Results 41 to 50 of about 6,013,042 (268)

NeuroVisio SyncPatch: A Skin‐Conformal Multimodal EMG–Motion Sensing Platform for Quantitative Neuromuscular Rehabilitation and Performance Monitoring

open access: yesAdvanced Healthcare Materials, EarlyView.
NeuroVisio SyncPatch integrates skin‐conformal electromyography (EMG) electrodes with camera‐tracked markers to jointly assess muscle activity and three‐dimensional knee kinematics during rehabilitation. Parallel feedback pathways provide real‐time kinematic guidance during movement and post‐trial neuromuscular feedback.
Bohyung Choi   +11 more
wiley   +1 more source

Development and Characterization of Nano-Composite Solder

open access: yes, 2012
\ua9 2012 John Wiley & Sons, Ltd. Published 2012 by John Wiley & Sons, Ltd. Lead-free solder and its soldering processing has been well developed and applied in the electronics industry as an interconnection material to replace Sn37Pb solder. However,
Liu, Johan,   +8 more
core   +1 more source

Stretchable Microelectrode Arrays for Electro‐Mechanical Probing of Brain Spheroids

open access: yesAdvanced Healthcare Materials, EarlyView.
A multimodal device featuring kirigami‐patterned stretchable microelectrode arrays enables concurrent mechanical actuation and electrophysiological recording of brain spheroids. The platform supports multiple loading regimes and reveals mechanically induced modulation of spontaneous network activity in 3D neural tissue models.
Eleonora Martinelli   +17 more
wiley   +1 more source

Investigation of Electrochemical Migration of Tin and Tin-Based Lead-Free Solder Alloys under Chloride-Containing Thin Electrolyte Layers

open access: yesInternational Journal of Electrochemical Science, 2018
The electrochemical migration behaviors of pure tin and tin-based lead-free solder alloys under thin electrolyte layers containing chloride ions were investigated.
Shuyi Jiang   +3 more
doaj   +1 more source

Leaftronics: Bio‐Fractal Scaffolds From Leaf Venation for Low‐Waste Electronics

open access: yesAdvanced Materials, EarlyView.
“Leaftronics” transforms naturally evolved leaf venation into quasi‐fractal scaffolds for sustainable electronics. Polymer‐infiltrated leaf skeletons can be used to fabricate ultra‐smooth, reflow‐ and thin‐film‐compatible decomposable substrates, while making the same lignocellulose networks conducting results in flexible transparent electrodes.
Rakesh Rajendran Nair   +3 more
wiley   +1 more source

Highlights of a EC funded project on Lead-free Materials and Assembly Development Technology

open access: yes, 2022
The EC has financially supported a pan-European collaboration on the development of lead-free interconnection materials and use of these materials for electronic assembly in a wide variety of industrial applications. The project started in April 2002 and
Vanfleteren, J.   +3 more
core   +1 more source

Radiative Thermal Management for Extreme Environments: Mechanisms and Design Strategies

open access: yesAdvanced Materials, EarlyView.
In this review, we discuss the fundamental mechanisms of radiative cooling and solar heating, material and structural design strategies, hybrid approaches integrating additional heat transfer pathways, and durability‐oriented designs addressing environmental stresses.
Hyung Rae Kim   +5 more
wiley   +1 more source

The Effect of Eutectic Structure on the Creep Properties of Sn-3.0Ag-0.5Cu and Sn-8.0Sb-3.0Ag Solders

open access: yesMetals, 2017
Solder joints are the main weak points of power modules used in harsh environments. For the power module of electric vehicles, the maximum operating temperature of a chip can reach 175 °C under driving conditions.
Yujin Park   +4 more
doaj   +1 more source

EFFECT ON MICROSTRUCTURAL AND PHYSICAL PROPERTIES OF Sn-3.0Ag-0.5Cu LEAD-FREE SOLDER WITH THE ADDITION OF SiC PARTICLES [PDF]

open access: yesEuropean Journal of Materials Science and Engineering, 2019
The Lead-free solder has been subject of concentrated research activity over the past era, but it is hard to meet the characterization and mechanical properties of Sn-Pb solder.
Zawawi MAHIM   +2 more
doaj   +1 more source

Microfabrication of Soft Millirobots Propelled by Low Voltage Electrohydraulic Actuators

open access: yesAdvanced Materials Technologies, EarlyView.
Manual layer‐by‐layer assembly is replaced by wafer‐level MEMS batch fabrication for compliant polymer‐based electrohydraulic actuators. The microfabricated devices integrate sacrificially defined microcavities, Parylene‐C‐sealed inlets, and multilayer polymer–metal films.
Shai Shmulevich   +2 more
wiley   +1 more source

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