Results 81 to 90 of about 8,512 (299)
Improvement in Thermomechanical Reliability of Low Cost Sn-Based BGA Interconnects by Cr Addition
Metals, 2018 The exemption of Pb-bearing automobile electronics in the End of Life Vehicle (ELV) directive has recently expired, bring an urgent need to find Pb-free alloys that can maintain good performance under high-temperature and vibration conditions for ...
Junghwan Bang +6 more
doaj +1 more source
Advanced Science, EarlyView.A novel near‐infrared‐II fluorescent imaging capsule endoscope that detects specific fluorescence signals above 900 nm enables highly sensitive, targeted imaging of gastrointestinal cancer tissue. This wirelessly powered and magnetically controlled “smart pill” achieves high sensitivity and deep tissue penetration, allowing precise, non‐invasive ...
Weicheng Wang +10 more
wiley +1 more source
Investigation of Mixed Solder Assemblies & Novel Lead-free Solder Alloys
, 2011 Due to the introduction of Restriction of Hazardous Substances (RoHS) directive Pb containing solders have been banned from the electronics industry and a reliable replacement for the Sn-Pb solder is being sought for by industry around the globe. Medical
Kaila, Rishi
core +1 more source
Stress‐to‐Light Conversion in an Earth‐Abundant Oxide Semiconductor
Advanced Science, EarlyView.Stress‐to‐light conversion in solids represents a unique photonic functionality, yet it has never been realized in a chemically simple and sustainable material. Here, we show that sustainable semiconductor ZnO exhibits strong near‐infrared (NIR) luminescence under elastic stress when defect‐engineered to stabilize the p‐type state.
Tomoki Uchiyama +7 more
wiley +1 more source
Effects of Bi and In Addition on Microstructure and Properties of Sn-0.7Cu Solder
MetalsWith the widespread application of lead-free solder, solder represented by the SAC series has been widely used. However, with the miniaturization and multifunctionalization of electronic devices, the distance between solder joints is becoming ...
Xiaochun Lv +5 more
doaj +1 more source
Metal deposited nanoparticles as "bridge materials" for lead-free solder nanocomposites. [PDF]
Appl Nanosci, 2023 Plevachuk Y +6 more
europepmc +1 more source
Intermetallic compound growth mechanism of hybrid nanocomposite lead-free solder
, 2021 The lead-free SAC nanocomposite solder alloy was prepared by mechanically dispersing 0.25, 0.50, 0.75, and 1.0 wt% of TiO2 and Al2O3 nanoparticles into the lead-free SAC solder alloy.
Mhd Noor, Ervina Efzan +2 more
core
Electrochemical migration of lead free solder joints
, 2022 S.229-241Electrochemical migration (ECM) tests on lead bearing and lead free solder joints on Cu lamination on FR-4 board were conducted by applying constant voltage.
Schmitt, E., Jillek, W., Yu, D.Q.
core +1 more source
Electrohydraulic Folding Ring Actuators for Radially Contracting Applications
Advanced Science, EarlyView.This work presents an Electrohydraulic Folding Ring Actuator that combines high‐performance electrohydraulic actuation with origami‐inspired folding geometry to achieve constricting radial actuation. This integration yields significant inner lumen constriction, alongside a gripping force capable of holding objects exceeding four times the actuator's ...
Gavril Yong En Tan +4 more
wiley +1 more source
Acetic acid mediated leaching of metals from lead-free solders
Bioresources and Bioprocessing, 2017 Background The replacement of lead (Pb)-bearing solders by several Pb-free solders is a subject of intense research in these days due to the toxic effects of Pb on the environment.
U. Jadhav +3 more
doaj +1 more source