Results 61 to 70 of about 6,013,042 (268)

Bamboo‐Slip‐Inspired Conformal Reconfigurable Metasurfaces

Advanced Science, EarlyView.
Bamboo‐slip‐inspired conformal reconfigurable metasurface system. The structure is mainly composed of three parts, which are conformal metasurface, pattern reconfigurable antenna, and control components (such as Field Programmable Gate Array (FPGA)). Conformal metasurfaces draw inspiration from the design of ancient Chinese bamboo slips.
Qifan Li, Shaofeng Zhang, Qiang Feng, Dexiao Xia, Yajie Mu, Xiangjin Ma, Jiaqi Han, Haixia Liu, Guangyao Liu, Long Li   +9 more
wiley   +1 more source

FP5-CSG-IMECAT - Highlight of a EC funded project on lead-free materials and assembly development technology

, 2022
The EC has financially supported a pan-European collaboration on the development of lead-free interconnection materials and use of these materials for electronic assembly in a wide variety of industrial applications. The project started in April 2002 and
Vanfleteren, J., Vandevelde, B., Manessis, D., Gonzales, M.   +3 more
core   +1 more source

Comparisons of Mechanical Properties of sub-mm Lead Based and Lead Free Based Solder Using in Manufacturing of Printed Circuits

Al-Khawarizmi Engineering Journal, 2017
This study investigates the mechanical compression properties of tin-lead and lead-free alloy spherical balls, using more than 500 samples to identify statistical variability in the properties in each alloy. Isothermal aging was done to study and compare
Alaa Hasan Ali
doaj  

Lead Free BGAs Soldered with SnPb36Ag2 Solder

MATERIALS TRANSACTIONS, 2015
Electronic components shrink in their dimensions due to space restrictions on electronic printed circuit boards (PCB). This is only possible on a limited scale for integrated circuits. Their number of connectors increases due to the growing complexity of the semiconductors.
Grossmann, Günter, Nicoletti, Giovanni
openaire   +3 more sources

Synergistic Grain Boundary and Phonon Engineering Enables Ultrahigh Thermoelectric Performance in Mg3(Sb, Bi)2‐Based Materials

Advanced Science, EarlyView.
Ta encapsulated melting and Cu doping synergistically engineer grain boundaries and phonon scattering in Mg3(Sb,Bi)2, enabling single‐crystal‐like carrier transport and high thermoelectric performance. ABSTRACT Thermoelectric Mg3(Sb, Bi)2 has emerged as a rising star in virtue of its promising thermoelectric performance and abundant constituent ...
Jingdan Lei, Kai Xu, Kunpeng Zhao, Junzhuo Zhou, Haotian Gao, Yifan Yuan, Tian‐Ran Wei, Min Zhu, Qihao Zhang, Franck Gascoin, Xun Shi   +10 more
wiley   +1 more source

Finite element comparative study on creep and random vibrations of solder joints in BGA package

Power Electronic Devices and Components
As the demand for increasing miniaturisation and functionality of electronic devices soars, understanding the creep and random vibration of solder joints (SJs) in BGA packages in devices is critical to achieving high device reliability.
Joshua A. Depiver, Sabuj Mallik, Emeka H. Amalu   +2 more
doaj   +1 more source

Microstructure and Thermal Analysis of Lead-Free Solder for Environmentally friendly Electronics [PDF]

BIO Web of Conferences
The transition from traditional Sn-Pb solders to lead-free alternatives has become a critical challenge in the electronics industry due to environmental and health concerns.
Nugroho Aris Widyo, Wiguna Andika, Rojabudin Yogy Dony, Marjianto Muhammad Tri, Rahman Muhammad Budi Nur, Ngafwan Ngafwan, Jamir Mohd Ridzuan Mohd, Suwanda Totok   +7 more
doaj   +1 more source

Supercapacitor Safety: Overcharge‐Induced Failure Mechanisms in Electrochemical Double‐Layer Capacitors

Advanced Science, EarlyView.
Time‐resolved synchrotron radiography reveals the internal evolution of electrochemical double‐layer capacitors under abusive overcharge. EDLCs are shown to follow a thermally driven failure pathway involving electrolyte decomposition, gas generation, and structural collapse, distinct from chemically driven thermal runaway effects of Lithium‐ion ...
Thomas Dore, Inez Kesuma, Abdus S. Ali, Jonas Pfaff, Yuxiao Jin, Rosalie Hamill, Mark Buckwell, Hamish Reid, Thomas Finco, Zeyu Sun, Yuanze Li, Sebastian Schopferer, Siegfried Nau, Nils Böttcher, Henning Markötter, Alexander J. E. Rettie, James Robinson, Paul R. Shearing, Alexander Rack, Thomas S. Miller   +19 more
wiley   +1 more source

Adaptive Conductive Systems: Enabling Deformable Electronics Through Engineered Materials, Circuits, and Intelligent Systems

Advanced Science, EarlyView.
This review presents the research advances of adaptive conductive systems from the perspective of materials, circuits, systems, and applications. Deformable conductors consist of substrates/matrices and conductive materials, structural design of circuit interconnections, fabrication of circuit interconnections, as well as intelligent systems ...
Yufei Lu, Siyu Liang, Jingyi Niu, Jie Chen, Shuo Zhang, Hongjian Zhang, Dongsheng Jia, Wei Huang   +7 more
wiley   +1 more source

Surface Morphology Study of Nanostructured Lead-Free Solder Alloy Sn-Ag-Cu Developed by Electrodeposition: Effect of Current Density Investigation

International Journal of Science and Engineering, 2013
Nanostructured lead-free solder Sn-Ag-Cu (SAC) was developed by electrodeposition method at room temperature. Electrolite bath which comprised of the predetermined quantity of tin methane sulfonate, copper sulfate and silver sulfate were added ...
Sakinah Mohd Yusof, Abdul Hadi, Junaidah Jai   +2 more
doaj   +1 more source