The microstructure and mechanical properties of Sn–Bi solder alloys with various Ag and In addition are comparatively investigated. The results illustrate that the tensile strength and ductility of the solder alloy could be dramatically enhanced with ...
Tianhan Hu +11 more
doaj +3 more sources
Analysis of Mechanical Strength of Indium-Doped SAC 105 Lead-Free Solder Alloy
The incorporation and doping of elements represent a widely used approach to enhance the solidity, integrity, and characteristics of pb-free solder joints.
Muhammad Sohail Hameed +4 more
doaj +2 more sources
This work investigates the effect of bismuth (Bi) addition, 1 wt% Bi, on wettability of the Sn-3.0Ag-0.5Cu (SAC305) ternary Pb-free solder alloy. Adding Bi to SAC305 decreased the contact angles (θ) of the Sn-2.0Ag-0.5Cu-1.0Bi (SAC-1Bi) quaternary Pb ...
Ahmet Mustafa Erer +2 more
doaj +3 more sources
Effect of Zn addition on alloy by 0.3, 0.6 and 0.9 wt.% on thermal properties, electrical conductivity and microstructure of eutectic Sn-3.5Ag alloy [PDF]
In this work, the effects of 0.3, 0.6 and 0.9 wt.% Zn additives on the characteristic of Sn3.5Ag eutectic solder alloy, have been diluted to produce four micro alloys.
Abdullah Muala
doaj +1 more source
A Short Review on the Influence of Antimony Addition to the Microstructure and Thermal Properties of Lead-Free Solder Alloy [PDF]
For long time, Sn-Pb solder alloys have been used extensively as the main interconnection materials in the soldering. It is no doubt that Sn-Pb offers many advantages including good electrical conductivity, mechanical properties as well as low melting ...
Nur Syahirah Mohamad Zaimi +3 more
doaj +1 more source
Experimental Study on the Melting Temperature, Microstructural and Improved Mechanical Properties of Sn58Bi/Cu Solder Alloy Reinforced with 1%, 2% and 3% Zirconia (ZrO2) Nanoparticles [PDF]
This paper investigates the influence of 1%, 2% and 3% zirconia (ZrO2) nanoparticles to the melting, microstructural and mechanical properties of the Sn58Bi solder. Melting temperatures of 145.11°C, 140.89°C and 143.84°C were attained correspondingly for
S. Amares, R. Durairaj, S.H. Kuan
doaj +1 more source
Development of Sn-9Zn Solder Alloy by Adding Bismuth
Tin-Zinc based on solder is a probable changing of lead element solder as a result of its enhanced mechanical characteristics. This alloy needs to be studied and explored to get a usable solder alloy having better properties.
Abbas AL-ALbawee
doaj +1 more source
Effect of trace elements on the interface reactions between two lead-free solders and copper or nickel substrates [PDF]
Traditional Sn-Pb solder alloys are being replaced, because of environmental and health concerns about lead toxicity. Among some alternative alloy systems, the Sn-Zn and Sn-Cu base alloy systems have been studied and reveal promising properties.
Soares D. +5 more
doaj +1 more source
On the Direct Extrusion of Solder Wire from 52In-48Sn Alloy
In this article, technology for producing wire and rod solder from 52In-48Sn alloy has been developed and investigated in the conditions of small-scale production.
Sergei Faizov +8 more
doaj +1 more source
Application of ZnO Nanoparticles in Sn99Ag0.3Cu0.7-Based Composite Solder Alloys
The properties of Sn99Ag0.3Cu0.7 (SACX0307) solder alloy reinforced with ZnO nanoparticles were investigated. The primary ZnO particle sizes were 50, 100, and 200 nm. They were added to a solder paste at a ratio of 1.0 wt %.
Agata Skwarek +8 more
doaj +1 more source

