Results 91 to 100 of about 8,512 (299)

A Supramolecular Reversible and Anisotropic Conductive Adhesive for Flexible Electronics

Advanced Science, EarlyView.
Supramolecular network‐based nanocomposites are developed as a stretchable conductive adhesive for flexible electronics. It's as convenient as traditional solders and constructs anisotropic conductive and robust stretchable connections among diverse soft/rigid materials.
Tongtong Li, Yahui Zhao, Ying Zhang, Yuquan Li, Xuan Ye, Hongyun Qiu, Zhaorui Zhang, Jiang‐Fei Xu, Shaobo Ji   +8 more
wiley   +1 more source

Electrochemical Migration on Lead-Free Soldering of PCBs

Journal of Integrated Circuits and Systems, 2009
It is well known that in printed circuits boards assembled by SMT technology may occur Electrochemical Migration (ECM). This phenomenon appears mainly because the new packaging has the terminals very close. Also the Electrochemical Migration may become a potential reliability problem in electronic soldering when lead free technology is used in ...
Luiz T. Freire Mendes, Valtemar F. Cardoso, Ana Neilde R. Da Silva   +2 more
openaire   +2 more sources

Temperature-dependent fatigue modelling of a novel Ni, Bi and Sb containing Sn-3.8Ag-0.7Cu lead-free solder alloy

, 2020
International audienceLow-cycle fatigue testing of a lead-free solder (InnoLot) based on Sn-3.8Ag-0.7Cu (SAC387) with three simultaneous additions of bismuth, nickel and antimony was conducted using miniature-sized fatigue specimens at different ...
Van Nhat Le, Tao, Quangbang, Ngoc Anh Thi Nguyen, Nguyen, Ngoc Anh Thi, Hung Nguyen‐Xuan, L. Benabou, Nguyen-Xuan, Hung, Benabou, Lahouari, Le, van Nhat, Q.B. Tao   +9 more
core   +1 more source

Multifaceted Roles of Tantalum in Promoting the Thermoelectric Performance of Mg3(Sb,Bi)2 Based Materials

Advanced Science, EarlyView.
A multifunctional tantalum incorporation strategy enables simultaneous tuning of carrier concentration, mitigation of grain‐boundary scattering, and enhanced phonon scattering in Mg3(Sb,Bi)2. These synergistic effects markedly improve carrier mobility and suppress lattice thermal conductivity, yielding both high material zT and high module conversion ...
Guangmeng You, Jingdan Lei, Kai Xu, Yuntian Fu, Xueke Gu, Chengxiao Peng, Zhen Wang, Jing Chen, Kunpeng Zhao, Chao Wang   +9 more
wiley   +1 more source

An Introductory Overview of Various Typical Lead-Free Solders for TSV Technology

Inorganics
As semiconductor packaging technologies face limitations, through-silicon via (TSV) technology has emerged as a key solution to extending Moore’s law by achieving high-density, high-performance microelectronics.
Sooyong Choi, Sooman Lim, Muhamad Mukhzani Muhamad Hanifah, Paolo Matteini, Wan Yusmawati Wan Yusoff, Byungil Hwang   +5 more
doaj   +1 more source

Nanoindentation of Lead Free Solders for Harsh Environments

MRS Proceedings, 2008
ABSTRACTTo better understand the factors governing the reliability of lead free solders during severe excursions in temperature, the hardness and elastic modulus of the micro-phases formed in a Sn-Ag-Cu/Cu solder joint were characterized using nanoindentation at temperatures from 25 to 175°C.
Marques, V, Grant, P, Johnston, C
openaire   +2 more sources

A Periosteum‐Inspired Janus Piezoelectric Scaffold Using Bioenergetic‐Driven H‐Type Vascularization for Diabetic Bone Regeneration

Advanced Science, EarlyView.
A periosteum‐inspired Janus piezoelectric scaffold converts micromechanical forces into electrical signals and synergizes with controlled resveratrol release. This dual action reprograms endothelial metabolism, drives H‑type vessel formation, and restores bone–vessel coupling in diabetic bone defects.
Kai Wang, Kai Jiang
wiley   +1 more source

Study of lead-free solder joints reliability

, 2010
The thesis deals with problems concerning lead free soldering especially the study of the structure of solder joints and their reliability. The thesis evaluates lead free solder alloys.
Pícha, Jan
core   +1 more source

Tin–Phosphorus Alloy: The Impact of Temperature on Alloy Formation and the Influence of the Dross Amount on the Solder Bath Surface

Applied Sciences
The restriction of lead content in alloys for the production of solder, based on the Directive of the European Parliament and of the Council of the European Union of 8 June 2011, which is also known as RoHS (Restriction of the use of certain Hazardous ...
Jana Körmendy, Ján Vavro, Ján Vavro
doaj   +1 more source

Microstructure and morphology of the soldering interface of Sn-2.0Ag-1.5Zn low Ag content lead-free solder ball and different substrates. [PDF]

Heliyon, 2023
Xiao J, Tong X, Liang J, Chen Q, Tang Q.
europepmc   +1 more source