Results 61 to 70 of about 3,856 (291)

An innovative high-entropy alloy solder for high-reliability low-temperature bonding in 3D electronic packaging–based on nano InSnBiZnAg particles

Journal of Materials Research and Technology
To address the demand for multilevel package, a low-melting-point high entropy alloy (HEA) solder was developed. It consists of 43In28Sn14Bi9Zn6Ag micro- and nano-particles with a melting point of about 62.80 °C.
Yini Chen, Jintao Wang, Ziwen Lv, Jianqiang Wang, Feng Tian, Luobin Zhang, Weiwei Zhang, Hongtao Chen, Mingyu Li   +8 more
doaj   +1 more source

Double‐Sided Mechanical Interlocking Enables Soft‐Rigid Conductive Interfaces With a Record High Toughness for Flexible Electronics

Advanced Materials, EarlyView.
A double‐sided mechanical interlocking strategy is developed to create robust electrical contact between polymer electrode and metal interconnect. The fibrous structure enables formation of thread–hole adhesion, which only breaks under bulk failure and achieves a record high interfacial energy exceeding 730 J·m−2. This adhesion secures the integrity of
Gang Li, Minkun Cai, Chunyan Cao, Zengbai Ouyang, Hong Fu, Lingyu Zhao, Bingang Xu   +6 more
wiley   +1 more source

Overcoming Printing and Interfacial Challenges in Liquid Metal Direct Writing for Integrated Stretchable Electronics

Advanced Materials Technologies, EarlyView.
Liquid metal direct writing is advanced from a technological and fundamental point. Utilizing a kinematic bed, printing on large surfaces with irregularities is enabled. Furthermore, a pressure‐driven flow during printing is discovered that affects the thickness of traces.
Maximilian Krack, Lennert Purnal, Parth Vinayakrao Sewlikar, Sam Cuyvers, Gus Geurts, Rathul Nengminza Sangma, Derese Desta, Dieter Reenaers, Bart Ruttens, Iris De Graeve, Tom Hauffman, Seppe Terryn, Bram Vanderborght, Michaël Daenen, Wim Deferme, Monika Rai   +15 more
wiley   +1 more source

Effects of Cooling Rates on Microstructure, Wettability and Strength of Sn3.8Ag0.7Cu Solder Alloy [PDF]

, 2017
The aim of this research paper is to study the effects of cooling rates on microstructure and mechanical properties of Sn3.8Ag0.7Cu solder alloy prepared through powder metallurgy (PM) method.
M., Ishak, Nadhrah, Murad, Siti Rabiatull Aisha, Idris   +2 more
core   +1 more source

Characterization of Strain Rate-Dependent Behavior of 63Sn-37Pb Solder Alloy

, 2001
A novel punch shear testing method is introduced in this study to investigate the strain rate-dependent shear behavior of solder materials. Both static and dynamic shear strengths of 63 Sn-37Pb solder were characterized. The experimental results indicate
Lee SWR, 戴兰宏
core   +1 more source

End‐to‐End Sensing Systems for Breast Cancer: From Wearables for Early Detection to Lab‐Based Diagnosis Chips

Advanced Materials Technologies, EarlyView.
This review explores advances in wearable and lab‐on‐chip technologies for breast cancer detection. Covering tactile, thermal, ultrasound, microwave, electrical impedance tomography, electrochemical, microelectromechanical, and optical systems, it highlights innovations in flexible electronics, nanomaterials, and machine learning.
Neshika Wijewardhane, Lyn I. Jones, Richard M. Martin, Helen Winter, Faezeh Arab Hassani   +4 more
wiley   +1 more source

A review: Effect of nanoparticles addition on the properties of Sn-Ag-Cu lead free solder alloy

, 2021
Sn-Ag-Cu lead-free solder alloy containing nanoparticles has been extensively developed as replacement for the conventional tin-lead (Sn-Pb) solder in electronic packaging industry.
Mhd Noor, Ervina Efzan, M. M., Nur Haslinda, Abdullah, M. M. Al Bakri   +2 more
core   +1 more source

Factorial design and design of experiments for developing novel lead free solder alloy with Sn, Cu and Ni

International Journal for Simulation and Multidisciplinary Design Optimization, 2020
Inherent toxicity makes lead a banned material in solder alloy making process. Lead-tin alloy was a favorable alloy used for soldering in electronic packaging manufacturers.
S Jayesh, Elias Jacob, Guru Manoj
doaj   +1 more source

Mechanical Fatigue in Liquid‐Metal Interconnects: Failure Mechanism Analysis and Validation of Improvement Strategies

Advanced Materials Technologies, EarlyView.
Multi‐million cycle reliability for liquid metal stretchable electronics is achieved through a continuous cycle of mechanical testing, failure mode and mechanism analysis and implementing subsequent mitigation strategies. ABSTRACT Stretchable electronics that combine mechanical compliance with reliable electrical performance are essential for ...
Lennert Purnal, Maximilian Krack, Parth Vinayakrao Sewlikar, Bart Ruttens, Tom Hauffman, Iris De Graeve, Wim Deferme, Michaël Daenen, Monika Rai   +8 more
wiley   +1 more source

Effect of the LaNd Addition on Melting Point and Spreading Properties of Bi5Sb8Sn Solder Alloy

, 2011
Bi5Sb8Sn solder alloy is the most promising alternative to existing high-Pb solder as high-temperature lead-free soft solder alloy series whose melting point is about 264°C and have better conductivity and mechanical properties, but its wettability need ...
Zhi Wei Xu, Kun Tang, Kuai Le Zhao, Cun Cang Han, Yang Yang Sheng, Yan Fu Yan   +5 more
core   +1 more source