Results 51 to 60 of about 398,038 (255)

Preparation and temperature cycling reliability of electroless Ni(P) under bump metallization [PDF]

open access: yes, 2007
The reliability of electroless Ni(P) under-bump metallization (UBM) was evaluated via temperature cycling and solder bump shear strength tests. Commercial diodes and dummy dies fabricated in-house were used as substrates for the electroless Ni(P) UBM ...
Chen, Weimin   +9 more
core   +2 more sources

Bioinspired Adaptive Artificial Cilia With Tunable Sensitivity and Dynamic Range for Airflow Monitoring in the Central Airway

open access: yesAdvanced Materials Technologies, EarlyView.
A magnetically reconfigurable airflow sensor integrated with an airway stent enables tunable sensitivity and dynamic sensing range. Airflow‐induced cantilever deformation generates resistance changes, while an external magnetic field modulates sensor stiffness, enhancing sensitivity at low airflow velocities and extending the sensing range at higher ...
Darren Wang   +10 more
wiley   +1 more source

Characterization of Strain Rate-Dependent Behavior of 63Sn-37Pb Solder Alloy

open access: yes, 2001
A novel punch shear testing method is introduced in this study to investigate the strain rate-dependent shear behavior of solder materials. Both static and dynamic shear strengths of 63 Sn-37Pb solder were characterized. The experimental results indicate
Lee SWR, 戴兰宏
core   +2 more sources

Differential Tissue‐Coupled Powering for Battery‐Free Injectable Electroceuticals

open access: yesAdvanced Science, EarlyView.
A thread‐like injectable neural stimulator is powered through differential tissue‐coupled powering (DTCP), which harvests RF‐frequency tissue potentials with an elongated receiver while preserving a injectable cross‐section. The system integrates an ASIC, stimulation electrodes, and a portable transmitter, enabling wireless peripheral nerve stimulation,
Han Wu   +13 more
wiley   +1 more source

An innovative high-entropy alloy solder for high-reliability low-temperature bonding in 3D electronic packaging–based on nano InSnBiZnAg particles

open access: yesJournal of Materials Research and Technology
To address the demand for multilevel package, a low-melting-point high entropy alloy (HEA) solder was developed. It consists of 43In28Sn14Bi9Zn6Ag micro- and nano-particles with a melting point of about 62.80 °C.
Yini Chen   +8 more
doaj   +1 more source

Bamboo‐Slip‐Inspired Conformal Reconfigurable Metasurfaces

open access: yesAdvanced Science, EarlyView.
Bamboo‐slip‐inspired conformal reconfigurable metasurface system. The structure is mainly composed of three parts, which are conformal metasurface, pattern reconfigurable antenna, and control components (such as Field Programmable Gate Array (FPGA)). Conformal metasurfaces draw inspiration from the design of ancient Chinese bamboo slips.
Qifan Li   +9 more
wiley   +1 more source

Synergistic Grain Boundary and Phonon Engineering Enables Ultrahigh Thermoelectric Performance in Mg3(Sb, Bi)2‐Based Materials

open access: yesAdvanced Science, EarlyView.
Ta encapsulated melting and Cu doping synergistically engineer grain boundaries and phonon scattering in Mg3(Sb,Bi)2, enabling single‐crystal‐like carrier transport and high thermoelectric performance. ABSTRACT Thermoelectric Mg3(Sb, Bi)2 has emerged as a rising star in virtue of its promising thermoelectric performance and abundant constituent ...
Jingdan Lei   +10 more
wiley   +1 more source

Supercapacitor Safety: Overcharge‐Induced Failure Mechanisms in Electrochemical Double‐Layer Capacitors

open access: yesAdvanced Science, EarlyView.
Time‐resolved synchrotron radiography reveals the internal evolution of electrochemical double‐layer capacitors under abusive overcharge. EDLCs are shown to follow a thermally driven failure pathway involving electrolyte decomposition, gas generation, and structural collapse, distinct from chemically driven thermal runaway effects of Lithium‐ion ...
Thomas Dore   +19 more
wiley   +1 more source

Adaptive Conductive Systems: Enabling Deformable Electronics Through Engineered Materials, Circuits, and Intelligent Systems

open access: yesAdvanced Science, EarlyView.
This review presents the research advances of adaptive conductive systems from the perspective of materials, circuits, systems, and applications. Deformable conductors consist of substrates/matrices and conductive materials, structural design of circuit interconnections, fabrication of circuit interconnections, as well as intelligent systems ...
Yufei Lu   +7 more
wiley   +1 more source

Spatiotemporal Thermal Modulation and Patterning using a Programmable 1024 Element Microheater Array

open access: yesAdvanced Science, EarlyView.
Programmable microheater arrays are essential for a variety of applications. However, large arrays have thus far not been realized. We introduce a programmable 32×$\times$32 microheater array consisting of heating elements – each smaller than 300 μm$\umu{\rm m}$.
Rahul Goyal   +3 more
wiley   +1 more source

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