Results 61 to 70 of about 8,512 (299)

Comparisons of Mechanical Properties of sub-mm Lead Based and Lead Free Based Solder Using in Manufacturing of Printed Circuits

Al-Khawarizmi Engineering Journal, 2017
This study investigates the mechanical compression properties of tin-lead and lead-free alloy spherical balls, using more than 500 samples to identify statistical variability in the properties in each alloy. Isothermal aging was done to study and compare
Alaa Hasan Ali
doaj  

End‐to‐End Sensing Systems for Breast Cancer: From Wearables for Early Detection to Lab‐Based Diagnosis Chips

Advanced Materials Technologies, EarlyView.
This review explores advances in wearable and lab‐on‐chip technologies for breast cancer detection. Covering tactile, thermal, ultrasound, microwave, electrical impedance tomography, electrochemical, microelectromechanical, and optical systems, it highlights innovations in flexible electronics, nanomaterials, and machine learning.
Neshika Wijewardhane, Lyn I. Jones, Richard M. Martin, Helen Winter, Faezeh Arab Hassani   +4 more
wiley   +1 more source

Finite element comparative study on creep and random vibrations of solder joints in BGA package

Power Electronic Devices and Components
As the demand for increasing miniaturisation and functionality of electronic devices soars, understanding the creep and random vibration of solder joints (SJs) in BGA packages in devices is critical to achieving high device reliability.
Joshua A. Depiver, Sabuj Mallik, Emeka H. Amalu   +2 more
doaj   +1 more source

Microstructure and Thermal Analysis of Lead-Free Solder for Environmentally friendly Electronics [PDF]

BIO Web of Conferences
The transition from traditional Sn-Pb solders to lead-free alternatives has become a critical challenge in the electronics industry due to environmental and health concerns.
Nugroho Aris Widyo, Wiguna Andika, Rojabudin Yogy Dony, Marjianto Muhammad Tri, Rahman Muhammad Budi Nur, Ngafwan Ngafwan, Jamir Mohd Ridzuan Mohd, Suwanda Totok   +7 more
doaj   +1 more source

Experimental and mechanical characterizations of a lead free solder alloy for electronic devices [PDF]

, 2012
Electronic power modules devices are paramount components in the aeronautical,automotive and military applications. The solder layers are the most critical parts of the module and are usually subjected in their whole life to complex loading conditions ...
Msolli, Sabeur, Karama, Moussa, Alexis, Joël, Dalverny, Olivier   +3 more
core   +1 more source

Mechanical Fatigue in Liquid‐Metal Interconnects: Failure Mechanism Analysis and Validation of Improvement Strategies

Advanced Materials Technologies, EarlyView.
Multi‐million cycle reliability for liquid metal stretchable electronics is achieved through a continuous cycle of mechanical testing, failure mode and mechanism analysis and implementing subsequent mitigation strategies. ABSTRACT Stretchable electronics that combine mechanical compliance with reliable electrical performance are essential for ...
Lennert Purnal, Maximilian Krack, Parth Vinayakrao Sewlikar, Bart Ruttens, Tom Hauffman, Iris De Graeve, Wim Deferme, Michaël Daenen, Monika Rai   +8 more
wiley   +1 more source

Self‐Soldering, Stretchable and Self‐Healing Liquid Metal Elastomer Interconnections for Soft Electronics Platforms

Advanced Materials Technologies, EarlyView.
A self‐healing and electrically conductive liquid metal elastomer enables robust self‐soldering of surface mount devices for soft electronics. Photothermally activated conductive pathways, strong pressure‐sensitive adhesion, and stable package‐integrated contacts provide high conductivity and extreme stretchability.
Su Thiri San, Ahmed Albeltagi, Mikko Nelo, Jari Juuti, Jarkko Tolvanen, Jari Hannu   +5 more
wiley   +1 more source

Surface Morphology Study of Nanostructured Lead-Free Solder Alloy Sn-Ag-Cu Developed by Electrodeposition: Effect of Current Density Investigation

International Journal of Science and Engineering, 2013
Nanostructured lead-free solder Sn-Ag-Cu (SAC) was developed by electrodeposition method at room temperature. Electrolite bath which comprised of the predetermined quantity of tin methane sulfonate, copper sulfate and silver sulfate were added ...
Sakinah Mohd Yusof, Abdul Hadi, Junaidah Jai   +2 more
doaj   +1 more source

Thermomechanical properties and fatigue life evaluation of SnAgCu solder joints for microelectronic power module application

Journal of Materials Research and Technology, 2020
In this paper, a new constitutive model of SnAgCu lead-free solder, which covered the low-temperature and elevated-temperature creep properties, was constructed according to the thermomechanical property test under a wide range of temperatures (−40 to ...
Xiaoguang Huang, Zhiqiang Wang, Yanqun Yu   +2 more
doaj   +1 more source

Optimization On Laser Soldering Parameters Onto Lead-Free Solder Joint [PDF]

, 2017
This paper presents the results of optimization on laser soldering parameters onto lead free solder joint. The objective of this study is to determine the laser power needed and scanning time required to produce a high quality of solder joint.
M., Ishak, Siti Rabiatull Aisha, Idris, T. J., Nabila   +2 more
core   +1 more source