Results 41 to 50 of about 3,856 (291)
Advanced Functional Materials, EarlyView.We introduce a capillary‐filtering‐based particle‐filling (CFPF) process that simultaneously forms vertical thermal pathways and electrical vias within µ‐pores. In situ microfluidic analysis reveals that capillary‐driven velocity gradients generate vorticity that governs µ‐platelet rotation and vertical alignment.
Yujin Mun +11 more
wiley +1 more source
Investigations On The Properties Of Sn-8zn-3Bi Lead-Free And Sn-37Pb Eutectic Solder Alloys [TS610. D928 2005 f rb] [Microfiche 8175]. [PDF]
, 2005 Sifat-sifat logam pateri bebas plumbum Sn-8Zn-3Bi dan logam pateri eutektik Sn-37Pb yang bersentuhan dengan substrak kuprum telah dikaji. Properties of Sn-8Zn-3Bi lead-free solder and Sn-37Pb eutectic solder in contact with copper substrates have been
Duong, Ngoc Binh
core
Improvement in Thermomechanical Reliability of Low Cost Sn-Based BGA Interconnects by Cr Addition
Metals, 2018 The exemption of Pb-bearing automobile electronics in the End of Life Vehicle (ELV) directive has recently expired, bring an urgent need to find Pb-free alloys that can maintain good performance under high-temperature and vibration conditions for ...
Junghwan Bang +6 more
doaj +1 more source
Advanced Materials, EarlyView.We report a multifunctional tapered optical fiber integrating a conformal micro‐resistance temperature detector (µRTD) for local, real‐time thermometry during optical stimulation. The platform combines light‐delivery and temperature sensing within a minimally invasive footprint, enabling detection of sub‐degree cortical heating under representative ...
Antonio Balena +6 more
wiley +1 more source
Leaftronics: Bio‐Fractal Scaffolds From Leaf Venation for Low‐Waste Electronics
Advanced Materials, EarlyView.“Leaftronics” transforms naturally evolved leaf venation into quasi‐fractal scaffolds for sustainable electronics. Polymer‐infiltrated leaf skeletons can be used to fabricate ultra‐smooth, reflow‐ and thin‐film‐compatible decomposable substrates, while making the same lignocellulose networks conducting results in flexible transparent electrodes.
Rakesh Rajendran Nair +3 more
wiley +1 more source
Preparation and Property of SnXCuNiBi Solder Alloy
, 2010 Lead-free solder is meeting the requirement of environmental protection, but the property performance of existing lead-free solder is hardly comparable to those of lead solder.
Yu Long Chen +4 more
core +1 more source
Advanced Materials, EarlyView.Mechanically origami‐coded 3D kirigami photovoltaics convert a single extension–release cycle into deterministic self‐folding, reconfiguring planar solar cells into programmable 3D modules. Distinct coding strategies enable either ultrahigh stretchability (500% system strain) or ultrahigh initial effective areal coverage (225%).
Seok Joon Hwang +15 more
wiley +1 more source
Hanjie xuebaoWith the rapid development of three-dimensional integrated packaging technology, higher requirements have been put forward for the performance and reliability of low-temperature lead-free solders.
Yan GAO +6 more
doaj +1 more source
Journal of Materials Research and TechnologyWith the ongoing advancements and innovations of electronic device, the demand for low-melting-point solder is rising, especially for flexible printed electronics.
Yini Chen +7 more
doaj +1 more source
Lead Halide Perovskite Photoelectrocatalysis
Advanced Materials, EarlyView.Lead halide perovskite semiconductors have emerged as highly promising materials for solar fuel and chemical synthesis. This perspective discusses advances made in the rational photoelectrode design to improve solar‐to‐chemical conversion, product scope, and scalability.
Virgil Andrei
wiley +1 more source