Results 61 to 70 of about 398,038 (255)

Printing‐Assisted Integration of Thermal, Fluidic and Electrical Components in Implants for Focal Brain Cooling

Advanced Science, EarlyView.
Extrusion‐based 3D printing of silicones and discrete electronic components are combined to create cortical implants for rodents that integrate thermal neuromodulation and electrical recording. Linked to an autonomous auxiliary driver unit, the system enables rapid, stable and localized hypothermia alongside ECoG recording.
Spencer Ryan Moore, Naomi King, Aruã Clayton Da Silva, Clare Howarth, Jason Berwick, Thomas E. Paterson, Ivan R. Minev   +6 more
wiley   +1 more source

Development of a technology for producing an Al–Cu–Si solder alloy based on recycled waste

Литьë и металлургия
The main stages of research on the development of technology for obtaining cast A34‑grade solder in the form of rods are presented. It is shown that, taking into account the basic patterns of structural heredity, up to 100 % of preprepared various scraps
K. V. Nikitin, I. Yu. Timoshkin, R. M. Biktimirov   +2 more
doaj   +1 more source

Effect of Mixed Rare Earths on the Wetting Behavior and Interfacial Reaction between Sn-0.70Cu-0.05Ni Solder and Amorphous Fe84.3Si0.3B5.4 Alloy

MATEC Web of Conferences, 2018
In order to explore the effect of addition of mixed rare earths (MRE) on the wetting behavior and interfacial reaction between Sn-0.70Cu-0.05Ni solder and amorphous Fe84.3Si10.3B5.4 alloy, 0.25 wt.% percentage of the MRE, which are mainly elements La and
Hou Bin, Liu Fengmei, Wang Hongqin, Zhang Yupeng, Yi Jianglong, Qin Hongbo   +5 more
doaj   +1 more source

Robust, Breathable and Stretchable Liquid Metal Composite Nanofibre for Physiological Electrical Signal Monitoring

Advanced Science, EarlyView.
A conductive TPU/liquid‐metal nanofibrous film is fabricated via ultrasonic dispersion, electrospinning, and mold imprinting. The film is breathable, stretchable, deformation‐stable, and provides electromagnetic shielding. n‐Butanol encapsulation mitigates liquid‐metal surface tension and improves biocompatibility. Stable ECG, EOG, EEG, and EMG signals
Cong Huang, Zhenyu Chen, Zedong Jiang, Yuhao Jiang, Haohong Jiang, Zhenli Zhou, Yunlu Pan, Shu‐Jen Wang   +7 more
wiley   +1 more source

Magnesium‐Retention Assisted Synthesis of High‐Performance Zintl Thermoelectrics

Angewandte Chemie, EarlyView.
Mg volatilization and chemical instability during high‐temperature synthesis hinder the scalable fabrication of Mg‐based thermoelectrics. Here, a magnesium‐retention assisted synthesis (MRAS) strategy stabilizes Mg using a sacrificial Mg reservoir and an inert‐gas‐regulated melting environment.
Boxuan Hu, Xiao‐Lei Shi, Tianyi Cao, Nanhai Li, Chao Zhang, Sen Wang, Siqi Liu, Meng Li, Dmitri Golberg, Zhi‐Gang Chen   +9 more
wiley   +2 more sources

A General and Efficient Framework for the Rapid Design of Miniaturized, Wideband, and High‐Bit RIS

Advanced Electronic Materials, EarlyView.
A general and efficient framework is proposed for the rapid design of high‐performance reconfigurable intelligent surfaces (RISs). This framework integrates advanced antenna design techniques and incorporates various load types, quantities, and values to achieve the design of high‐performance RISs.
Jun Wei Zhang, Zheng Xing Wang, Wanwan Cao, Zhen Jie Qi, Li Jie Wu, Han Qing Yang, Qun Yan Zhou, Si Ran Wang, Hui Dong Li, Jun Yan Dai, Jiang Luo, Jun Wei Wu, Jia Nan Zhang, Zhen Zhang, Qiang Cheng   +14 more
wiley   +1 more source

Factorial design and design of experiments for developing novel lead free solder alloy with Sn, Cu and Ni

International Journal for Simulation and Multidisciplinary Design Optimization, 2020
Inherent toxicity makes lead a banned material in solder alloy making process. Lead-tin alloy was a favorable alloy used for soldering in electronic packaging manufacturers.
S Jayesh, Elias Jacob, Guru Manoj
doaj   +1 more source

Bridging Performance and Fate: A Framework for Sustainable, Composite‐Based Flexible Electronic Systems

Advanced Electronic Materials, EarlyView.
Composite‐based flexible electronics integrate biodegradable polymers, conductive networks, and multilayer device architectures to balance electrical performance, mechanical durability, and controlled degradation. Interfacial engineering and encapsulation regulate transport stability and operational lifetime, while programmed disassembly enables ...
Sayam, Sangho Cho
wiley   +1 more source

Influência do teor do elemento índio nas propriedades termo-mecânicas de ligas para interconexão de componentes eletrônicos [PDF]

, 2012
Tese (doutorado) - Universidade Federal de Santa Catarina, Centro Tecnológico. Programa de Pós-Graduação em Ciência e Engenharia de Materiais.Este trabalho insere-se no âmbito da confiabilidade de interconexões eletrônicas.
Boareto, José Carlos
core  

Coarsening‐Resistant Ag Sinter Composites: Mechanistic Insights From Different Ag–Additive Systems

Advanced Electronic Materials, EarlyView.
An Ag–WC sintered composite exhibiting superior resistance to thermal coarsening. Different particle‐reinforced Ag sinter composites showed markedly different microstructural responses to thermal aging. The comparison revealed that robust Ag–additive interfaces maintain grain‐boundary pinning, whereas insufficient interfacial stability results in the ...
Yang Liu, Chuantong Chen, Ran Liu, Akitsu Shigetou, Katsuaki Suganuma   +4 more
wiley   +1 more source