Results 91 to 100 of about 27,052 (317)
This study presents a miniaturized bidirectional thermal stimulation system integrated with an electrode array enabling real‐time, bidirectional modulation and simultaneous recording of neural activity through localized heating and cooling. By monolithic integration of the Peltier element and with a silicon neural probe, the innovative system allows ...
Zoia Naumkina +6 more
wiley +1 more source
With the miniaturization of electronic packaging and devices, the size of solder joints in electronics is also decreasing from bulk solder joints to micro-bumps.
Shaobin Wang, Yao Yao, Xu Long
doaj +1 more source
Dynamic properties of solders and solder joints
The high strain rate mechanical properties have been measured for three types of solder: 63% Sn 37%Pb, 96.5Sn 3.5 Ag and 95.5Sn 3.8Ag 0.7Cu. Bulk properties were measured using a split Hopkinson pressure bar (SHPB) at strain rates from 500 to 3000 s -1 . A novel method has been designed and used to measure the shear strength of solder joints at low and
Siviour, C +5 more
openaire +2 more sources
Influence of Humidity on Voids Formation Inside the Solder Joint
Void is defined such as blow hole in the solder joint. Voids may degrade the mechanical and conductive properties of the solder joint and thus decrease the reliability. Article deals with influence of humidity on voids formation inside the solder joint
Žák, P. +4 more
core
Temporal Interference Stimulation Enhances Neural Regeneration
Temporal interference (TI) stimulation is proposed as a non‐invasive approach to enhance neural regeneration in the deep brain. Theta‐band TI modulation selectively promotes neural progenitor cell differentiation in vitro and augments hippocampal neurogenesis in amouse model of Alzheimer's disease‐like amyloidosis.
Sofia Peressotti +15 more
wiley +1 more source
The Solder Alloys Combination and Influence on Solder Joint Properties
Solder joints, solder alloys, low melting point solder aloys, solder joint mechanical strength, resistance of solder ...
Bedlivý, Michal
core
International audienceLow-cycle fatigue testing of a lead-free solder (InnoLot) based on Sn-3.8Ag-0.7Cu (SAC387) with three simultaneous additions of bismuth, nickel and antimony was conducted using miniature-sized fatigue specimens at different ...
Van Nhat Le +9 more
core +1 more source
A reconfigurable physical unclonable function is developed using CMOS‐integrated SOT‐MRAM chips, leveraging a dual‐pulse strategy and offering enhanced environmental robustness. A temperature‐compensation effect arising from the CMOS transistor and SOT‐MTJ is revealed and established as a key prerequisite for thermal resilience.
Min Wang +7 more
wiley +1 more source
Current technologies for spinal cord optogenetic stimulation rely on external power sources and face reliability constraints in freely behaving animals. Here, a fully implantable, battery‐powered optoelectronic device is introduced, enabling operation in any selected environment with wireless recharging for months‐long stimulation.
Shahriar Shalileh +8 more
wiley +1 more source
RANCANG BANGUN PENGONTROL SUHU SOLDER OVEN BERBASIS MIKROKONTROLER ATMEGA16
Abstrak Telah dilakukan penelitian rancang bangun pengontrol suhu solder oven berbasis mikrokontroler Atmega16 dengan sensor LM35DZ sebagai penyolder IC.
HASYIM, IBNU; RANCANG BANGUN PENGONTROL SUHU SOLDER OVEN BERBASIS MIKROKONTROLER ATMEGA16
core

