Results 81 to 90 of about 27,052 (317)

A study on the effect of ageing and intermetallic compound growth on the shear strength of surface mount technology solder joints

open access: yes, 2015
The effect of ageing and intermetallic compound formation on the surface mount solder joints and its shear strength behavior under extreme mechanical and thermal conditions have been discussed in this paper.
Nath, Jyotishman   +3 more
core   +1 more source

Mechanical Fatigue in Liquid‐Metal Interconnects: Failure Mechanism Analysis and Validation of Improvement Strategies

open access: yesAdvanced Materials Technologies, EarlyView.
Multi‐million cycle reliability for liquid metal stretchable electronics is achieved through a continuous cycle of mechanical testing, failure mode and mechanism analysis and implementing subsequent mitigation strategies. ABSTRACT Stretchable electronics that combine mechanical compliance with reliable electrical performance are essential for ...
Lennert Purnal   +8 more
wiley   +1 more source

Development of a program for calculating the fatigue reliability of solder joints using the Engelmayer models

open access: yesФизика волновых процессов и радиотехнические системы, 2018
The algorithm for estimating the fatigue reliability of soldered joints of radioelectronic modules of level 1 and 2 is given. Engelmayers mathematical models were used as initial data.
M.N. Piganov, A.V. Ivanov
doaj  

Effect of Different Ga Contents on the Acid and Alkaline Resistance of New SnInAg Lead-Free Solder Alloy [PDF]

open access: yesCailiao Baohu
In order to improve the corrosion resistance of Sn-11In-1.5Ag lead-free solder alloy solder, the corrosion behavior of Sn-11In-1.5Ag-xGa(x=0, 0.1, 0.3, 0.5, 0.7, mass fraction, %) solder alloy in a corrosive environment was studied by weight loss method ...
REN Pengkai, XU Dongxia, CAO Fulei, CHU Yadong, ZHANG Hongxia
doaj   +1 more source

Self‐Soldering, Stretchable and Self‐Healing Liquid Metal Elastomer Interconnections for Soft Electronics Platforms

open access: yesAdvanced Materials Technologies, EarlyView.
A self‐healing and electrically conductive liquid metal elastomer enables robust self‐soldering of surface mount devices for soft electronics. Photothermally activated conductive pathways, strong pressure‐sensitive adhesion, and stable package‐integrated contacts provide high conductivity and extreme stretchability.
Su Thiri San   +5 more
wiley   +1 more source

Study on Novel Water-Based Polymer Surface Treatment Agent for Solder Ball and Its Performance [PDF]

open access: yesCailiao Baohu
In order to solve the problem of solder balls being prone to oxidation during long-term storage and transportation, a novel water-based polymer surface treatment agent for solder balls was prepared and researched, with solder balls of Sn3.0Ag0.5Cu ...
WANG Tongju, LIN Zipeng, ZHANG Wenqian, LEI Yongping, WU Yuting, LIU Yahao, LENG Qishun
doaj   +1 more source

Fully 3D‐Printed Wave‐Wound Electromagnetic Motors

open access: yesAdvanced Materials Technologies, EarlyView.
This work presents the first fully 3D‐printed wave‐wound electromagnetic motors, which are created using conductive nanoparticle inks, carbon‐filled nylon polymers, and surface mount components. These motors can achieve a stall torque of 7.62N·mmA−1$7.62 \nobreakspace N{\cdot }mm A^{-1}$ and efficiency of 28.2 %, which approaches the performance of ...
Joseph Schwalbe   +4 more
wiley   +1 more source

Advanced tin recycling technology

open access: yesЛитьë и металлургия
The article gives compositions of tin alloys and tin of the highest and first quality categories. The main impurities in tin, tin babbit and tin‑lead solders are presented. The technique of removing copper from POSM 61M solder for producing POSM 61solder
B. M. Nemenenok   +3 more
doaj   +1 more source

Solders and Soldering [PDF]

open access: yesJournal of Electronic Packaging, 2002
Howard H. Manko,, Anthony J. Rafanelli,
openaire   +1 more source

Thermal-mechanical interface crack behaviour of a surface mount solder joint

open access: yes, 1998
The effect of thermal-mechanical loading on a surface mount assembly with interface cracks between the solder and the resistor and between the solder and the printed circuit board (PCB) was studied using a non-linear thermal finite element analysis.
吴永礼   +3 more
core   +1 more source

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