Results 1 to 10 of about 3,856 (291)

Coupled effect of Ag and In addition on the microstructure and mechanical properties of Sn–Bi lead-free solder alloy

open access: yesJournal of Materials Research and Technology, 2023
The microstructure and mechanical properties of Sn–Bi solder alloys with various Ag and In addition are comparatively investigated. The results illustrate that the tensile strength and ductility of the solder alloy could be dramatically enhanced with ...
Tianhan Hu   +11 more
doaj   +3 more sources

Analysis of Mechanical Strength of Indium-Doped SAC 105 Lead-Free Solder Alloy

open access: yesEngineering Proceedings, 2023
The incorporation and doping of elements represent a widely used approach to enhance the solidity, integrity, and characteristics of pb-free solder joints.
Muhammad Sohail Hameed   +4 more
doaj   +2 more sources

Influence of bismuth (Bi) addition on wetting characteristics of Sn-3Ag-0.5Cu solder alloy on Cu substrate

open access: yesEngineering Science and Technology, an International Journal, 2018
This work investigates the effect of bismuth (Bi) addition, 1 wt% Bi, on wettability of the Sn-3.0Ag-0.5Cu (SAC305) ternary Pb-free solder alloy. Adding Bi to SAC305 decreased the contact angles (θ) of the Sn-2.0Ag-0.5Cu-1.0Bi (SAC-1Bi) quaternary Pb ...
Ahmet Mustafa Erer   +2 more
doaj   +3 more sources

Effect of Zn addition on alloy by 0.3, 0.6 and 0.9 wt.% on thermal properties, electrical conductivity and microstructure of eutectic Sn-3.5Ag alloy [PDF]

open access: yesمجلة جامعة النجاح للأبحاث العلوم الطبيعية, 2021
In this work, the effects of 0.3, 0.6 and 0.9 wt.% Zn additives on the characteristic of Sn3.5Ag eutectic solder alloy, have been diluted to produce four micro alloys.
Abdullah Muala
doaj   +1 more source

A Short Review on the Influence of Antimony Addition to the Microstructure and Thermal Properties of Lead-Free Solder Alloy [PDF]

open access: yesArchives of Metallurgy and Materials, 2023
For long time, Sn-Pb solder alloys have been used extensively as the main interconnection materials in the soldering. It is no doubt that Sn-Pb offers many advantages including good electrical conductivity, mechanical properties as well as low melting ...
Nur Syahirah Mohamad Zaimi   +3 more
doaj   +1 more source

Experimental Study on the Melting Temperature, Microstructural and Improved Mechanical Properties of Sn58Bi/Cu Solder Alloy Reinforced with 1%, 2% and 3% Zirconia (ZrO2) Nanoparticles [PDF]

open access: yesArchives of Metallurgy and Materials, 2021
This paper investigates the influence of 1%, 2% and 3% zirconia (ZrO2) nanoparticles to the melting, microstructural and mechanical properties of the Sn58Bi solder. Melting temperatures of 145.11°C, 140.89°C and 143.84°C were attained correspondingly for
S. Amares, R. Durairaj, S.H. Kuan
doaj   +1 more source

Development of Sn-9Zn Solder Alloy by Adding Bismuth

open access: yesDiyala Journal of Engineering Sciences, 2020
Tin-Zinc based on solder is a probable changing of lead element solder as a result of its enhanced mechanical characteristics. This alloy needs to be studied and explored to get a usable solder alloy having better properties.
Abbas AL-ALbawee
doaj   +1 more source

Effect of trace elements on the interface reactions between two lead-free solders and copper or nickel substrates [PDF]

open access: yesJournal of Mining and Metallurgy. Section B: Metallurgy, 2007
Traditional Sn-Pb solder alloys are being replaced, because of environmental and health concerns about lead toxicity. Among some alternative alloy systems, the Sn-Zn and Sn-Cu base alloy systems have been studied and reveal promising properties.
Soares D.   +5 more
doaj   +1 more source

On the Direct Extrusion of Solder Wire from 52In-48Sn Alloy

open access: yesMachines, 2021
In this article, technology for producing wire and rod solder from 52In-48Sn alloy has been developed and investigated in the conditions of small-scale production.
Sergei Faizov   +8 more
doaj   +1 more source

Application of ZnO Nanoparticles in Sn99Ag0.3Cu0.7-Based Composite Solder Alloys

open access: yesNanomaterials, 2021
The properties of Sn99Ag0.3Cu0.7 (SACX0307) solder alloy reinforced with ZnO nanoparticles were investigated. The primary ZnO particle sizes were 50, 100, and 200 nm. They were added to a solder paste at a ratio of 1.0 wt %.
Agata Skwarek   +8 more
doaj   +1 more source

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