Results 51 to 60 of about 3,856 (291)

Influência do teor do elemento índio nas propriedades termo-mecânicas de ligas para interconexão de componentes eletrônicos [PDF]

open access: yes, 2012
Tese (doutorado) - Universidade Federal de Santa Catarina, Centro Tecnológico. Programa de Pós-Graduação em Ciência e Engenharia de Materiais.Este trabalho insere-se no âmbito da confiabilidade de interconexões eletrônicas.
Boareto, José Carlos
core  

Stress Relaxation and Fatigue Characterisation of Eutectic SnPb Solder Alloy

open access: yes, 2011
Soldering is the most important joining technology in the semiconductor industry, especially for IC chip packaging. The binary eutectic SnPb alloy had been in used for decades, before regulations and restriction on the usage of lead in solders was ...
Mohd Amin Hashim, A. Rahmat
core   +1 more source

Advances in Magnesium‐Based Thermoelectrics: A Critical Review

open access: yesAdvanced Materials, EarlyView.
Magnesium‐based thermoelectric materials have emerged as promising candidates for low‐to‐mid‐temperature energy conversion due to their abundance, low cost, and competitive performance. This review summarizes recent advances in Mg3X2, MgAgSb, and Mg2X systems, covering transport mechanisms, fabrication strategies, stability challenges, and device ...
Li‐Min Zhang   +5 more
wiley   +1 more source

Contribuição ao desenvolvimento de ligas para interconexão eletrônica utilizando moagem de alta enegia [PDF]

open access: yes, 2013
Dissertação (mestrado) - Universidade Federal de Santa Catarina, Centro Tecnológico, Programa de Pós-Graduação em Ciência e Engenharia de Materiais, Florianópolis, 2013O processamento de materiais compósitos tem despertado interesse dos engenheiros pelo ...
Rodrigues, Guilherme Valença da Silva
core  

Mechanical and Physical Properties of In-Zn-Ga Lead-Free Solder Alloy for Low Energy Consumption

open access: yes, 2016
Due to the demand in the use of electronics devices in industry, the usage of solder connections has increased. Concerning with the toxicity of lead in Sn-37Pb solder alloy, developing lead free solder alloy with low melting temperature is one of the ...
Mhd Noor, Ervina Efzan   +2 more
core   +1 more source

Microstructural evaluation of sn3.0ag0.5cu solder alloy fabricated via powder metallurgy method [PDF]

open access: yes, 2021
For decades, casting has been the most influential industrial manufacturing process to fabricate and promote higher properties of solder alloy. However, stirring technique which is commonly applies in casting method has brought some attentions for ...
Nadhrah, Murad
core  

Fabrication and mechanical properties of novel CFRP/Mg alloy hybrid laminates with enhanced interface adhesion

open access: yesMaterials & Design, 2021
To enhance the interfacial and mechanical properties of magnesium alloy based fiber-metal laminates, a novel of AZ31B magnesium alloy-based hybrid fiber metal laminates (Mg-FMLs) bonded with Mg-Zn-Al eutectic alloy solder based on carbon fiber woven ...
Xia Zhou   +5 more
doaj   +1 more source

Ultrathin Li Metal Anodes: Quantitative Design Principles and Manufacturability Across Liquid and Solid‐State Batteries

open access: yesAdvanced Materials, EarlyView.
Ultrathin lithium metal anodes (≤15 µm) offer a promising route to high‐energy‐density batteries due to their high capacity and low potential. This review presents design principles for ultrathin Li, evaluates fabrication strategies, and discusses challenges in liquid and solid‐state cells.
Cheng Wang   +9 more
wiley   +1 more source

Influence of bismuth on the solidification of tin copper lead-free solder alloy

open access: yes, 2018
Lead-based solder alloy has been used for a long time as solder material in electronic industry. However, its usage in electronic industry has been restricted due to its toxicity to human health and negative impact on the environmental.
Ezaham, N. A.   +5 more
core   +1 more source

Weaving Intelligence: Thermally Drawn Multimaterial Fibers Toward AI‐Enabled Smart Textiles

open access: yesAdvanced Materials, EarlyView.
Thermally drawn multimaterial fibers are rapidly advancing as intelligent structural units for next‐generation smart textiles. Integrating multimaterial architectures with neuromorphic and spiking‐neural‐network principles enables fabrics that can sense, compute, and adapt autonomously.
Vuong Dinh Trung   +9 more
wiley   +1 more source

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