Results 141 to 150 of about 27,052 (317)

Interfacial reaction of Cu/SAC105/Cu solder joints reinforced with Ti nanoparticles under vacuum thermo-compression bonding

open access: yesJournal of Materials Research and Technology
In this study, 0.3 wt% Ti nanoparticles (Ti NPs) were incorporated into Sn1.0Ag0.5Cu (SAC105) solder, and vacuum thermo-compression soldering was employed to fabricate two distinct solder joints: Cu/SAC105/Cu and Cu/SAC105-0.3Ti/Cu.
Chuanjiang Wu   +4 more
doaj   +1 more source

Effect of Solder Ball Geometry on Solder Joint Reliability under Solder Reflow Cooling Process

open access: yes, 2022
Solder joint reliability has become an increasingly important factor in electronic industries to obtain sustainable and reliable electronic packages. The simulation study of 3D finite elements on BGA test assembly models with geometries of SMD-NSMD and ...
Sujan Debnath   +5 more
core  

Performance assessment of a potential underground thermal storage facility: Case study of the closed mine Prosper‐Haniel in the Ruhr coal mining area in Germany

open access: yesDeep Underground Science and Engineering, EarlyView.
This study demonstrates the feasibility of an underground closed‐loop thermal storage facility at a post‐mining site, intended for seasonal heat energy storage. Its principal design shows water flow directions in winter and summer (1, 2), heat pumps (3), an upper water reservoir (4), and connecting pipes (5).
Dmytro Rudakov, Oleksandr Inkin
wiley   +1 more source

Thermal reaction of high power semiconductor laser with voids in solder layer

open access: yes, 2011
With the improvement of power, efficiency, reliability, manufacturability, and cost of high power semiconductor laser, many new applications are being enabled. Most of the semiconductor laser bars are packaged with the indium solder.
DingXiaochen   +8 more
core  

Unique deficits in place coding across subfields of the hippocampus in a mouse model of temporal lobe epilepsy

open access: yesEpilepsia, EarlyView.
Abstract Objective Memory problems are comorbid with temporal lobe epilepsy (TLE). Animal models of TLE reveal impairments in spatial firing fields of hippocampal place cells, providing a potential neural substrate for memory problems. Each subfield of the hippocampus carries out unique aspects of spatial memory, yet little is known about how ...
Brittney L. Boublil   +4 more
wiley   +1 more source

Solders and soldering for hybird technology.

open access: yesHYBRIDS, 1986
Okuya, Ken   +2 more
openaire   +2 more sources

Prenatal betamethasone–postnatal N‐methyl‐D‐aspartic acid model of spasms: Update on mechanisms and treatments

open access: yesEpilepsia Open, EarlyView.
Abstract Infantile epilepsy spasms syndrome (IESS), formerly known as infantile spasms or West Syndrome, is a severe epilepsy syndrome affecting about 3 in 10,000 newborns in the United States. Characterized by clusters of epileptic spasms, interictal hypsarrhythmia, and developmental delays, IESS has diverse causes, including structural‐metabolic ...
Kayla Vieira   +5 more
wiley   +1 more source

Experimental Study on the Effective Thermal Conductivity of 3D‐Printed PLA Annular Thermal Insulators With Different Infill Parameters

open access: yesMacromolecular Symposia, EarlyView.
ABSTRACT 3D‐printed parts have the potential to be used as low‐temperature thermal insulators in different applications where custom geometries and aesthetics are required. The present paper describes the experimental process for measuring the effective thermal conductivity of different 2D infill patterns and infill densities in 3D‐printed annular ...
Gabriel‐Dumitru Tcaciuc   +4 more
wiley   +1 more source

Characterization of Strain Rate-Dependent Behavior of 63Sn-37Pb Solder Using Split Hopkinson Torsional Bars (SHTB)

open access: yes, 2001
The present study is aimed at the experimental characterization of strain-rate dependent behaviour of solder materials under impulsive shear loading.
Lee SWR, 戴兰宏
core  

Ultrasound‐Assisted Epoxy Resin Curing Monitored by Impedance Spectroscopy

open access: yesPolymer Engineering &Science, EarlyView.
Ultrasound enhances epoxy cure rates via localized heating without altering cure kinetics. Impedance spectroscopy provides a direct, non‐destructive measure of cure progression, enabling accurate mapping of degree of cure in real time. ABSTRACT Epoxy resins are widely used in aerospace and automotive manufacturing as structural adhesives and matrices ...
Daniel Csehngeri   +2 more
wiley   +1 more source

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