Results 21 to 30 of about 8,512 (299)
ZINC MICRO-ALLOYING ADDITIONS IN Sn-0.7Cu LEAD-FREE SOLDER ALLOYS. SHORT REVIEW [PDF]
European Journal of Materials Science and Engineering, 2017 Sn-Pb solder alloy has been replaced with lead-free solder alloys due to the negative effect for environment and human health. The additions of Zinc (Zn) micro-alloying element in Sn0.7Cu lead-free solder alloy were reported by several researchers in ...
Intan Nashasha Amira IBRAHIM +1 more
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Investigation Of Intermetallic Compounds In Sn-Cu-Ni Lead-Free Solders
Archives of Metallurgy and Materials, 2015 Interfacial intermetallic compounds (IMC) play an important role in Sn-Cu lead-free soldering. The size and morphology of the intermetallic compounds formed between the lead-free solder and the Cu substrate have a significant effect on the mechanical ...
Nagy E. +3 more
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Effect of Nanoparticles Addition on the Microstructure and Properties of Lead-Free Solders: A Review
Applied Sciences, 2019 With the development of microelectronic packaging and increasingly specific service environment of solder joints, much stricter requirements have been placed on the properties of lead-free solders. On account of small size effect and high surface energy,
Peng Zhang +5 more
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Science and Engineering of Composite Materials, 2013 In this work, contact angle, spreading area, and isothermal aging tests were conducted to study the difference between Sn-3Ag-0.5Cu lead-free solder and its composite solder at different multiwalled carbon nanotube reinforcement volume fractions.
Huang Her-Yueh +2 more
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Creep-fatigue life evaluation of Sn-3.5Ag lead-free solder at low temperatures
Mechanical Engineering Journal, 2016 This paper describes creep-fatigue lives of Sn-3.5Ag lead-free solder at low temperatures. Since solders have lower melting temperature and electronic devices are often used at low temperature environment, it is effective for improving the fatigue life ...
Noritake HIYOSHI
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Crystals, 2022 The mechanical and fatigue properties of microelectronic interconnection materials are important issues in critical applications in the life of electronic assemblies.
Raed Al Athamneh +3 more
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Segmentation of Images of Lead Free Solder [PDF]
, 2010 We present two approaches to segment metallic phases in images of lead free solder joints. We compare the results of a method without user interaction with another one extrapolating information from a relatively small set of user labeled pixels. The segmented images provide statistical data of spatial characteristics of phases to serve as input in ...
Matthias Scheller Lichtenauer +2 more
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Quantitative evaluation of voids in lead free solder joints
, 2015 Voiding in solder joints poses a serious reliability concern for electronic products. The aim of this research was to quantify the void formation in lead-free solder joints through X-ray inspections.
Takyi, Gabriel +2 more
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International Journal for Simulation and Multidisciplinary Design Optimization, 2019 As a result of the ban of lead from solder joints, many lead-free solder joints were developed. Most of the electronic equipment is subjected to random vibration.
Jayesh S., Elias J.
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Size-dependent thermodynamic description of the binary Pb-Sn system [PDF]
Journal of Mining and Metallurgy. Section B: Metallurgy, 2017 Recently, a new thermodynamic description of the binary Pb - Sn system was proposed and it seems to be interesting to extend this description on the system, where size of particles plays a key-role.
Gierlotka W.
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