Advanced Intelligent Systems, EarlyView.A hybrid mobile robot with a modular Variable‐Stiffness Bridge transitions between a rigid locomotion platform and a flexible, shape‐conforming body. By enclosing objects within its deformable structure rather than relying on dedicated end effectors, the robot achieves orientation‐regulated planar transport, with conformal contact quality shown to ...
Luiza Labazanova +5 more
wiley +1 more source
Applied SciencesThe restriction of lead content in alloys for the production of solder, based on the Directive of the European Parliament and of the Council of the European Union of 8 June 2011, which is also known as RoHS (Restriction of the use of certain Hazardous ...
Jana Körmendy, Ján Vavro, Ján Vavro
doaj +1 more source
Acetic acid mediated leaching of metals from lead-free solders
Bioresources and Bioprocessing, 2017 Background The replacement of lead (Pb)-bearing solders by several Pb-free solders is a subject of intense research in these days due to the toxic effects of Pb on the environment.
U. Jadhav +3 more
doaj +1 more source
Microstructure and morphology of the soldering interface of Sn-2.0Ag-1.5Zn low Ag content lead-free solder ball and different substrates. [PDF]
Heliyon, 2023 Xiao J, Tong X, Liang J, Chen Q, Tang Q.
europepmc +1 more source
Advanced Intelligent Systems, EarlyView.How can additive manufacturing enable components that sense, adapt, heal, and power themselves? This review synthesizes recent advances in smart functionalities, manufacturing technologies, and intelligent design strategies, revealing a pathway toward fully integrated, autonomous, and multifunctional systems across diverse engineering sectors. Additive
Aiswarya Rony +3 more
wiley +1 more source
Investigation of Lead-Free Solder for Military Applications [PDF]
, 2007 Due to international environmental regulations that took effect in July 2006, the replacement of lead-tin solder with lead-free solder is occurring globally in the electronics industry.
Doering, Kenneth, Brinkmeyer, Brandon
core +1 more source
An Introductory Overview of Various Typical Lead-Free Solders for TSV Technology
InorganicsAs semiconductor packaging technologies face limitations, through-silicon via (TSV) technology has emerged as a key solution to extending Moore’s law by achieving high-density, high-performance microelectronics.
Sooyong Choi +5 more
doaj +1 more source
Formation and Growth of Intermetallic Compounds in Lead-Free Solder Joints: A Review. [PDF]
Materials (Basel), 2022 Ramli MII +7 more
europepmc +1 more source
Author Correction: Reliability modeling of the fatigue life of lead-free solder joints at different testing temperatures and load levels using the Arrhenius model. [PDF]
Sci Rep, 2023 Bani Hani D +3 more
europepmc +1 more source
Reliability modeling of the fatigue life of lead-free solder joints at different testing temperatures and load levels using the Arrhenius model. [PDF]
Sci Rep, 2023 Bani Hani D +3 more
europepmc +1 more source