Results 61 to 70 of about 27,052 (317)
Leaftronics: Bio‐Fractal Scaffolds From Leaf Venation for Low‐Waste Electronics
Advanced Materials, EarlyView.“Leaftronics” transforms naturally evolved leaf venation into quasi‐fractal scaffolds for sustainable electronics. Polymer‐infiltrated leaf skeletons can be used to fabricate ultra‐smooth, reflow‐ and thin‐film‐compatible decomposable substrates, while making the same lignocellulose networks conducting results in flexible transparent electrodes.
Rakesh Rajendran Nair +3 more
wiley +1 more source
Thermal modelling and optimisation of hot solder dip process
, 2012 The use of electronic components with coated leadfree solder terminations in high reliability and safety products and equipment has risks for their long-term reliability caused by tin-wicker growth phenomena.
Roulston, John +13 more
core +1 more source
Advanced Materials, EarlyView.Mechanically origami‐coded 3D kirigami photovoltaics convert a single extension–release cycle into deterministic self‐folding, reconfiguring planar solar cells into programmable 3D modules. Distinct coding strategies enable either ultrahigh stretchability (500% system strain) or ultrahigh initial effective areal coverage (225%).
Seok Joon Hwang +15 more
wiley +1 more source
STUDY ON CHIP COMPONENT NO-FILLET SOLDER JOINT STRESS AND STRAIN UNDER THERMAL CYCLE
Jixie qiangdu, 2016 The chip component no-fillet solder joints finite element analysis models were set up. The influences of pad length,pad width,solder joint volume and solder joint material on the stress and strain distribution on no-fillet solder joints were analyzed ...
LIN XunChao, LIANG Ying
doaj
Lead Halide Perovskite Photoelectrocatalysis
Advanced Materials, EarlyView.Lead halide perovskite semiconductors have emerged as highly promising materials for solar fuel and chemical synthesis. This perspective discusses advances made in the rational photoelectrode design to improve solar‐to‐chemical conversion, product scope, and scalability.
Virgil Andrei
wiley +1 more source
The Performance of Resistance to Hot and Cold Cycle of A New Lead-Free Solder Paste
Journal of Harbin University of Science and Technology, 2018 The performance of resistance to hot and cold cycle of a new low silver solder paste SnAgCuBiNi (SACBN07) and SAC305 solder paste on the market were compared and analyzed.
ZHANG Qi, SUN Feng-lian
doaj +1 more source
Advances in Magnesium‐Based Thermoelectrics: A Critical Review
Advanced Materials, EarlyView.Magnesium‐based thermoelectric materials have emerged as promising candidates for low‐to‐mid‐temperature energy conversion due to their abundance, low cost, and competitive performance. This review summarizes recent advances in Mg3X2, MgAgSb, and Mg2X systems, covering transport mechanisms, fabrication strategies, stability challenges, and device ...
Li‐Min Zhang +5 more
wiley +1 more source
Microstructural Evolution of Low-Temperature Solder Joints
, 2022 Lead-free solder development is critical for semiconductor package. The properties of solder determine the process temperature and joint strength. SnAgCu and SnAg are the leading lead-free solder.
Tseng, T.T.;Wu, G.W.;Liang, H.T.;Wang, Y.W.
core
Advanced Materials, EarlyView.Ultrathin lithium metal anodes (≤15 µm) offer a promising route to high‐energy‐density batteries due to their high capacity and low potential. This review presents design principles for ultrathin Li, evaluates fabrication strategies, and discusses challenges in liquid and solid‐state cells.
Cheng Wang +9 more
wiley +1 more source
Weaving Intelligence: Thermally Drawn Multimaterial Fibers Toward AI‐Enabled Smart Textiles
Advanced Materials, EarlyView.Thermally drawn multimaterial fibers are rapidly advancing as intelligent structural units for next‐generation smart textiles. Integrating multimaterial architectures with neuromorphic and spiking‐neural‐network principles enables fabrics that can sense, compute, and adapt autonomously.
Vuong Dinh Trung +9 more
wiley +1 more source