder Alloy Reinforced Al6061 MMCs’

Journal of Manufacturing and Materials Processing
The self-healing characteristics of Al6061 reinforced with CuO have been examined experimentally. The solder alloys 60Pb40Sn and 99.3Sn0.7Cu with low melting points are incorporated to strengthen the Al6061 MMCs’; the self-healing properties have been ...
Subrahmanya Ranga Viswanath Mantha, Gonal Basavaraja Veeresh Kumar, Ramakrishna Pramod, Chilakalapalli Surya Prakasha Rao, Mohd Shahneel Saharudin, Santosh Kumar Sahu   +5 more
doaj   +1 more source

Analysis of surface mount technology solder joints

, 1996
This thesis was submitted for the degree of Doctor of Philosophy and awarded by Brunel University.The factors determining the quality of surface mount technology (SMT) solder joints are numerous, and complex.
Hui, Ip Kee, Hui, I.K.
core  

A damage integral approach to solder joint fatigue

, 1990
The application of a damage integral approach which provides numerical accounting of the accumulated fatigue damage in solder joint is reviewed. The instantaneous fatigue damage rate is determined by the solder stress state, temperature and environment ...
R. Subrahmanyan, C.-Y. Li, Li, C.-Y., McGroarty, J., J. McGroarty, Subrahmanyan, R.   +5 more
core   +1 more source

Overcoming Printing and Interfacial Challenges in Liquid Metal Direct Writing for Integrated Stretchable Electronics

Advanced Materials Technologies, EarlyView.
Liquid metal direct writing is advanced from a technological and fundamental point. Utilizing a kinematic bed, printing on large surfaces with irregularities is enabled. Furthermore, a pressure‐driven flow during printing is discovered that affects the thickness of traces.
Maximilian Krack, Lennert Purnal, Parth Vinayakrao Sewlikar, Sam Cuyvers, Gus Geurts, Rathul Nengminza Sangma, Derese Desta, Dieter Reenaers, Bart Ruttens, Iris De Graeve, Tom Hauffman, Seppe Terryn, Bram Vanderborght, Michaël Daenen, Wim Deferme, Monika Rai   +15 more
wiley   +1 more source

Influência do teor do elemento índio nas propriedades termo-mecânicas de ligas para interconexão de componentes eletrônicos [PDF]

, 2012
Tese (doutorado) - Universidade Federal de Santa Catarina, Centro Tecnológico. Programa de Pós-Graduação em Ciência e Engenharia de Materiais.Este trabalho insere-se no âmbito da confiabilidade de interconexões eletrônicas.
Boareto, José Carlos
core  

Wettability of molten Sn-Bi-Cu solder on Cu substrate

, 2009
The wetting behavior of a new Sn-Bi-Cu Pb-firee solder on Cu substrate was investigated by sessile drop method under an Ar-H(2) flow in the temperature range from 493 K to 623 K.
Zhao, Hongxin, Likun Zang, Zang, LK, Zang, Likun, Hongxin Zhao, Xiaorui Zhang, Yuan, Zhangfu, Zhang, Xiaorui, Zhangfu Yuan   +8 more
core   +1 more source

End‐to‐End Sensing Systems for Breast Cancer: From Wearables for Early Detection to Lab‐Based Diagnosis Chips

Advanced Materials Technologies, EarlyView.
This review explores advances in wearable and lab‐on‐chip technologies for breast cancer detection. Covering tactile, thermal, ultrasound, microwave, electrical impedance tomography, electrochemical, microelectromechanical, and optical systems, it highlights innovations in flexible electronics, nanomaterials, and machine learning.
Neshika Wijewardhane, Lyn I. Jones, Richard M. Martin, Helen Winter, Faezeh Arab Hassani   +4 more
wiley   +1 more source