Results 81 to 90 of about 6,013,042 (268)
Use of Sn91Zn9 Lead-Free Solder in Resistance Element Soldering Technology
MetalsResistance Element Soldering (RES) is one of the new methods of joining dissimilar materials by resistance heating using an element. Sn60Pb40 solder, which has been used for decades in tin smithing and the electrical industry, has already been tested for
Pavol Sejč +3 more
doaj +1 more source
Improvement in Thermomechanical Reliability of Low Cost Sn-Based BGA Interconnects by Cr Addition
Metals, 2018 The exemption of Pb-bearing automobile electronics in the End of Life Vehicle (ELV) directive has recently expired, bring an urgent need to find Pb-free alloys that can maintain good performance under high-temperature and vibration conditions for ...
Junghwan Bang +6 more
doaj +1 more source
A Full Physical Strategy for Electrical Contacts on Laser‐Induced Graphene (LIG) Electrodes
Advanced Electronic Materials, EarlyView.A fully dry fabrication strategy combining PVD and dual‐laser processing enables direct integration of laser‐induced graphene with metallic current collectors. Ultralow Au‐LIG contact resistance is achieved without binders, adhesives, or chemical treatments, while preserving electrochemical performance.
Davide Arcoraci +9 more
wiley +1 more source
Thermomechanical Stress of Lead Free Solder Joint
, 2011 This diploma thesis deals with the reliability of lead-free solder joints at a different interconnection structures. The first goal is to design the test cases shape BGA (FC) for testing the strength of lead-free solder joints at shear test in link with ...
Libich, Jiří
core +2 more sources
Metal deposited nanoparticles as "bridge materials" for lead-free solder nanocomposites. [PDF]
Appl Nanosci, 2023 Plevachuk Y +6 more
europepmc +1 more source
Advanced Electronic Materials, EarlyView.A compact resistively loaded metamaterial absorber captures RF energy at 2.4 GHz and directs most of the accepted power to modeled loads. The resonant response is confirmed experimentally for the fabricated absorber, while an impedance‐matched rectifier is evaluated through simulation. The stage‐wise results distinguish absorber, rectifier, and cascade
Md. Murad Kabir Nipun, Md. Jahedul Islam
wiley +1 more source
, 2013 Microelectronics failure during operation is commonly attributed to ineffective heat management within the system. Hence, reliability of such devices becomes a challenge area.
Bhatti, Raj +5 more
core +1 more source
Effects of Bi and In Addition on Microstructure and Properties of Sn-0.7Cu Solder
MetalsWith the widespread application of lead-free solder, solder represented by the SAC series has been widely used. However, with the miniaturization and multifunctionalization of electronic devices, the distance between solder joints is becoming ...
Xiaochun Lv +5 more
doaj +1 more source
Harnessing the VO2 Phase Transition for Automatic Gain Control in Transimpedance Amplifiers
Advanced Electronic Materials, EarlyView.A nanoscale VO2‐based volatile switch integrated into a transimpedance‐amplifier feedback loop dynamically lowers gain when input current rises, preventing saturation and extending dynamic range. Rapid self‐recovery restores high sensitivity without external reset circuitry.
Amir Gildor +3 more
wiley +1 more source
Advanced Intelligent Discovery, EarlyView.This article implements a unified human digital twin framework that integrates cutting edge actuation, sensing, simulation, and bidirectional feedback capability. The approach includes integrating multimodal sensing, AI, and biomechanical simulation into one compact system.
Tajbeed Ahmed Chowdhury +4 more
wiley +1 more source