Results 111 to 120 of about 27,052 (317)

Multifaceted Roles of Tantalum in Promoting the Thermoelectric Performance of Mg3(Sb,Bi)2 Based Materials

Advanced Science, EarlyView.
A multifunctional tantalum incorporation strategy enables simultaneous tuning of carrier concentration, mitigation of grain‐boundary scattering, and enhanced phonon scattering in Mg3(Sb,Bi)2. These synergistic effects markedly improve carrier mobility and suppress lattice thermal conductivity, yielding both high material zT and high module conversion ...
Guangmeng You, Jingdan Lei, Kai Xu, Yuntian Fu, Xueke Gu, Chengxiao Peng, Zhen Wang, Jing Chen, Kunpeng Zhao, Chao Wang   +9 more
wiley   +1 more source

A Periosteum‐Inspired Janus Piezoelectric Scaffold Using Bioenergetic‐Driven H‐Type Vascularization for Diabetic Bone Regeneration

Advanced Science, EarlyView.
A periosteum‐inspired Janus piezoelectric scaffold converts micromechanical forces into electrical signals and synergizes with controlled resveratrol release. This dual action reprograms endothelial metabolism, drives H‑type vessel formation, and restores bone–vessel coupling in diabetic bone defects.
Kai Wang, Kai Jiang
wiley   +1 more source

3D‐Printed Magnetoelectronics for Interactive Appliances and Self‐Aware 4D‐Printed Mechatronics

Advanced Science, EarlyView.
3D‐printed magnetoelectronics integrate high‐performance magnetic field sensing directly into complex structural components. Flexible spring and cross‐shaped sensors exhibit giant magnetoimpedance and 3D Hall sensing for vector field reconstruction. Applications include smart‐home switches, robotic joysticks, volumetric magnetometers, and self‐aware 4D‐
Eduardo Sergio Oliveros‐Mata, Anna Martin Vilardell, Fabian Ganss, Christoph Leyens, Lukas Stepien, Denys Makarov   +5 more
wiley   +1 more source

Reliability issues of lead-free solder joints in electronic devices

Science and Technology of Advanced Materials, 2019
Electronic products are evolving towards miniaturization, high integration, and multi-function, which undoubtedly puts forward higher requirements for the reliability of solder joints in electronic packaging.
Nan Jiang, Liang Zhang, Zhi-Quan Liu, Lei Sun, Wei-Min Long, Peng He, Ming-Yue Xiong, Meng Zhao   +7 more
doaj   +1 more source

A General and Efficient Framework for the Rapid Design of Miniaturized, Wideband, and High‐Bit RIS

Advanced Electronic Materials, EarlyView.
A general and efficient framework is proposed for the rapid design of high‐performance reconfigurable intelligent surfaces (RISs). This framework integrates advanced antenna design techniques and incorporates various load types, quantities, and values to achieve the design of high‐performance RISs.
Jun Wei Zhang, Zheng Xing Wang, Wanwan Cao, Zhen Jie Qi, Li Jie Wu, Han Qing Yang, Qun Yan Zhou, Si Ran Wang, Hui Dong Li, Jun Yan Dai, Jiang Luo, Jun Wei Wu, Jia Nan Zhang, Zhen Zhang, Qiang Cheng   +14 more
wiley   +1 more source

Reliability optimization of solder joints in large-sized COTS devices based on solder mask layer design

Hanjie xuebao
High reliability application fields often require specialized devices, which have slower iteration updates and higher costs. COTS devices have a fast update speed and good quality consistency, but their applicability and reliability in specialized fields
Geng LI, Shang WANG, Yuxin SUN, Junhao MENG, Wenzhi WU, Yanhong TIAN   +5 more
doaj   +1 more source

Contribuição ao desenvolvimento de ligas para interconexão eletrônica utilizando moagem de alta enegia [PDF]

, 2013
Dissertação (mestrado) - Universidade Federal de Santa Catarina, Centro Tecnológico, Programa de Pós-Graduação em Ciência e Engenharia de Materiais, Florianópolis, 2013O processamento de materiais compósitos tem despertado interesse dos engenheiros pelo ...
Rodrigues, Guilherme Valença da Silva
core  

Residual free solder process for fluxless solder pastes

, 2018
Purpose For soldering, flux is essential because it enables the wetting of the molten solder. Fluxless soldering, i.e. residue-free soldering with the aid of gaseous activators, has been known for many years, but is only well established in the field of
Alexander Hanss, Gordon Elger
core   +1 more source

An Electrically Conducting Water‐based Reversible Adhesive

Advanced Electronic Materials, EarlyView.
A water‐based reversible glue is demonstrated. The glue has electrical properties similar to other conducting adhesives but can detach after an alkaline wash. Metal fillers are added to an aqueous mixture of polymer nanoparticles synthesized by emulsion polymerization. The nanoparticles are stabilized by poly(acrylic acid) chains bonded to them. The pH‐
Bassam A. Aljohani, Ama B. Asiedu‐Asante, Adriana Sierra‐Romero, Katarina Novakovic, Volker Pickert, Mark Geoghegan   +5 more
wiley   +1 more source

Soldering sheets using soft solders

Acta Universitatis Agriculturae et Silviculturae Mendelianae Brunensis, 2013
The paper contains strength tests results of joints soldered using lead and leadless soft solders. For tests lead solders types Pb60Sn40 and Sn60Pb40 and leadless soft solders types Sn95.5Ag3.8Cu0.7 and Sn96Ag4 were used. As basic materials steel sheet, zinc-coated steel sheet, copper sheet and brass sheet 100 x 20 x 1 mm was the test samples size ...
openaire   +2 more sources