Results 101 to 110 of about 27,052 (317)

Electric‐Current‐Induced Phase Transformation in Cu6Sn5 Below Its Equilibrium Transition Temperature

Advanced Science, EarlyView.
Electric current induces a monoclinic‐to‐hexagonal phase transformation in Cu6Sn5 at a measured bulk temperature of ∼120°C, below the equilibrium transition temperature. Ex situ synchrotron x‐ray diffraction, TEM, and matched thermal controls show that current stressing promotes the formation of a retained hexagonal η‐phase post‐stress state not ...
Shih‐kang Lin, Shubhayan Mukherjee, Yu‐chen Liu, Jun Mizuno   +3 more
wiley   +1 more source

A Flexible Metamaterial Absorber via Loss Engineering for Large‐Area Ultra‐Broadband Infrared Extinction

Advanced Science, EarlyView.
Designed and demonstrated a flexible metamaterial absorber via loss engineering for large‐area ultra‐broadband infrared extinction, providing a new method for miniaturization of absorbers and flexible optical devices. ABSTRACT The advancement of compact and wearable optical systems is critically limited by the lack of high‐performance, integrable ...
Zhe Wu, Zhongzhu Liang, Xiaoyan Shi, Fuming Yang, Enzhu Hou, Jihui Jiang, Xintong Wei, Siyu Guo, Bing Sun, Qingxin Tang, David R. Smith, Haiyang Xu   +11 more
wiley   +1 more source

Thermal Performance Analysis of High-power IGBT Module Based on ANSYS

Kongzhi Yu Xinxi Jishu, 2012
A three-dimensional FEA model of IGBT module is constructed by utilizing finite element analysis of ANSYS. Temperature distribution of the model under steady condition is analyzed and effects of baseplate material and thickness, solder material and layer
FANG Jie, CHANG Guiqin, PENG Yongdian, LI Jilu, TANG Longgu   +4 more
doaj  

Vision-based classification of solder joint defects

, 2010
Inspection of solder joints has been a critical process in the electronic manufacturing industry to reduce manufacturing cost, improve yield, and ensure product quality and reliability.
Mar, Nang Seng Siri
core  

Cross-interaction of interfacial reactions in Ni (Au/Ni/Cu)-SnAg-Cu solder joints during reflow soldering and thermal aging [PDF]

, 2007
The coupling effect of interfacial reactions between two pads in Ni-SnAg-Cu and Au/Ni/Cu-SnAg-Cu solder joints was investigated in this paper. After reflow soldering, a large amount of Cu can diffuse across the solder joint to the opposite pad to form ...
Chen, Hongtao, Li, Mingyu, C.Q. Wang, Wang, Chunqing, Yan, Cheng, Huang, Y., H.T. Chen, C. Yan, M.Y. Li, Y. Huang   +9 more
core   +1 more source

Wireless, Deep‐Seeing Smart Pill: A NIR‐II Fluorescence Imaging Capsule Endoscope for Gastrointestinal Cancer

Advanced Science, EarlyView.
A novel near‐infrared‐II fluorescent imaging capsule endoscope that detects specific fluorescence signals above 900 nm enables highly sensitive, targeted imaging of gastrointestinal cancer tissue. This wirelessly powered and magnetically controlled “smart pill” achieves high sensitivity and deep tissue penetration, allowing precise, non‐invasive ...
Weicheng Wang, Jinlei Jiang, Zhengting Wang, Shuqi Liu, Wei Wang, Xi Chen, Qirui Zhao, Xinyuan Cui, Cheng Zhou, Shengsheng Cui, Daxiang Cui   +10 more
wiley   +1 more source

Stress‐to‐Light Conversion in an Earth‐Abundant Oxide Semiconductor

Advanced Science, EarlyView.
Stress‐to‐light conversion in solids represents a unique photonic functionality, yet it has never been realized in a chemically simple and sustainable material. Here, we show that sustainable semiconductor ZnO exhibits strong near‐infrared (NIR) luminescence under elastic stress when defect‐engineered to stabilize the p‐type state.
Tomoki Uchiyama, Koki Otonari, Reona Omori, Guangfa Yang, Eiji Nishibori, Ying Chen, Xu‐Guang Zheng, Chao‐Nan Xu   +7 more
wiley   +1 more source

Electrohydraulic Folding Ring Actuators for Radially Contracting Applications

Advanced Science, EarlyView.
This work presents an Electrohydraulic Folding Ring Actuator that combines high‐performance electrohydraulic actuation with origami‐inspired folding geometry to achieve constricting radial actuation. This integration yields significant inner lumen constriction, alongside a gripping force capable of holding objects exceeding four times the actuator's ...
Gavril Yong En Tan, Quan Xiong, Jonathan William Ambrose, Zeynep Altundal, Raye Chen‐Hua Yeow   +4 more
wiley   +1 more source

A Review on Effect of Surface Finish and Cooling Rate on Solder Joint Reliability [PDF]

, 2017
The increasing environmental concern over the toxicity of lead (Pb) combined with strict regulations, the use of lead-based solders providing an inevitable driving force for the development of lead-free solder alloys. Many studies have been conducted for
Hardinnawirda, Kahar, Zetty Akhtar, Abd Malek, Siti Rabiatull Aisha, Idris   +2 more
core  

A Supramolecular Reversible and Anisotropic Conductive Adhesive for Flexible Electronics

Advanced Science, EarlyView.
Supramolecular network‐based nanocomposites are developed as a stretchable conductive adhesive for flexible electronics. It's as convenient as traditional solders and constructs anisotropic conductive and robust stretchable connections among diverse soft/rigid materials.
Tongtong Li, Yahui Zhao, Ying Zhang, Yuquan Li, Xuan Ye, Hongyun Qiu, Zhaorui Zhang, Jiang‐Fei Xu, Shaobo Ji   +8 more
wiley   +1 more source