Results 11 to 20 of about 3,856 (291)

Latent heat induced deformation of PCB substrate: Measurement and simulation

Case Studies in Thermal Engineering, 2022
The work evaluates the impact of latent heat (LH) absorbed or released by a solder alloy during melting or solidification, respectively, on changes of dimensions of materials surrounding of the solder alloy.
Denis Froš, Petr Veselý, Jan Zemen, Karel Dušek   +3 more
doaj   +1 more source

Thermal fatigue life of ball grid array (BGA) solder joints made from different alloy compositions

, 2021
As temperature cycling drives fatigue failure of solder joints in electronic modules, characterisation of the thermal fatigue response of different solder alloy formulations in BGA solder joints functioning in mission-critical systems has become crucial.
MALLIK, SABUJ, DEPIVER, JOSHUA A., Sabuj, Mallik, Amalu, Emeka H, Amalu, Emeka H., Depiver, Joshua Adeniyi, Amalu, Emeka; id_orcid   +6 more
core   +1 more source

Effect of Different Ga Contents on the Acid and Alkaline Resistance of New SnInAg Lead-Free Solder Alloy [PDF]

Cailiao Baohu
In order to improve the corrosion resistance of Sn-11In-1.5Ag lead-free solder alloy solder, the corrosion behavior of Sn-11In-1.5Ag-xGa(x=0, 0.1, 0.3, 0.5, 0.7, mass fraction, %) solder alloy in a corrosive environment was studied by weight loss method ...
REN Pengkai, XU Dongxia, CAO Fulei, CHU Yadong, ZHANG Hongxia
doaj   +1 more source

Reliability Examinations of SAC Lead Free Solder Material [PDF]

Archives of Metallurgy and Materials, 2019
In this paper the effect of soldering technique and thermal shock test were investigated on SAC 305 solder joints, produced by two different solder method.
D. Koncz-Horváth, G. Gergely, Z. Gyökér, Z. Gácsi   +3 more
doaj   +1 more source

Viscoplastic behavior of diamond die attach subjected to high temperature conditions [PDF]

, 2012
In power electronic applications, diamond based semi-conductors appears to be a new way to widely increase the capabilities of power electronic converters. The main prospective expected is an increasing in system integration and power capabilities.
Msolli, Sabeur, Baazaoui, Ahlem, Karama, Moussa, M. Karama, Alexis, Joël, J. Alexis, O. Dalverny, A. Baazaoui, Dalverny, Olivier, S. Msolli   +9 more
core   +1 more source

Impact of Cu Content on Corrosion Property of Zn20Sn Lead- free Solder

Chemical Engineering Transactions, 2017
By alloying principle, different contents of Cu were added in the matrix Zn20Sn filler metals to form a new type of alloy, the effects of Cu contents on the Zn20Sn solder alloy corrosion resistance were studied.
Qiumin Wang, Hongxia Mou
doaj   +1 more source

Microstructure and morphology of the soldering interface of Sn–2.0Ag–1.5Zn low Ag content lead-free solder ball and different substrates

Heliyon, 2023
Eutectic Sn–Ag–Cu lead-free solder has limited applications due to cost and reliability issues. Sn–Ag–Zn solder has the advantages of low melting point, good mechanical properties and reliable welding interface. However, the research system of low silver
Jin Xiao, Xing Tong, Jinhui Liang, Quankun Chen, Qiming Tang   +4 more
doaj   +1 more source

Mechanical Property of Sn-58Bi Solder Paste Strengthened by Resin

Applied Sciences, 2018
Sn-58Bi solder has been widely used for microelectronics packaging due to its low melting point temperature, good wetting performance, good mechanical properties, and low cost.
Lu Liu, Songbai Xue, Siyi Liu
doaj   +1 more source

Mechanical properties and microstructure evolution of Cu/Sn58Bi/Cu solder joint reinforced by B4C nanoparticles

Journal of Materials Research and Technology, 2023
The mechanical mixed Sn58Bi solder reinforced by B4C nanoparticles for the interconnect of Cu/Cu same metal was studied. The hardness of solder alloy and shear strength of joints with Sn58Bi-xB4C (x = 0, 0.2, 0.4, 0.6, 0.8, 1.0 wt%) composite solder were
Chen Chen, Liang Zhang, Xi Wang, Xiao Lu, Li-li Gao, Meng Zhao, Yong-huan Guo   +6 more
doaj   +1 more source

Temperature-dependent fatigue modelling of a novel Ni, Bi and Sb containing Sn-3.8Ag-0.7Cu lead-free solder alloy

, 2020
International audienceLow-cycle fatigue testing of a lead-free solder (InnoLot) based on Sn-3.8Ag-0.7Cu (SAC387) with three simultaneous additions of bismuth, nickel and antimony was conducted using miniature-sized fatigue specimens at different ...
Van Nhat Le, Tao, Quangbang, Ngoc Anh Thi Nguyen, Nguyen, Ngoc Anh Thi, Hung Nguyen‐Xuan, L. Benabou, Nguyen-Xuan, Hung, Benabou, Lahouari, Le, van Nhat, Q.B. Tao   +9 more
core   +1 more source