Results 31 to 40 of about 27,052 (317)
Implicit integration scheme for porous viscoplastic potential-based constitutive equations [PDF]
, 2011 This paper deals with a viscoplastic potential-based model allowing thermomechanical damage behavior modeling of porous materials. The model describes rate dependent effects, hardening, creep as well as defects coalescence and propagation.
Msolli, S. +11 more
core +1 more source
Journal of Materials Research and TechnologyWith the continuous advancement of integrated packaging technology, the dimensions of Sn-based interconnected joints are being steadily reduced. It is necessary to investigate the dependability of Sn-based solder joints with various size since the change
Sijin Li +7 more
doaj +1 more source
Quantitative evaluation of voids in lead free solder joints
, 2015 Voiding in solder joints poses a serious reliability concern for electronic products. The aim of this research was to quantify the void formation in lead-free solder joints through X-ray inspections.
Takyi, Gabriel +2 more
core +1 more source
Crystals, 2022 The Sn–Bi solder paste is commonly used in electronic assembly and packaging, but its brittleness causes poor reliability in shock environments. In this study, the mechanical reliability of Sn–Bi solder paste and Sn–Bi composite solder paste with ...
Lu Liu +3 more
doaj +1 more source
Hot‐Film and Calorimetric Methods With Transient Heating for Measurement of High Biofluid Flow Rate
Advanced Functional Materials, EarlyView.Accurate measurement of biofluid flow rate is vital for clinical diagnostics. We propose a transient heating strategy using short thermal pulses and peak temperature tracking to enhance the flow sensitivity of the hot‐Film and calorimetric methods. Simulations show how optimal heating time maximizes sensitivity across flow rates.
Yuanting Wei +8 more
wiley +1 more source
Solderability of Solder-Coated Surfaces.
Circuit Technology, 1993 表面実装における微細パターン化に伴い, プリント配線板の前処理であるソルダコート (予備はんだ被膜) の薄膜化が要求されている。しかし, 薄いソルダコート表面では, はんだペーストとの濡れ性低下が問題となる。そこで, メニスコグラフ濡れ性試験, オージェ分光分析, X線マイクロアナライザにより, 薄いソルダコート表面でのはんだ濡れ性低下のメカニズムの解明と, 薄いソルダコート用はんだ材料について検討した。その結果以下のことが明らかとなった。母材からのCuの拡散によってCu-はんだ界面に生成するCu-Sn金属間化合物ははんだ表面まで成長し, 表面に露出した化合物中の過剰なCuが酸化することによって, 薄いソルダコート表面でのはんだ濡れ性が低下する。ソルダコート用共晶はんだ浴に0.3wt%のCu添加は,
SAKUYAMA, Seiki +3 more
openaire +2 more sources
Effect Of Lead-free Solder And Gold Content On The Shear Strength, Toughness, IMC And Void Formation [TT267. C518 2004 f rb Kejuruteraan] [Microfiche 7715]. [PDF]
, 2004 Study of interaction between lead free solder with gold and the mechanical toughness,shear strength of solder that associated with intermetallic compound IMC and void formation was carried out.
Oo, Cheng Ee
core
Advanced Functional Materials, EarlyView.We present a tissue‐stimulator platform for seamless electrode integration with pancreatic tissue, applying uniform electrical stimulation through optimized design with biohybrid 3D printing. Advantageous effects of electrical stimulation on β‐cell function were observed, including enhanced calcium signaling, islet morphology, and maturation.
Jihwan Kim +7 more
wiley +1 more source
Investigations On The Properties Of Sn-8zn-3Bi Lead-Free And Sn-37Pb Eutectic Solder Alloys [TS610. D928 2005 f rb] [Microfiche 8175]. [PDF]
, 2005 Sifat-sifat logam pateri bebas plumbum Sn-8Zn-3Bi dan logam pateri eutektik Sn-37Pb yang bersentuhan dengan substrak kuprum telah dikaji. Properties of Sn-8Zn-3Bi lead-free solder and Sn-37Pb eutectic solder in contact with copper substrates have been
Duong, Ngoc Binh
core
Machine Learning‐Assisted Inverse Design of Soft and Multifunctional Hybrid Liquid Metal Composites
Advanced Functional Materials, EarlyView.A machine learning framework is presented for inverse design of synthesizable multifunctional composites containing both liquid metal and solid inclusions. By integrating physics‐based modeling, data‐driven prediction, and Bayesian optimization, the approach enables intelligent design of experiments to identify optimal compositions and realize these ...
Lijun Zhou +5 more
wiley +1 more source