Results 11 to 20 of about 398,038 (255)
Analysis of surface mount technology solder joints [PDF]
, 1996 This thesis was submitted for the degree of Doctor of Philosophy and awarded by Brunel University.The factors determining the quality of surface mount technology (SMT) solder joints are numerous, and complex.
Hui, Ip Kee
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Study of gold-based alloy phase diagrams [PDF]
, 1990 This thesis was submitted for the degree of Doctor of Philosophy and awarded by Brunel University.The partial constitutions of the Au-Ge-X and Au-Pb-X ternary alloys have been investigated, where X is a metallic element, selected from the sub-groups ...
Butt, M Taqi Zahid
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Thermal fatigue life of ball grid array (BGA) solder joints made from different alloy compositions [PDF]
, 2021 As temperature cycling drives fatigue failure of solder joints in electronic modules, characterisation of the thermal fatigue response of different solder alloy formulations in BGA solder joints functioning in mission-critical systems has become crucial.
MALLIK, SABUJ +6 more
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Latent heat induced deformation of PCB substrate: Measurement and simulation
Case Studies in Thermal Engineering, 2022 The work evaluates the impact of latent heat (LH) absorbed or released by a solder alloy during melting or solidification, respectively, on changes of dimensions of materials surrounding of the solder alloy.
Denis Froš +3 more
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Effect of Different Ga Contents on the Acid and Alkaline Resistance of New SnInAg Lead-Free Solder Alloy [PDF]
Cailiao BaohuIn order to improve the corrosion resistance of Sn-11In-1.5Ag lead-free solder alloy solder, the corrosion behavior of Sn-11In-1.5Ag-xGa(x=0, 0.1, 0.3, 0.5, 0.7, mass fraction, %) solder alloy in a corrosive environment was studied by weight loss method ...
REN Pengkai, XU Dongxia, CAO Fulei, CHU Yadong, ZHANG Hongxia
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Reliability Examinations of SAC Lead Free Solder Material [PDF]
Archives of Metallurgy and Materials, 2019 In this paper the effect of soldering technique and thermal shock test were investigated on SAC 305 solder joints, produced by two different solder method.
D. Koncz-Horváth +3 more
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Impact of Cu Content on Corrosion Property of Zn20Sn Lead- free Solder
Chemical Engineering Transactions, 2017 By alloying principle, different contents of Cu were added in the matrix Zn20Sn filler metals to form a new type of alloy, the effects of Cu contents on the Zn20Sn solder alloy corrosion resistance were studied.
Qiumin Wang, Hongxia Mou
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Viscoplastic behavior of diamond die attach subjected to high temperature conditions [PDF]
, 2012 In power electronic applications, diamond based semi-conductors appears to be a new way to widely increase the capabilities of power electronic converters. The main prospective expected is an increasing in system integration and power capabilities.
Msolli, Sabeur +9 more
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Heliyon, 2023 Eutectic Sn–Ag–Cu lead-free solder has limited applications due to cost and reliability issues. Sn–Ag–Zn solder has the advantages of low melting point, good mechanical properties and reliable welding interface. However, the research system of low silver
Jin Xiao +4 more
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Effect of Cr on microstructure and properties of brazed diamond with Ni-based boron free solder
Jin'gangshi yu moliao moju gongcheng, 2022 In view of the problem that B element is easy to cause more hard and brittle phases in brazed diamond joints, a new type of Ni–Cr–Si–Cu–Sn boron free active solder was prepared, and the effects of Cr element on the microstructure of solder and the ...
Pengbo WANG +7 more
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