Results 121 to 130 of about 27,052 (317)
Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization [TK7870. R165 2007 f rb]. [PDF]
, 2007 Secara praktiknya kesemua pemasangan elektronik masa kini menggunakan pateri eutektik Sn-Pb pada antara penyambung. Akibat pertambahan penggunaan peranti elektronik dalam industri serta untuk kegunaan peribadi, maka penggunaan pateri penyambung juga ...
Mayappan, Ramani
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Self‐Adhesive Conductive Elastomers for Gel‐Free Biopotential Recording
Advanced Electronic Materials, EarlyView.σPOMaC, a self‐adhesive conductive citrate elastomer incorporating PEDOT:PSS and DBSA, enables gel‐free biopotential electrodes with stable conductivity and intrinsic skin adhesion. The composite exhibits low resistivity (∼ 0.02 Ω·cm), robust electrical performance during repeated use, and reliable on‐body ECG acquisition comparable to Ag/AgCl ...
Kirstie M. K. Queener +7 more
wiley +1 more source
Solder bump counts in different solder bump arrangements/ orientations.
, 2016 Solder bump counts in different solder bump arrangements/ orientations.
Z. L. Gan (3148722) +4 more
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Advanced Electronic Materials, EarlyView.Composite‐based flexible electronics integrate biodegradable polymers, conductive networks, and multilayer device architectures to balance electrical performance, mechanical durability, and controlled degradation. Interfacial engineering and encapsulation regulate transport stability and operational lifetime, while programmed disassembly enables ...
Sayam, Sangho Cho
wiley +1 more source
Jixie qiangdu, 2018 Based on ANSYS software established board level optical interconnect module finite element model,by means of the analysis of the model of the thermal-structure random vibration coupling,obtained the data of stress and strain under the coupling condition ...
HUA JianWei +4 more
doaj
Scientific ReportsThe effect of carbon fibers (Cf) and Ni nanoparticles addition on the melting point, microstructure, shear strength, indentation hardness and indentation creep of SnBi58/Cu solder joints were explored.
Xiangxia Kong +6 more
doaj +1 more source
Frontiers in MaterialsThe shear fatigue performance and fracture behavior of microscale ball grid array (BGA) structure Cu/Sn-3.0Ag-0.5Cu/Cu solder joints with different heights (500 μm, 300 μm, and 100 μm) with increasing current density (from 6.0 × 103 to 1.1 × 104 A/cm2 ...
Bo Wang +5 more
doaj +1 more source
Advanced Energy Materials, EarlyView.Organic photoelectrochemical cells based on π‐conjugated semiconductors offer a versatile platform for solar fuel generation. This review outlines operating principles, device architectures, and key metrics, and highlights advances in p‐ and n‐type photoelectrodes, interfacial engineering, and catalyst integration.
Jaehyeong Kim +8 more
wiley +1 more source
A review of extreme condition effects on solder joint reliability: Understanding failure mechanisms
Defence TechnologySolder joint, crucial component in electronic systems, face significant challenges when exposed to extreme conditions during applications. The solder joint reliability involving microstructure and mechanical properties will be affected by extreme ...
Norliza Ismail +4 more
doaj +1 more source
Automatic solder joint defect classification using the Log-Gabor filter
, 2010 This paper proposes the validity of a Gabor filter bank for feature extraction of solder joint images on Printed Circuit Boards (PCBs). A distance measure based on the Mahalanobis Cosine metric is also presented for classification of five different types
Yarlagadda, Prasad K. +2 more
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