Results 31 to 40 of about 3,856 (291)

Interfacial reaction of Sn-1.5Ag-2.0Zn low-silver lead-free solder with oriented copper

Heliyon
High density packaging technology reduces the pad size and the number of grains contained in the pad. When the polycrystalline pad turns into a single crystal pad, the grain orientation has an important impact on the formation of the intermetallic ...
Jin Xiao, Wei Cheng, Qu Fu-kang
doaj   +1 more source

Printing Morphology and Rheological Characteristics of Lead-Free Sn-3Ag-0.5Cu (SAC) Solder Pastes [PDF]

, 2014
Solder paste plays a crucial role as the widely used joining material in surface mount technology (SMT).The understanding of its behaviour and properties is essential to ensure the proper functioning of the electronic assemblies.The composition of the ...
Mallik, Sabuj, Ekere, N., Sharma, Ashutosh, Jung, Jae-Pil, Ekere, Nduka N.   +4 more
core   +1 more source

Modulating thermo-mechanical properties of lead-free Sn-30Bi TIM by adding In-3Ag alloy

Journal of Alloys and Metallurgical Systems
This research work is focused on studying the effect of indium (In) and silver (Ag) addition on the thermo-mechanical properties of lead-free Sn-Bi solder alloy. Sn-30B is a potential solder to be used as thermal interface material; however, its enhanced
Munim Shahriar Jawad, Md. Asif Mahmud Noman, Ridwan Radit Ahsan, Md. Muktadir Billah   +3 more
doaj   +1 more source

Machine Learning‐Assisted Inverse Design of Soft and Multifunctional Hybrid Liquid Metal Composites

Advanced Functional Materials, EarlyView.
A machine learning framework is presented for inverse design of synthesizable multifunctional composites containing both liquid metal and solid inclusions. By integrating physics‐based modeling, data‐driven prediction, and Bayesian optimization, the approach enables intelligent design of experiments to identify optimal compositions and realize these ...
Lijun Zhou, Yunsik Ohm, Ren‐Mian Chin, Olivia Kerr, Krithika Manohar, Mohammad H. Malakooti   +5 more
wiley   +1 more source

Effect Of Lead-free Solder And Gold Content On The Shear Strength, Toughness, IMC And Void Formation [TT267. C518 2004 f rb Kejuruteraan] [Microfiche 7715]. [PDF]

, 2004
Study of interaction between lead free solder with gold and the mechanical toughness,shear strength of solder that associated with intermetallic compound IMC and void formation was carried out.
Oo, Cheng Ee
core  

STUDY OF PROPERTIES OF DIFFUSION-HARDENING COMPOSITE SOLDER GaSn — CuSn — Mo

Физико-химические аспекты изучения кластеров, наноструктур и наноматериалов, 2020
The article discusses the possibility of regulating the properties of a diffusion-hardening solder based on a low-melting gallium-tin alloy and a solid component consisting of a copper-tin alloy powder by introducing an inert metal molybdenum powder and ...
V.М. Skachkov, L.A. Pasechnik, S.P. Yatsenko   +2 more
doaj   +1 more source

Effect of in Addition on Thermodynamic Properties, Wettability, Interface Microstructure, and Soldering Performance of SnBiAg–xIn/Cu Solder Joints

Metals, 2022
In this experiment, a Sn35Bi0.3Ag–xIn (x = 0, 0.5, 1.0, 1.5) alloy solder was prepared by electromagnetic induction heating furnace. The effects of In on the thermodynamic properties, wettability, interface microstructure, and soldering performance of ...
Bingwei Shen, Shangrong Yang, Mingyue Xu, Jincheng Zhao, Guohua Liu, Ming Xie, Qiao Zhang   +6 more
doaj   +1 more source

Pull‐and‐Push Nanotherapeutic Hydrogels: Scavenging Inflammatory Triggers While Driving Tissue Regeneration in Burn Wounds

Advanced Functional Materials, EarlyView.
A nanounit‐assembled hydrogel employing a “pull‐and‐push” strategy simultaneously scavenges pro‐inflammatory cell‐free DNA (cfDNA) and delivers regenerative therapeutics in response to burn‐induced hyperthermia. By repolarizing macrophages and promoting angiogenesis, this multifunctional platform accelerates burn wound healing, offering a blueprint for
Han‐Sem Kim, Seong‐Jin Shin, Sak Lee, Nandin Mandakhbayar, Ji‐Hye Kang, Da‐Young Kong, Seong‐Doo Hong, Ueon Sang Shin, Hae‐Won Kim, Jung‐Hwan Lee   +9 more
wiley   +1 more source

Utilization of a Porous Cu Interlayer for the Enhancement of Pb-Free Sn-3.0Ag-0.5Cu Solder Joint

Metals, 2016
The joining of lead-free Sn-3.0Ag-0.5Cu (SAC305) solder alloy to metal substrate with the addition of a porous Cu interlayer was investigated. Two types of porous Cu interlayers, namely 15 ppi—pore per inch (P15) and 25 ppi (P25) were sandwiched in ...
Nashrah Hani Jamadon, Ai Wen Tan, Farazila Yusof, Tadashi Ariga, Yukio Miyashita, Mohd Hamdi   +5 more
doaj   +1 more source

Characterizing the Soldering Alloy Type Zn–Al–Cu and Study of Ultrasonic Soldering of Al7075/Cu Combination

Metals, 2020
The aim of the research was to characterize the soldering alloy type Zn–Al–Cu and study the fluxless ultrasonic soldering of the combination of aluminum alloy type Al7075 with copper substrate.
Roman Kolenak, Igor Kostolny, Jaromir Drapala, Paulina Babincova, Martin Sahul   +4 more
doaj   +1 more source