Results 41 to 50 of about 398,038 (255)

Characterizing the Soldering Alloy Type Zn–Al–Cu and Study of Ultrasonic Soldering of Al7075/Cu Combination

Metals, 2020
The aim of the research was to characterize the soldering alloy type Zn–Al–Cu and study the fluxless ultrasonic soldering of the combination of aluminum alloy type Al7075 with copper substrate.
Roman Kolenak, Igor Kostolny, Jaromir Drapala, Paulina Babincova, Martin Sahul   +4 more
doaj   +1 more source

Stretchable Microelectrode Arrays for Electro‐Mechanical Probing of Brain Spheroids

Advanced Healthcare Materials, EarlyView.
A multimodal device featuring kirigami‐patterned stretchable microelectrode arrays enables concurrent mechanical actuation and electrophysiological recording of brain spheroids. The platform supports multiple loading regimes and reveals mechanically induced modulation of spontaneous network activity in 3D neural tissue models.
Eleonora Martinelli, Ivan Furfaro, Flavius Timis, João Marques, Tala El Kaissi, Desirée Maulà, Laurine Kolly, Julian Bär, Sina Röllin, Scott Erickson, Laetitia Nikles, Benoît Delaup, Camille Delgrange, Loris Gomez Baisac, Luc Stoppini, Adrien Roux, Giuseppe Schiavone, Stéphanie P. Lacour   +17 more
wiley   +1 more source

Improvement in Thermomechanical Reliability of Low Cost Sn-Based BGA Interconnects by Cr Addition

Metals, 2018
The exemption of Pb-bearing automobile electronics in the End of Life Vehicle (ELV) directive has recently expired, bring an urgent need to find Pb-free alloys that can maintain good performance under high-temperature and vibration conditions for ...
Junghwan Bang, Dong-Yurl Yu, Ming Yang, Yong-Ho Ko, Jeong-Won Yoon, Hiroshi Nishikawa, Chang-Woo Lee   +6 more
doaj   +1 more source

Effect of in Addition on Thermodynamic Properties, Wettability, Interface Microstructure, and Soldering Performance of SnBiAg–xIn/Cu Solder Joints

Metals, 2022
In this experiment, a Sn35Bi0.3Ag–xIn (x = 0, 0.5, 1.0, 1.5) alloy solder was prepared by electromagnetic induction heating furnace. The effects of In on the thermodynamic properties, wettability, interface microstructure, and soldering performance of ...
Bingwei Shen, Shangrong Yang, Mingyue Xu, Jincheng Zhao, Guohua Liu, Ming Xie, Qiao Zhang   +6 more
doaj   +1 more source

Leaftronics: Bio‐Fractal Scaffolds From Leaf Venation for Low‐Waste Electronics

Advanced Materials, EarlyView.
“Leaftronics” transforms naturally evolved leaf venation into quasi‐fractal scaffolds for sustainable electronics. Polymer‐infiltrated leaf skeletons can be used to fabricate ultra‐smooth, reflow‐ and thin‐film‐compatible decomposable substrates, while making the same lignocellulose networks conducting results in flexible transparent electrodes.
Rakesh Rajendran Nair, Hrisheekesh Thachoth Chandran, Karl Leo, Hans Kleemann   +3 more
wiley   +1 more source

Corrosion resistance and electrochemical migration behavior of InSnBiAgxZn low-melting-point alloy solders

Journal of Materials Research and Technology
With the ongoing advancements and innovations of electronic device, the demand for low-melting-point solder is rising, especially for flexible printed electronics.
Yini Chen, Jintao Wang, Jianqiang Wang, Shengli Li, Feng Tian, Hongtao Chen, Gaoliang Peng, Mingyu Li   +7 more
doaj   +1 more source

Radiative Thermal Management for Extreme Environments: Mechanisms and Design Strategies

Advanced Materials, EarlyView.
In this review, we discuss the fundamental mechanisms of radiative cooling and solar heating, material and structural design strategies, hybrid approaches integrating additional heat transfer pathways, and durability‐oriented designs addressing environmental stresses.
Hyung Rae Kim, Haeseong Kim, Joo Hwan Ko, Gil Ju Lee, Dae‐Hyeong Kim, Young Min Song   +5 more
wiley   +1 more source

Influence of composition variations on microstructure and properties of SnBiInAl low-melting-point medium-entropy solder alloys

Hanjie xuebao
With the rapid development of three-dimensional integrated packaging technology, higher requirements have been put forward for the performance and reliability of low-temperature lead-free solders.
Yan GAO, Ruyu TIAN, Xiaotong GUO, Jianchao LIANG, Peng WU, Tao DENG, Wei WANG   +6 more
doaj   +1 more source

Microfabrication of Soft Millirobots Propelled by Low Voltage Electrohydraulic Actuators

Advanced Materials Technologies, EarlyView.
Manual layer‐by‐layer assembly is replaced by wafer‐level MEMS batch fabrication for compliant polymer‐based electrohydraulic actuators. The microfabricated devices integrate sacrificially defined microcavities, Parylene‐C‐sealed inlets, and multilayer polymer–metal films.
Shai Shmulevich, Florian Hartmann, Herbert Shea   +2 more
wiley   +1 more source

Microscale 3D‐Printed Digital Strain Switches for Embedded Mechanical Computation

Advanced Materials Technologies, EarlyView.
Microscale 3D‐printed strain switches on flexible films convert deformation into native digital signals at geometry defined thresholds. A closed form model predicts switching from 3000 to 15 000 microstrain and is validated across 110 devices. Reliable ohmic closure and strain activated AND, OR, and XOR logic point toward low‐power mechanical ...
Regan Kubicek, Daniel Quinn, Gabriel Smith, Sarah Bergbreiter   +3 more
wiley   +1 more source